Copper wiring module control

• US 8,005,634 B2
• Filed: 01/25/2007
• Issued: 08/23/2011
• Est. Priority Date: 03/22/2002
• Status: Expired due to Fees

• Current Assignee: Applied Materials Incorporated
• Original Assignee: Applied Materials Incorporated
• Inventors: Shanmugasundram, Arulkumar, Parikh, Suketu A.
• Primary Examiner(s): Garber; Charles D
• Assistant Examiner(s): STEVENSON, ANDRE C
• Application Number:
  US11/627,353
• Publication Number:
  US 20070122921A1
• Time in Patent Office: 1,671 Days
• Field of Search: None
• US Class Current: 702/81
• CPC Class Codes: B24B 37/042 operating processes therefor
• CPC Class Codes: B24B 49/00 Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation B24B33/06, B24B37/005 take precedence; if applicable to other machine tools, B23Q15/00 - B23Q17/00 take precedence
• CPC Class Codes: C23F 3/00 Brightening metals by chemical means
• CPC Class Codes: H01L 21/2885 using an external electrical current, i.e. electro-deposition
• CPC Class Codes: H01L 21/67253 Process monitoring, e.g. flow or thickness monitoring
• CPC Class Codes: H01L 21/67276 Production flow monitoring, e.g. for increasing throughput program-control systems per se G05B19/00, e.g. total factory control G05B19/418
• CPC Class Codes: H01L 22/20 Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

Techniques for controlling an output property during wafer processing include forwarding feedforward and feedback information between functional units in a wafer manufacturing facility. At least some embodiments of the invention envision implementing such techniques in a copper wiring module to optimize a sheet resistance or an interconnect line resistance. Initially, a first wafer property is measured during or after processing by a plating process. Subsequently, the wafer is forwarded to a polishing process. A second wafer property is then measured during or after processing by the second process. At least one of these first and second wafer properties are used to optimize the second process. Specifically, one or more target parameters of a second process recipe are adjusted in a manner that obtains a desired final output property on the wafer by using these first and second wafer properties.

Claims

1. A computer-implemented method for processing wafers, the method comprising:

subjecting a first wafer to a first deposition process and a subsequent polishing process, the first deposition process being controlled in accordance with a first deposition model that is operable to calculate parameters for the first deposition process, the polishing process being controlled in accordance with a polishing model that is operable to calculate parameters for the polishing process;

measuring a property of the first wafer while or after the first wafer is subject to the polishing process, the measuring producing a measured value for the property of the first wafer;

identifying a property of a subsequent wafer incoming to the first deposition process and calculating a pre-polish target value for the identified property, the identifying and calculating being based on the polishing model and the measured value of the property of the first wafer; and

using the first deposition model to determine whether it is possible to achieve, by using the first deposition process, the pre-polish target value for the identified property and, if it is determined that it is possible to achieve the pre-polish target value, using the first deposition model to calculate parameters for the first deposition process that are needed to achieve the pre-polish target value.

2. The method of claim 1, wherein:

the identifying and calculating is performed without consideration of the first model.

3. The method of claim 1, wherein:

the first deposition model is a plating model and subjecting the first wafer to a first deposition process includes subjecting the wafer to a plating process.

4. The method of claim 3, wherein:

a plating module, operable to use the plating model, controls the plating process and a polishing module, operable to use the polishing model, controls the polishing process, the method further comprising;

sending a request from the polishing module to the plating module, the request specifying the target value and the identified property.

5. The method of claim 3, wherein:

a module, operable to use the plating model and the polishing model, controls the plating process and the polishing process.

6. The method of claim 1, wherein:

identifying a property of the subsequent wafer includes identifying one or more of dielectric deposition thickness, dielectric deposition uniformity, critical depth, critical width, trench depth, sheet resistance, interconnect line resistance, thickness profile, sheet resistance profile, reflectance, resistivity drop, and reflectivity.

8. The method of claim 1, wherein:

the first deposition model is an dielectric deposition model and subjecting the wafer to a first deposition process includes subjecting the wafer to a dielectric deposition process.

9. The method of claim 1, wherein the measured property is a first property, the method further comprising:

measuring a second property of the first wafer, the measuring being performed while the first wafer is being subject to the first deposition process or after the wafer has been subject to the first deposition process but before the wafer is subject to the polishing process; and

using the polishing model and the second property to change parameters for the polishing process.

10. The method of claim 1, wherein the first deposition process includes multiple portions, the method further comprising:

identifying one or more portions of the first deposition process that can be adjusted to attain the pre-polish target value of the identified property.

11. The method of claim 1, wherein identifying a property and calculating a target value includes:

identifying a property and calculating pre-polish target value so that an efficiency of the polishing process is improved.

12. The method of claim 11, wherein improving efficiency includes achieving a particular range of interconnect line resistance.

13. The method of claim 11, wherein improving efficiency includes:

achieving a particular range of sheet resistance in a wafer after the wafer is subject to the first deposition process and the polishing process.

14. The method of claim 11, wherein improving efficiency includes:

optimizing efficiency.

15. The method of claim 1, further comprising:

receiving, from an in-line metrology station, a measurement indicating the pre-polish target property; and

changing a recipe of the deposition process, the change being based on the measurement.

31. The method of claim 9, wherein:

using the polishing model and the second property to change parameters for the polishing process comprises changing parameters to obtain a desired output property on the wafer.

