Semiconductor device, method of manufacturing the same, and signal transmitting/receiving method using the semiconductor device
First Claim
1. A semiconductor device, comprising:
- a semiconductor substrate including a semiconductor chip formation region;
a chip internal circuit provided within the semiconductor chip formation region of the semiconductor substrate;
a signal transmitting/receiving unit which is provided within the semiconductor chip formation region of the semiconductor substrate, transmits/receives a signal to/from an outside in a non-contact manner by one of electromagnetic induction and capacitive coupling, and transmits/receives a signal to/from the chip internal circuit through electrical connection to the chip internal circuit; and
a power receiving inductor which has a diameter provided along an outer edge of the semiconductor chip formation region of the semiconductor substrate so as to surround the chip internal circuit and the signal transmitting/receiving unit, receives a power supply signal from the outside in the non-contact manner, and is electrically connected to the chip internal circuit,wherein said signal transmitting/receiving unit transmits/receives said signal to/from said outside in said non-contact manner without using said power receiving inductor.
3 Assignments
0 Petitions
Accused Products
Abstract
A semiconductor device (100) including: a semiconductor substrate including a semiconductor chip formation region (102); a chip internal circuit (124); a signal transmitting/receiving inductor (114) which transmits/receives a signal to/from an outside in a non-contact manner by electromagnetic induction, and transmits/receives a signal to/from the chip internal circuit (124) through electrical connection to the chip internal circuit (124); and a power receiving inductor (112) which has a diameter provided along an outer edge of the semiconductor chip formation region (102) so as to surround the chip internal circuit (124) and the signal transmitting/receiving inductor (114), receives a power supply signal from the outside in the non-contact manner, and is electrically connected to the chip internal circuit (124). Accordingly, power supply can be sufficiently made in the non-contact manner while limiting an increase in chip size when various signals are transmitted/received in the non-contact manner.
9 Citations
16 Claims
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1. A semiconductor device, comprising:
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a semiconductor substrate including a semiconductor chip formation region; a chip internal circuit provided within the semiconductor chip formation region of the semiconductor substrate; a signal transmitting/receiving unit which is provided within the semiconductor chip formation region of the semiconductor substrate, transmits/receives a signal to/from an outside in a non-contact manner by one of electromagnetic induction and capacitive coupling, and transmits/receives a signal to/from the chip internal circuit through electrical connection to the chip internal circuit; and a power receiving inductor which has a diameter provided along an outer edge of the semiconductor chip formation region of the semiconductor substrate so as to surround the chip internal circuit and the signal transmitting/receiving unit, receives a power supply signal from the outside in the non-contact manner, and is electrically connected to the chip internal circuit, wherein said signal transmitting/receiving unit transmits/receives said signal to/from said outside in said non-contact manner without using said power receiving inductor. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16)
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Specification