Method of making a semiconductor chip assembly with a post/base heat spreader and dual adhesives
First Claim
1. A method of making a semiconductor chip assembly, comprising:
- providing a post, a base, a conductive layer and a first adhesive, whereinthe post is adjacent to the base, extends above the base in an upward direction and extends through an opening in the first adhesive into an aperture in the conductive layer,the base extends below the post in a downward direction opposite the upward direction and extends laterally from the post in lateral directions orthogonal to the upward and downward directions,the first adhesive is mounted on and extends above the base and is sandwiched between the base and the conductive layer, andthe conductive layer is mounted on and extends above the first adhesive and is mechanically attached to the base by the first adhesive;
providing a conductive trace that includes a pad, a terminal and a selected portion of the conductive layer;
flowing a second adhesive into and downward in a gap that laterally surrounds and is adjacent to the post, thereby contacting the adhesives with one another;
solidifying the second adhesive;
thenmounting a semiconductor device on a heat spreader that includes the post and the base, wherein the semiconductor device overlaps the post and the second adhesive overlaps the conductive trace and does not cover the post and the pad in the upward direction;
electrically connecting the semiconductor device to the pad, thereby electrically connecting the semiconductor device to the terminal; and
thermally connecting the semiconductor device to the post, thereby thermally connecting the semiconductor device to the base.
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Abstract
A method of making a semiconductor chip assembly includes providing a post and a base, mounting a first adhesive on the base including inserting the post through an opening in the first adhesive, mounting a conductive layer on the base including aligning the post with an aperture in the conductive layer, providing a conductive trace that includes a pad, a terminal and a selected portion of the conductive layer, then flowing a second adhesive into and downward in a gap between the post and the conductive trace, solidifying the second adhesive, then mounting a semiconductor device on a heat spreader that includes the post and the base, electrically connecting the semiconductor device to the conductive trace and thermally connecting the semiconductor device to the heat spreader.
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Citations
35 Claims
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1. A method of making a semiconductor chip assembly, comprising:
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providing a post, a base, a conductive layer and a first adhesive, wherein the post is adjacent to the base, extends above the base in an upward direction and extends through an opening in the first adhesive into an aperture in the conductive layer, the base extends below the post in a downward direction opposite the upward direction and extends laterally from the post in lateral directions orthogonal to the upward and downward directions, the first adhesive is mounted on and extends above the base and is sandwiched between the base and the conductive layer, and the conductive layer is mounted on and extends above the first adhesive and is mechanically attached to the base by the first adhesive; providing a conductive trace that includes a pad, a terminal and a selected portion of the conductive layer; flowing a second adhesive into and downward in a gap that laterally surrounds and is adjacent to the post, thereby contacting the adhesives with one another; solidifying the second adhesive;
thenmounting a semiconductor device on a heat spreader that includes the post and the base, wherein the semiconductor device overlaps the post and the second adhesive overlaps the conductive trace and does not cover the post and the pad in the upward direction; electrically connecting the semiconductor device to the pad, thereby electrically connecting the semiconductor device to the terminal; and thermally connecting the semiconductor device to the post, thereby thermally connecting the semiconductor device to the base. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 20)
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11. A method of making a semiconductor chip assembly, comprising:
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providing a post and a base, wherein the post is adjacent to and integral with the base and extends above the base in an upward direction, and the base extends below the post in a downward direction opposite the upward direction and extends laterally from the post in lateral directions orthogonal to the upward and downward directions; providing a first adhesive, wherein an opening extends through the first adhesive; providing a conductive layer, wherein an aperture extends through the conductive layer; mounting the first adhesive on the base, including inserting the post into the opening, wherein the first adhesive extends above the base and the post extends through the opening; mounting the conductive layer on the base, including inserting the post into the aperture, wherein the conductive layer extends above and is mounted on the first adhesive and the first adhesive is sandwiched between the base and the conductive layer;
