Medical electrical lead

• US 8,005,549 B2
• Filed: 09/15/2008
• Issued: 08/23/2011
• Est. Priority Date: 09/13/2007
• Status: Active Grant

• Current Assignee: Medtronic Incorporated (Medtronic Plc)
• Original Assignee: Medtronic Incorporated (Medtronic Plc)
• Inventors: Garlough, Greg, Boser, Gregory A., Seifert, Kevin R.
• Primary Examiner(s): Layno; Carl H
• Assistant Examiner(s): ANTHONY, JESSICA LYNN
• Application Number:
  US12/211,065
• Publication Number:
  US 20090076577A1
• Time in Patent Office: 1,072 Days
• Field of Search: 607115-116
• US Class Current: 607/116
• CPC Class Codes: A61N 1/05 for implantation or insertion into the body, e.g. heart electrode A61N1/06 takes precedence
• CPC Class Codes: A61N 1/0563 specially adapted for defibrillation or cardioversion
• CPC Class Codes: Y10T 29/49123 Co-axial cable
• CPC Class Codes: Y10T 29/49204 Contact or terminal manufacturing

Abstract

A method of manufacture of a medical device lead. The lead includes one or more jacketed conductive elements. The jacket comprises one or more covers. The jacketed conductive element is formed by introducing a polymeric material over a conductive element, coupling the conductive element around a mandrel to form a coil shape, annealing the polymeric material over the at least one conductive element and setting a coiled shape in the at least one conductive element; and then removing the at least one conductive element from the mandrel.

The coiled conductive element as manufactured thus substantially retains its original coiled shape.

Claims

1. A method of insulating a conductive element in a medical electrical lead comprising the ordered steps of:

introducing a polymeric material over at least one conductive element;

wrapping helically the at least one conductive element around a mandrel; and

then

while the at least one conductive element is wrapped around the mandrel, coupling the polymeric material over the at least one conductive element and thereby setting a coiled shape in the conductive element; and

wherein coupling the polymeric material over the at least one conductive element includes shape setting the polymeric material and then thermally bonding a lower melting point second polymeric material previously introduced over a first polymeric material.

2. The method of claim 1, wherein coupling the polymeric material over the at least one conductive element includes adhesively bonding the polymeric material to an underlying structure.

3. The method of claim 1, wherein coupling the polymeric material over the at least one conductive element includes thermally bonding selectively at points along a length of an assembled structure.

4. The method of claim 1, wherein coupling the polymeric material over the at least one conductive element includes adhesively bonding selectively at points along a length of an assembled structure.

5. The method of claim 1, wherein the second polymeric material is of a lower strength and lower elongation than the first polymeric material.

6. The method of claim 1, wherein the first and the second polymeric materials are coupled with a weakly bonded interface.

7. The method of claim 1, wherein the first polymeric material is treated to promote a weakly bonded interface when coupled to the second polymeric material.

8. The method of claim 7, wherein treated to promote a weakly bonded interface includes one of plasma and a chemical treatment.

9. The method of claim 1, wherein coupling includes mechanically constraining the at least one conductive element with one of an outer tubular material and a component.