Plasma processing apparatus and plasma processing method
First Claim
Patent Images
1. A plasma processing apparatus comprising:
- a process container configured to hold a vacuum therein and perform a plasma process on a target object accommodated therein, the process container including a container casing that is equipped with an upper plate disposed on an upper side thereof and defining a top opening, and a dielectric transmission plate supported by the upper plate and airtightly closing the top opening;
a worktable configured to place the target object thereon inside the process container;
a planar antenna disposed above the transmission plate and including a plurality of slots to supply microwaves from the slots through the transmission plate into the process container;
a gas feed member configured to supply a process gas, to be turned into plasma by the microwaves, into the process container;
an exhaust line configured to exhaust gas from inside the process container;
a dielectric wave-retardation body disposed above the planar antenna and configured to shorten a wavelength of the microwaves; and
a metal cover covering the planar antenna and the wave-retardation body,wherein the planar antenna is fixed at a periphery of the planar antenna to the metal cover by fixing members, which are fitted in a recess formed on the transmission plate at a periphery of the transmission plate, andthe transmission plate is set at a position where the transmission plate is separated from the target object placed on the worktable by a distance of from 20 mm to 100 mm.
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Abstract
A plasma processing apparatus includes: a process container configured to accommodate a target object and hold a vacuum therein for performing a plasma process; a worktable configured to place the target object thereon inside the process container; a planar antenna including a plurality of slots and configured to supply microwaves into the process container; a gas feed mechanism configured to supply a process gas into the process container; and a top plate disposed opposite the worktable, the top plate being set at a position separated from the target object placed on the worktable by a distance of 20 mm or more and 100 mm or less.
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Citations
9 Claims
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1. A plasma processing apparatus comprising:
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a process container configured to hold a vacuum therein and perform a plasma process on a target object accommodated therein, the process container including a container casing that is equipped with an upper plate disposed on an upper side thereof and defining a top opening, and a dielectric transmission plate supported by the upper plate and airtightly closing the top opening; a worktable configured to place the target object thereon inside the process container; a planar antenna disposed above the transmission plate and including a plurality of slots to supply microwaves from the slots through the transmission plate into the process container; a gas feed member configured to supply a process gas, to be turned into plasma by the microwaves, into the process container; an exhaust line configured to exhaust gas from inside the process container; a dielectric wave-retardation body disposed above the planar antenna and configured to shorten a wavelength of the microwaves; and a metal cover covering the planar antenna and the wave-retardation body, wherein the planar antenna is fixed at a periphery of the planar antenna to the metal cover by fixing members, which are fitted in a recess formed on the transmission plate at a periphery of the transmission plate, and the transmission plate is set at a position where the transmission plate is separated from the target object placed on the worktable by a distance of from 20 mm to 100 mm. - View Dependent Claims (2, 3, 4)
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5. A plasma processing apparatus comprising:
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a process container configured to hold a vacuum therein and perform a plasma process on a target object accommodated therein, the process container including a container casing that is equipped with an upper plate disposed on an upper side thereof and defining a top opening, and a dielectric transmission plate supported by the upper plate and airtightly closing the top opening through a first seal member; a worktable configured to place the target object thereon inside the process container; a planar antenna disposed above the transmission plate and including a plurality of slots to supply microwaves from the slots through the transmission plate into the process container; a gas feed member configured to supply a process gas, to be turned into plasma by the microwaves, into the process container; an exhaust line configured to exhaust gas from inside the process container; a dielectric wave-retardation body disposed above the planar antenna and configured to shorten a wavelength of the microwaves; a metal cover covering the planar antenna and the wave-retardation body; a first presser member that presses the transmission plate to the upper plate via a first fixing member, the first presser member being set in contact with the transmission plate at a periphery of the transmission plate with a second seal member interposed between the first presser member and the periphery of the transmission plate, and the first presser member being in contact with a top portion of the upper plate with a third seal member of a metal seal ring interposed between the first presser member and the top portion of the upper plate; and a second presser member that presses the metal cover to the first presser member via a second fixing member, the second presser member being set in contact with the metal cover at a periphery of the metal cover with a fourth seal member of a metal seal ring interposed between the second presser member and the periphery of the metal cover, and the second presser member being in contact with the first presser member with a fifth seal member of a metal seal ring interposed between the second presser member and the first presser member, wherein the transmission plate is set at a position where the transmission plate is separated from the target object placed on the worktable by a distance of from 20 mm to 100 mm. - View Dependent Claims (6, 7, 8, 9)
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Specification