LED array module

• US 8,002,443 B2
• Filed: 06/23/2006
• Issued: 08/23/2011
• Est. Priority Date: 07/01/2005
• Status: Expired due to Fees

• Current Assignee: Samsung Electronics Co. Ltd.
• Original Assignee: Samsung LED Co., Ltd. (Samsung Electronics Co. Ltd.)
• Inventors: Shin, Su-ho, Shin, Kyu-ho, Choi, Seung-tae, Kwon, Ki-hwan, Kweon, Soon-cheol, Moon, Chang-youl
• Primary Examiner(s): Shallenberger; Julie A
• Application Number:
  US11/473,188
• Publication Number:
  US 20070001582A1
• Time in Patent Office: 1,887 Days
• Field of Search: 362/294, 362/373, 362/800, 257/706, 257712-722, 257/13, 257/59, 257/72, 257/79, 257/81, 257/99, 257 88- 93, 257/918
• US Class Current: 362/294
• CPC Class Codes: F21K 9/00 Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
• CPC Class Codes: F21V 29/51 using condensation or evaporation of a fluid, e.g. heat pipes
• CPC Class Codes: F21V 29/52 electrically powered, e.g. refrigeration systems
• CPC Class Codes: F21V 29/67 characterised by the arrangement of fans
• CPC Class Codes: F21V 29/677 the fans being used for discharging
• CPC Class Codes: F21Y 2105/10 comprising a two-dimensional array of point-like light-generating elements
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 33/648 the elements comprising fluids, e.g. heat-pipes
• CPC Class Codes: H05K 1/0203 Cooling of mounted components H05K1/0272 takes precedence
• CPC Class Codes: H05K 1/0272 Adaptations for fluid transport, e.g. channels, holes
• CPC Class Codes: H05K 2201/10106 Light emitting diode [LED]

Abstract

A light emitting diode (LED) array module includes a plurality of LEDs; and a substrate which mounts the LEDs and has a built-in cooling device for cooling heat generated when the LED is driven. The cooling device includes a heat radiation space formed on the substrate and a minute passage member which is wick- or mesh-structured to form a plurality of minute passages that operate by a heat pipe principle in the heat radiation space. The cooling device operating by the heat pipe principle is integrally formed on the substrate mounted with the LEDs, so heat radiation performance of the LEDs is enhanced, such that the LEDs can operate stably for a long time.

Claims

1. A light emitting diode (LED) array module comprising:

a plurality of LEDs;

a substrate having a first surface and a second surface opposite the first surface, the plurality of LEDs disposed on the first surface;

a cover disposed on the second surface, wherein the substrate comprises;

a first recess formed in the second surface; and

a cooling passage member having a structure through which a cooling fluid can pass, the cooling passage member formed to contact a lower surface and a side surface of the first recess, and the cooling passage member bent to form a second recess, and

wherein the cover disposed on the second surface encloses the second recess to generate a cavity-shaped heat radiation space between the cooling passage member and the cover, and

the cooling fluid is unable to pass through the cavity-shaped heat radiation space.

2. The LED array module of claim 1, wherein the cooling passage uses a heat pipe principle.

3. The LED array module of claim 1, wherein the cooling passage uses a fluid circulation structure.

4. A light emitting diode (LED) array module comprising:

a plurality of LEDs;

a substrate having a first surface and a second surface opposite the first surface, the plurality of LEDs disposed on the first surface;

a cover disposed on the second surface,

wherein the substrate comprises;

a plurality of first recesses formed in the second surface; and

a plurality of cooling passage members respectively having a structure through which a cooling fluid can pass, the plurality of cooling passage members respectively formed to contact lower surfaces and side surfaces of the plurality of first recesses, and the plurality of cooling passage members respectively bent to form a plurality of second recess, and

wherein the cover disposed on the second surface encloses the plurality of second recesses to respectively generate a plurality of cavity-shaped heat radiation spaces between the plurality of cooling passage members and the cover, and

the cooling fluid is unable to pass through the plurality of cavity-shaped heat radiation spaces.

5. The LED array module of claim 4, wherein the plurality of cooling passage members are one of wick-and mesh-structured.

6. The LED array module of claim 4, further comprising:

an insulating layer disposed on the first surface;

a conductive pattern disposed on the insulating layer; and

a plurality of lenses respectively covering the plurality of LEDs, the conductive pattern electrically connected to the plurality of LEDs.