Thermal structure for sample processing systems

• US 8,003,051 B2
• Filed: 06/25/2009
• Issued: 08/23/2011
• Est. Priority Date: 12/28/2001
• Status: Active Grant

• Current Assignee: DiaSorin S.p.A.
• Original Assignee: 3M Innovative Properties Company (3M Company)
• Inventors: Aysta, James E., Bedingham, William, Robole, Barry W.
• Primary Examiner(s): Soderquist; Arlen
• Application Number:
  US12/491,959
• Publication Number:
  US 20090263280A1
• Time in Patent Office: 789 Days
• Field of Search: 219/388, 219428-429, 219/432, 219/435, 422 63- 64, 422/67, 422/72, 422/102, 422/104, 436/45
• US Class Current: 422/64
• CPC Class Codes: B01L 2300/0803 Disc shape
• CPC Class Codes: B01L 2300/1861 using radiation
• CPC Class Codes: B01L 3/50851 specially adapted for heating or cooling samples laboratory heating apparatus B01L7/00; incubators C12M
• CPC Class Codes: B01L 7/52 with provision for submitting samples to a predetermined sequence of different temperatures, e.g. for treating nucleic acid samples amplification or hybridisation processes per se C12Q1/68; controlling sequential reactions for synthesis B01J19/0046
• CPC Class Codes: B01L 7/54 using spatial temperature gradients
• CPC Class Codes: B01L 9/523 for multisample carriers, e.g. used for microtitration plates
• CPC Class Codes: G01N 2035/00326 Analysers with modular structure
• CPC Class Codes: G01N 35/025 having a carousel or turntable for reaction cells or cuvettes
• CPC Class Codes: Y10T 436/111666 Utilizing a centrifuge or compartmented rotor

Abstract

Sample processing systems for processing sample materials located in sample processing devices that are separate from the system are disclosed. The sample processing systems include a rotating base plate with raised and/or non-planar thermal structures on which the sample processing devices are located during operation of the systems. The systems may also include structure to urge the sample processing devices against the base plate and thermal structures.

Claims

1. A sample processing system comprising:

a base plate adapted to receive a sample processing device proximate a top surface of the base plate;

a thermal structure exposed on the top surface of the base plate, wherein an upper surface of the thermal structure contacts a sample processing device received proximate the top surface of the base plate, wherein the upper surface of the thermal structure includes a non-planar surface that is raised relative to the top surface of the base plate adjacent the thermal structure, and wherein the thermal structure includes at least one of a thermoelectric module and an electrical resistance heater; and

a drive system adapted to rotate the base plate about an axis of rotation.

2. The sample processing system of claim 1, further comprising an electromagnetic energy source adapted to direct electromagnetic energy at the thermal structure while the base plate is rotating about the axis of rotation.

3. The sample processing system of claim 2, wherein the thermal structure is opaque to the electromagnetic energy emitted by the electromagnetic energy source.

4. The sample processing system of claim 1, wherein the thermal structure is positioned to extend at least partially into a process chamber of the sample processing device when the sample processing device is received proximate a top surface of the base plate.

5. The sample processing system of claim 1, wherein the thermal structure is positioned to minimize any air gaps between a process chamber of the sample processing device and the thermal structure.

6. The sample processing system of claim 1, wherein the thermal structure is positioned to support the sample processing device, such that the sample processing device does not contact the top surface of the base plate that surrounds the thermal structure when the sample processing device is received proximate a top surface of the base plate.

7. The sample processing system of claim 1, wherein the thermal structure is one of a plurality of thermal structures attached to the base plate.

8. The sample processing system of claim 1, wherein the thermal structure consists of at least one of a thermoelectric module and an electrical resistance heater.

9. The sample processing system of claim 1, wherein the non-planar upper surface of the thermal structure comprises a raised protrusion extending upward from surrounding portions of the upper surface.