Chip-type LED package and light emitting apparatus having the same

• US 7,999,276 B2
• Filed: 05/07/2007
• Issued: 08/16/2011
• Est. Priority Date: 05/08/2006
• Status: Active Grant

• Current Assignee: Seoul Semiconductor Co., Ltd.
• Original Assignee: Seoul Semiconductor Co., Ltd.
• Inventors: Yoon, Yeo Jin
• Primary Examiner(s): Soward; Ida M
• Application Number:
  US12/298,238
• Publication Number:
  US 20090200567A1
• Time in Patent Office: 1,562 Days
• Field of Search: 257/100, 257/433, 257/789, 257/795, 257/E23.126, 257/98, 257/E33.059, 257/E33.59
• US Class Current: 257/98
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 24/73 Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 33/507 the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
• CPC Class Codes: H01L 33/56 Materials, e.g. epoxy or silicone resin

Abstract

Disclosed are a chip-type LED package and a light emitting apparatus having the same. The chip-type LED package includes a thermally conductive substrate with lead electrodes formed thereon. An LED chip is mounted on the thermally conductive substrate, and a lower molding portion covers the LED chip. In addition, an upper molding portion having hardness higher than that of the lower molding portion covers the lower molding portion. The upper molding portion is formed by performing transfer molding using resin powder. Accordingly, since the lower molding portion can be formed of a resin having hardness smaller than that of the upper molding portion, it is possible to provide a chip-type LED package in which device failure due to thermal deformation of the molding portion can be prevented.

Claims

1. A chip-type light emitting diode (LED) package, comprising:

a thermally conductive substrate with lead electrodes formed thereon;

an LED chip mounted on the thermally conductive substrate;

a lower molding portion covering the LED chip; and

an upper molding portion covering the lower molding portion, the upper molding portion having hardness higher than that of the lower molding portion and contains a phosphor uniformly dispersed therein,

wherein the lead electrodes comprise a first electrode and a second electrode formed on a top surface of the thermally conductive substrate,

wherein the upper molding portion contacts portions of the lead electrodes formed on the top surface of the thermally conductive substrate, and

wherein the upper molding portion is wider where it contacts the lead electrodes than at its upper surface.

2. The chip-type LED package as claimed in claim 1, wherein the thermally conductive substrate is a metal core printed circuit board (MCPCB) or a ceramic substrate.

3. The chip-type LED package as claimed in claim 1, wherein the lower molding portion does not contain a phosphor.

4. The light emitting apparatus as claimed in claim 1, wherein the lower molding portion contacts portions of the lead electrodes formed on the top surface of the thermally conductive substrate.

5. The chip-type LED package as claimed in claim 1, wherein the entire upper surface of the upper molding portion is exposed from a point where it contacts the first lead electrode to the point where it contacts the second lead electrode.

6. The chip-type LED package as claimed in claim 1, further comprising an intermediate molding portion interposed between the lower and upper molding portions and having the same shape as the upper molding portion.

7. The chip-type LED package as claimed in claim 6, wherein the intermediate molding portion does not contain a phosphor.

8. The light emitting apparatus as claimed in claim 1,

wherein the LED chip is mounted on the top surface of the thermally conductive substrate, and

wherein the lower molding portion and the upper molding portion both directly contact portions of the first electrode and the second electrode formed on the top surface of the thermally conductive substrate.

9. The light emitting apparatus as claimed in claim 8, wherein the upper molding portion comprises a substantially uniform thickness.

10. A light emitting apparatus, comprising:

a heat-sink slug with a thermally conductive substrate mounted thereon;

the thermally conductive substrate with lead electrodes formed thereon;

an LED chip mounted on the thermally conductive substrate;

a lower molding portion covering the LED chip; and

an upper molding portion covering the lower molding portion, the upper molding portion having a hardness higher than that of the lower molding portion and containing a phosphor uniformly dispersed therein,

wherein the lead electrodes comprise a first electrode and a second electrode formed on a top surface of the thermally conductive substrate,

wherein the upper molding portion contacts portions of the lead electrodes formed on the top surface of the thermally conductive substrate, and

wherein the upper molding portion is wider where it contacts the lead electrodes than at its upper surface.

11. The light emitting apparatus as claimed in claim 10, wherein the heat-sink slug has a recess, and the thermally conductive substrate is mounted in the recess.

12. The light emitting apparatus as claimed in claim 10, wherein the thermally conductive substrate is a metal core printed circuit board (MCPCB) or a ceramic substrate.

13. The light emitting apparatus as claimed in claim 10, wherein the lower molding portion does not contain the phosphor.

14. The light emitting apparatus as claimed in claim 10, wherein the lower molding portion contacts portions of the lead electrodes formed on the top surface of the thermally conductive substrate.

15. The light emitting apparatus of claim 10, wherein the entire upper surface of the upper molding portion is exposed from a point where it contacts the first lead electrode to the point where it contacts the second lead electrode.

16. The light emitting apparatus as claimed in claim 10, further comprising an intermediate molding portion interposed between the lower and upper molding portions and having the same shape as the upper molding portion.

17. The light emitting apparatus as claimed in claim 16, wherein the lower molding portion and the intermediate molding portion do not contain the phosphor.

18. The light emitting apparatus as claimed in claim 10,

wherein the LED chip is mounted on the top surface of the thermally conductive substrate, and

wherein the lower molding portion and the upper molding portion both directly contact portions of the first electrode and the second electrode formed on the top surface of the thermally conductive substrate.

19. The light emitting apparatus as claimed in claim 18, wherein the upper molding portion comprises a substantially uniform thickness.