Device for measuring fluid properties in caustic environments

• US 8,002,315 B2
• Filed: 12/23/2009
• Issued: 08/23/2011
• Est. Priority Date: 12/23/2009
• Status: Active Grant

• Current Assignee: Amphenol Thermometrics, Inc. (Amphenol Corporation), Cooper-Standard Automotive Incorporated (Cooper-Standard Holdings Incorporated)
• Original Assignee: General Electric Company
• Inventors: Engle, Brian Allen, Szabo, George, Kim, Woojin
• Primary Examiner(s): BOCHNA, DAVID
• Application Number:
  US12/645,972
• Publication Number:
  US 20110148096A1
• Time in Patent Office: 608 Days
• Field of Search: 285/93, 285/305, 137/557, 137/558, 439/180, 439/178, 439/179, 439/208, 439/210
• US Class Current: 285/305
• CPC Class Codes: G01K 1/14 Supports; Fastening devices; Arrangements for mounting thermometers in particular locations
• CPC Class Codes: G01K 13/02 for measuring temperature of moving fluids or granular materials capable of flow
• CPC Class Codes: G01L 19/0023 for flowthrough systems having a flexible pressure transmitting element
• CPC Class Codes: G01L 19/0038 being part of the housing other details about the housing G01L19/14
• CPC Class Codes: Y10T 137/8326 Fluid pressure responsive indicator, recorder or alarm

Abstract

There is provided embodiments of a fluid fitting, and system incorporating the fluid fitting therein, which is compatible with harsh, caustic environments such as those environments found in the automotive industry. In one embodiment, the fluid fitting can comprise a conductive element with a fluid pathway for transporting a fluid, e.g., fuel. The fluid fitting can also comprise a non-conductive element that is coupled to the conductive element in a manner discharging electrons from the conductive body. The non-conductive element can comprise a cavity with an opening exposing a sensing device with a sensing element disposed on a sensing element housing. The sensing element housing can be sealed to the conductive element, but expose the sensing element to the fluid in the fluid pathway.

Claims

1. A device for connecting a plurality of tubes comprising:

a non-conductive housing comprising a receptacle end for receiving a plug device;

a ground path for conducting charge to the receptacle end;

a conductive housing coupled to the ground path, the conductive housing comprising a first fluid pathway for receiving a fluid, and a mating portion secured to the non-conductive housing, the mating portion having an aperture exposing the first fluid pathway to the non-conductive housing;

a sensing element housing disposed in the aperture, the sensing element housing comprising a first open end proximate the non-conductive housing, a second open end proximate the first fluid pathway, and a second fluid pathway extending from the first open end and the second open end, the second fluid pathway for receiving the fluid from the first fluid pathway; and

a sensing element exposed to the fluid in the second fluid pathway, the sensing element for collecting data about a property of the fluid.

2. A device according to claim 1, further comprising a seal in communication with the sensing element housing and the conductive housing, wherein the seal is operatively configured to maintain a pressure of the fluid in the first fluid pathway.

3. A device according to claim 2, wherein the seal comprises an annular ring in surrounding relation to the sensing element housing, and wherein the annular ring comprises an outer surface disposed in sealing communication with the aperture of the conductive housing.

4. A device according to claim 1, wherein the ground path comprises a conductive terminal extending through the non-conductive housing.

5. A device according to claim 1, wherein the sensing element comprises a wire with an end responsive to a property of the fluid.

6. A device according to claim 1, further comprising at least one processor element that is disposed in a cavity of the non-conductive housing, wherein the processor element is coupled to the sensing element so as to receive data collected by the sensing element.

7. A device according to claim 6, wherein the sensing element comprises a piezo-resistive semiconductor die coupled to the processor element, and wherein the piezo-resistive semiconductor die is disposed on a surface of the sensing element housing proximate the first open end.

8. A device according to claim 7, wherein the piezo-resistive semiconductor die comprises a pressure sensor.

9. A device according to claim 1, further comprising a quick-connection device disposed on an end of the conductive housing.

10. A device according to claim 1, wherein a weldment secures the mating portion of the conductive housing to the non-conductive housing.

11. A fluid fitting comprising:

a body comprising a non-conductive housing, and a conductive housing coupled to the non-conductive housing, the conductive housing having a first fluid pathway for receiving a fluid;

a conductive terminal extending through the non-conductive housing, the conductive terminal comprising a terminal body with an end in electrical contact with the conductive housing;

a sensing device responsive to a property of the fluid, the sensing device comprising a sensing element housing extending into the conductive housing, the sensing element housing comprising a first open end proximate the non-conductive housing, a second open end proximate the first fluid pathway, and a second fluid pathway extending between the first open end and the second open end, the second fluid pathway receiving the fluid from the first fluid pathway; and

a seal in surrounding relation to the sensing element housing, the seal comprising at least one surface in contact with the conductive housing.

12. A fluid fitting according to claim 11, further comprising a quick-connection device disposed on the conductive housing.

13. A fluid fitting according to claim 11, wherein the sensing device comprises a plurality of wires extending from a cavity in the non-conductive housing into the second fluid pathway.

14. A fluid fitting according to claim 11, wherein the sensing device comprises piezo-resistive semiconductor die disposed on a surface of the sensing element housing, and wherein the piezo-resistive semiconductor die is responsive to pressure of the fluid in the first fluid pathway.

15. A fluid fitting according to claim 14, further comprising a processing device coupled to the pressure sensor, wherein the processing device comprises a processor disposed in a cavity of the non-conductive housing.

16. A fluid fitting for monitoring properties of a fluid, said fluid fitting comprising:

a non-conductive housing for receiving a plug device;

a conductive housing secured to the non-conductive housing, the conductive housing having a first fluid pathway for receiving the fluid, and a mating portion coupled to the non-conductive housing with a weldment, the mating portion comprising an aperture exposing the first fluid pathway;

a sensing element housing extending through the aperture, the sensing element housing comprising a first open end proximate the non-conductive housing, a second open end proximate the first fluid pathway, and a second fluid pathway extending between the first open end and the second open end, the second fluid pathway receiving fluid from the first fluid pathway;

a seal in surrounding relation to the sensing element housing, the seal having a surface in contact with the aperture; and

a sensing element exposed to the second fluid pathway, the sensing element for sensing properties of the fluid in the first fluid pathway,

wherein the non-conductive housing comprises a conductive terminal extending through the non-conductive housing in a manner discharging electrons from the conductive housing to the plug device.

17. A fluid fitting according to claim 16, wherein the properties comprise one or more of temperature, and pressure.

18. A fluid fitting according to claim 17, wherein the sensing element comprises a piezo-resistive semiconductor die that is responsive to the properties of the fluid in the first fluid pathway.

19. A fluid fitting according to claim 16, wherein the seal comprises a material compatible with fluid temperatures of at least about 150°

C.

20. A fluid fitting according to claim 16, wherein the conductive housing and the non-conductive housing comprise polymers.