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Semiconductor device, method of manufacturing the same, and signal transmitting/receiving method using the semiconductor device

  • US 8,004,054 B2
  • Filed: 11/26/2008
  • Issued: 08/23/2011
  • Est. Priority Date: 12/04/2007
  • Status: Expired due to Fees
First Claim
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1. A semiconductor device, comprising:

  • a semiconductor substrate including a semiconductor chip formation region;

    a chip internal circuit provided within the semiconductor chip formation region of the semiconductor substrate;

    a signal transmitting/receiving unit which is provided within the semiconductor chip formation region of the semiconductor substrate, transmits/receives a signal to/from an outside in a non-contact manner by one of electromagnetic induction and capacitive coupling, and transmits/receives a signal to/from the chip internal circuit through electrical connection to the chip internal circuit; and

    a power receiving inductor which has a diameter provided along an outer edge of the semiconductor chip formation region of the semiconductor substrate so as to surround the chip internal circuit and the signal transmitting/receiving unit, receives a power supply signal from the outside in the non-contact manner, and is electrically connected to the chip internal circuit,wherein said signal transmitting/receiving unit transmits/receives said signal to/from said outside in said non-contact manner without using said power receiving inductor.

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