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Method of assessing bond integrity in bonded structures

  • US 8,004,689 B2
  • Filed: 05/09/2007
  • Issued: 08/23/2011
  • Est. Priority Date: 05/10/2006
  • Status: Active Grant
First Claim
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1. A method for assessing bond integrity at a region of a surface of a bonded material, the method comprising:

  • a. producing transient heating in the region so that if the region overlies a disbond in the bonded material, membrane vibration having a vibration period is induced over the disbond; and

    b. detecting any surface displacement at or adjacent the region with a large etendue interferometer having a response time sufficiently short to adapt to ambient vibrations and speckle changes, but substantially longer than the vibration period;

    whereby the surface displacement can be used to determine whether a disbond is present.

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