Power mesh arrangement method utilized in an integrated circuit having multiple power domains
DC CAFCFirst Claim
1. A power routing arrangement method applied in an integrated circuit having multiple power domains, the arrangement method comprising:
- forming a first partial local power mesh according to the position of a first power domain of the integrated circuit by an automatic placement and routing (APR) tool;
forming a second partial local power mesh according to the position of a second power domain of the integrated circuit by the APR tool;
forming a global power mesh that is utilized to provide the power needed by the first and the second power domains by the APR tool;
coupling the first partial local power mesh to the global power mesh and the first power domain by the APR tool; and
coupling the second partial local power mesh to the global power mesh and the second power domain by the APR tool;
wherein the global power mesh includes a plurality of horizontal power supply wires placed on a first metal layer and a plurality of vertical power supply wires placed on a second metal layer; and
wherein the first metal layer and the second metal layer are different layers.
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Abstract
The invention discloses a power mesh arrangement method utilized in an integrated circuit having multiple power domains. The arrangement method includes: forming a first partial local power mesh according to a position of a first power domain; forming a second partial local power mesh according to a position of a second power domain; forming a global power mesh, utilized for providing powers needed by the first and the second power domains; coupling the first partial local power mesh to the global power mesh and the first power domain; and coupling the second partial local power mesh to the global power mesh and the second power domain.
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Citations
20 Claims
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1. A power routing arrangement method applied in an integrated circuit having multiple power domains, the arrangement method comprising:
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forming a first partial local power mesh according to the position of a first power domain of the integrated circuit by an automatic placement and routing (APR) tool; forming a second partial local power mesh according to the position of a second power domain of the integrated circuit by the APR tool; forming a global power mesh that is utilized to provide the power needed by the first and the second power domains by the APR tool; coupling the first partial local power mesh to the global power mesh and the first power domain by the APR tool; and coupling the second partial local power mesh to the global power mesh and the second power domain by the APR tool; wherein the global power mesh includes a plurality of horizontal power supply wires placed on a first metal layer and a plurality of vertical power supply wires placed on a second metal layer; and wherein the first metal layer and the second metal layer are different layers. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. A power routing structure applied in an integrated circuit having multiple power domains, comprising:
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a first partial local power mesh having its position corresponding to the position of a first power domain and coupling to the first power domain; a second partial local power mesh having its position corresponding to the position of a second power domain and coupling to the second power domain; and a global power mesh, coupling to the first local power mesh and the second local power mesh, to provide the power needed by the first power domain and the second domain separately; wherein the first partial local power mesh and the second partial local power mesh are positioned on the same metal layer while the global power mesh and the first local power mesh are positioned on different metal layers; wherein the global power mesh includes a plurality of horizontal power supply wires placed on a first metal layer and a plurality of vertical power supply wires placed on a second metal layer; and wherein the first metal layer and the second metal layer are different layers. - View Dependent Claims (13, 14, 15, 16, 17, 18)
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19. A power routing arrangement method applied in an integrated circuit having multiple power domains, the arrangement method comprising:
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providing a global power mesh, positioned above a first power domain and a second power domain, comprising at least one first power wire that provides the voltage needed by the first power domain, at least one second power wire that provides the voltage needed by the second power domain, and at least one ground wire that provides the ground potential needed by the first power domain and the second power domain by an automatic placement and routing (APR) tool; coupling the first power wire and the ground wire of the global power mesh to the first power domain by the APR tool; and coupling the second power wire and the ground wire of the global power mesh to the second power domain by the APR tool; wherein the global power mesh includes a plurality of horizontal power supply wires placed on a first metal layer and a plurality of vertical power supply wires placed on a second metal layer; and wherein the first metal layer and the second metal layer are different layers. - View Dependent Claims (20)
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Specification