7. A computer-implemented method for processing wafers, the method comprising:

subjecting a first wafer to a first process and a subsequent polishing process, the first process being controlled in accordance with a first model that is operable to calculate parameters for the first process, the polishing process being controlled in accordance with a polishing model that is operable to calculate parameters for the polishing process;

measuring a property of the first wafer while or after the first wafer is subject to the polishing process, the measuring producing a measured value for the property of the first wafer;

identifying a property of a subsequent wafer incoming to the first process and calculating a pre-polish target value for the identified property, the identifying and calculating being based on the polishing model and the measured value of the property of the first wafer; and

using the first model to determine whether it is possible to achieve, by using the first process, the pre-polish target value for the identified property and, if it is determined that it is possible to achieve the pre-polish target value, using the first model to calculate parameters for the first process that are needed to achieve the pre-polish target value, wherein;

the first process is an electro-chemical plating process that includes a bevel cleaning process; and

calculating parameters for the first process includes calculating parameters for the bevel cleaning process.

16. A computer program product, tangibly stored on machine readable medium, comprising instructions operable to cause a processor to operate a semiconductor wafer manufacturing system to:

subject a first wafer to a first deposition process and a subsequent polishing process, the first deposition process being controlled in accordance with a first deposition model that is operable to calculate parameters for the first deposition process, the polishing process being controlled in accordance with a polishing model that is operable to calculate parameters for the polishing process;

measure a property of the first wafer while or after the first wafer is subject to the polishing process, the measuring producing a measured value for the property of the first wafer;

identify a property of a subsequent wafer incoming to the first deposition process and calculate a pre-polish target value for the identified property, the identifying and calculating being based on the polishing model and the measured value of the property of the first wafer; and

use the first deposition model to determine whether it is possible to achieve, by using the first deposition process, the pre-polish target value for the identified property and, if it is determined that it is possible to achieve the pre-polish target value, use the first deposition model to calculate parameters for the first deposition process that are needed to achieve the pre-polish target value.

17. The product of claim 16, wherein:

the identifying and calculating is performed without consideration of the first model.

18. The product of claim 16, wherein:

the first deposition model is a plating model and subjecting the first wafer to a first deposition process includes subjecting the wafer to a plating process.

19. The product of claim 18, wherein:

a plating module, operable to use the plating model, controls the plating process and a polishing module, operable to use the polishing model, controls the polishing process, the product further comprising instructions to;

send a request from the polishing module to the plating module, the request specifying the target value and the identified property.

20. The product of claim 18, wherein:

a module, operable to use the plating model and the polishing model, controls the plating process and the polishing process.

21. The product of claim 16, wherein:

identifying a property of the subsequent wafer includes identifying one or more of dielectric deposition thickness, dielectric deposition uniformity, critical depth, critical width, trench depth, sheet resistance, interconnect line resistance, thickness profile, sheet resistance profile, reflectance, resistivity drop, and reflectivity.

23. The product of claim 16, wherein:

the first deposition model is an dielectric deposition model and subjecting the wafer to a first deposition process includes subjecting the wafer to a dielectric deposition process.

24. The product of claim 16, wherein the measured property is a first property, the product further comprising instructions to:

measure a second property of the first wafer, the measuring being performed while the first wafer is being subject to the first deposition process or after the wafer has been subject to the first deposition process but before the wafer is subject to the polishing process; and

use the polishing model and the second property to change parameters for the polishing process.

25. The product of claim 16, wherein the first deposition process includes multiple portions, the product further comprising instructions to:

identify one or more portions of the first deposition process that can be adjusted to attain the pre-polish target value of the identified property.

26. The product of claim 16, wherein identifying a property and calculating a target value includes:

identifying a property and calculating pre-polish target value so that an efficiency of the polishing process is improved.

27. The product of claim 26, wherein improving efficiency includes achieving a particular range of interconnect line resistance.

28. The product of claim 26, wherein improving efficiency includes:

achieving a particular range of sheet resistance in a wafer after the wafer is subject to the first deposition process and the polishing process.

29. The product of claim 26, wherein improving efficiency includes:

optimizing efficiency.

30. The product of claim 16, further comprising instructions to:

receive, from an in-line metrology station, a measurement indicating the pre-polish target property; and

change a recipe of the deposition process, the change being based on the measurement.

32. The product of claim 24, wherein:

instructions to use of the polishing model and the second property to change parameters for the polishing process comprises instructions to change parameters to obtain a desired output property on the wafer.

22. A computer program product tangibly stored on machine readable medium, comprising instructions operable to cause a processor to operate a semiconductor wafer manufacturing system to:

subject a first wafer to a first process and a subsequent polishing process, the first process being controlled in accordance with a first model that is operable to calculate parameters for the first process, the polishing process being controlled in accordance with a polishing model that is operable to calculate parameters for the polishing process;

measure a property of the first wafer while or after the first wafer is subject to the polishing process, the measuring producing a measured value for the property of the first wafer;

identify a property of a subsequent wafer incoming to the first process and calculate a pre-polish target value for the identified property, the identifying and calculating being based on the polishing model and the measured value of the property of the first wafer; and

use the first model to determine whether it is possible to achieve, by using the first process, the pre-polish target value for the identified property and, if it is determined that it is possible to achieve the pre-polish target value, use the first model to calculate parameters for the first process that are needed to achieve the pre-polish target value, wherein;

the first process is an electro-chemical plating process that includes a bevel cleaning process; and

calculating parameters for the first process includes calculating parameters for the bevel cleaning process.