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Dynamic push for topological routing of semiconductor packages

  • US 8,006,216 B1
  • Filed: 06/06/2008
  • Issued: 08/23/2011
  • Est. Priority Date: 06/06/2008
  • Status: Active Grant
First Claim
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1. A computer-implemented method for routing topological interconnections for a package, the method comprising:

  • receiving, using one or more processors associated with one or more computer systems, information associated with a chip;

    determining an escape routing of a bump array for the chip, the escape routing indicative of a set of I/Os along a set of escape boundaries;

    determining a set of obstructions on a set of package layers;

    determining a scale of via staggering pitches on the set of package layers;

    for each build-up layer in the set of package layers, from a top layer to a bottom layer;

    performing a topologically planar routing of each I/O in the set of I/Os to a location substantially vertical to a center of a corresponding ball, wherein at least a first net is dynamically pushed in response to the topologically planar routing of a second net, andtransferring a stopping point associated with an I/O for a failed net to another build-up layer by stack vias;

    assigning vias for one or more successfully routed nets;

    analyzing a congestion associated with each build-up layer to generate a congestion map; and

    generating, with the one or more processors associated with the one or more computer systems, information indicative of a set of topological interconnections, the congestion map, and a set of fail-routed nets and storing the information in a storage device associated with the one or more computers systems.

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