Methods of manufacturing a semiconductor device using a layer suspended across a trench
First Claim
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1. A method of manufacturing a semiconductor device, comprising:
- forming first patterns separated from each other by a first width and second patterns separated from each other by a second width wider than the first width, on a substrate;
etching the substrate using the first patterns and the second patterns as an etching mask to form a first trench having a first depth and a preliminary second trench having a second depth;
forming a sacrificial layer to cover the first patterns and fill up a space between the first patterns while simultaneously filling up a space between the second patterns and exposing at least a floor of the preliminary second trench; and
etching the substrate using the sacrificial layer as an etching mask to form a second trench having a third depth deeper than the second depth,wherein the sacrificial layer is formed by a polymer attachment process using a gas for forming the polymer; and
wherein the polymer attachment process is performed at a temperature of about 500°
C. to about 800°
C.
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Abstract
In methods of forming a trench, first patterns separated from each other by a first width and second patterns separated from each other by a second width are formed on a substrate. The second width is wider than the first width. The substrate is etched using the first patterns and the second patterns to form a first trench having a first depth and a preliminary second trench having a second depth. A sacrificial layer is formed to fill up a space between the first patterns. The substrate is etched using the sacrificial layer to form a second trench having a third depth deeper than the second depth.
5 Citations
13 Claims
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1. A method of manufacturing a semiconductor device, comprising:
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forming first patterns separated from each other by a first width and second patterns separated from each other by a second width wider than the first width, on a substrate; etching the substrate using the first patterns and the second patterns as an etching mask to form a first trench having a first depth and a preliminary second trench having a second depth; forming a sacrificial layer to cover the first patterns and fill up a space between the first patterns while simultaneously filling up a space between the second patterns and exposing at least a floor of the preliminary second trench; and etching the substrate using the sacrificial layer as an etching mask to form a second trench having a third depth deeper than the second depth, wherein the sacrificial layer is formed by a polymer attachment process using a gas for forming the polymer; and wherein the polymer attachment process is performed at a temperature of about 500°
C. to about 800°
C. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13)
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Specification