thenapplying pressure to the first adhesive, thereby deforming the first adhesive and attaching the base to the conductive layer; providing a conductive trace that includes a pad and a terminal, wherein the conductive trace includes selected portions of the conductive layer and an electrically conductive path is between the pad and the terminal; flowing a second adhesive into and downward in a gap that laterally surrounds and is adjacent to the post after applying pressure to the first adhesive, thereby contacting the adhesives with one another; solidifying the second adhesive;
thenmounting a semiconductor device on a heat spreader that includes the post and the base, wherein the semiconductor device overlaps the post and the second adhesive overlaps the conductive trace and does not cover the post and the pad in the upward direction; electrically connecting the semiconductor device to the pad, thereby electrically connecting the semiconductor device to the terminal; and thermally connecting the semiconductor device to the post, thereby thermally connecting the semiconductor device to the base. - View Dependent Claims (12, 13, 14, 15, 16, 17, 18, 19)
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21. A method of making a semiconductor chip assembly, comprising:
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providing a post, a base, a substrate and a first adhesive, wherein the substrate includes a conductive layer and a dielectric layer, the post is adjacent to the base, extends above the base in an upward direction, extends through an opening in the first adhesive and extends into an aperture in the substrate, the base extends below the post in a downward direction opposite the upward direction and extends laterally from the post in lateral directions orthogonal to the upward and downward directions, the first adhesive is mounted on and extends above the base, is sandwiched between the base and the substrate and is solidified, the substrate is mounted on and extends above the first adhesive, and the conductive layer extends above the dielectric layer, and a gap is located in the aperture between the post and the substrate and the gap laterally surrounds and is adjacent to the post;
thenproviding a conductive trace that includes a pad and a terminal, wherein the conductive trace includes a selected portion of the conductive layer and the pad is electrically connected to the terminal;
thenflowing a second adhesive into and downward in the gap, thereby contacting the adhesives with one another; solidifying the second adhesive;
thenmounting a semiconductor device on a heat spreader that includes the post and the base, wherein the semiconductor device overlaps the post and the second adhesive overlaps the conductive trace and does not cover the post and the pad in the upward direction; electrically connecting the semiconductor device to the pad, thereby electrically connecting the semiconductor device to the terminal; and thermally connecting the semiconductor device to the post, thereby thermally connecting the semiconductor device to the base. - View Dependent Claims (22, 23, 24, 25, 26, 27, 28, 29, 30)
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31. A method of making a semiconductor chip assembly, comprising:
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providing a post and a base, wherein the post is adjacent to and integral with the base and extends above the base in an upward direction, and the base extends below the post in a downward direction opposite the upward direction and extends laterally from the post in lateral directions orthogonal to the upward and downward directions; providing a first adhesive, wherein an opening extends through the first adhesive; providing a substrate that includes a conductive layer and a dielectric layer, wherein an aperture extends through the substrate; mounting the first adhesive on the base, including inserting the post through the opening, wherein the first adhesive extends above the base and the post extends through the opening; mounting the substrate on the base, including inserting the post into the aperture, wherein the substrate extends above the first adhesive, the conductive layer extends above the dielectric layer, the post extends through the opening into the aperture, the first adhesive is sandwiched between the base and the substrate and is solidified, and a gap is located in the aperture between the post and the substrate and the gap laterally surrounds and is adjacent to the post;
thenmoving the base and the substrate towards one another, thereby moving the post upward in the aperture and applying pressure to the first adhesive between the base and the substrate, wherein the pressure forces the first adhesive to deform and attach the base to the substrate;
thenproviding a conductive trace that includes a pad and a terminal, wherein the pad includes selected portions of the conductive layer and an electrically conductive path is between the pad and the terminal;
thenflowing the second adhesive into and downward in the gap, thereby contacting the adhesives with one another;
thenapplying heat to solidify the second adhesive;
thenmounting a semiconductor device on a heat spreader that includes the post and the base, wherein the semiconductor device overlaps the post and the second adhesive overlaps the routing line and does not cover the post and the pad in the upward direction; electrically connecting the semiconductor device to the pad, thereby electrically connecting the semiconductor device to the terminal; and thermally connecting the semiconductor device to the post, thereby thermally connecting the semiconductor device to the base. - View Dependent Claims (32, 33, 34, 35)
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Specification