Micro-chimney and thermosiphon die-level cooling

• US 8,006,747 B2
• Filed: 01/08/2009
• Issued: 08/30/2011
• Est. Priority Date: 01/11/2002
• Status: Active Grant

• Current Assignee: Intel Corporation
• Original Assignee: Intel Corporation
• Inventors: Chrysler, Gregory M., Maveety, James G.
• Primary Examiner(s): Ciric; Ljiljana (Lil) V
• Application Number:
  US12/319,505
• Publication Number:
  US 20090129022A1
• Time in Patent Office: 964 Days
• Field of Search: 165/48.1, 165/80.2, 165/80.3, 165/80.4, 165/80.5, 165/104.21, 165/104.26, 165/104.33, 165/185, 361/690, 361/699, 361/700, 361/702, 361/718, 361/719, 257/707, 257/712, 257/713, 257/717, 298/900.32
• US Class Current: 165/104.33
• CPC Class Codes: F28D 15/0233 the conduits having a particular shape, e.g. non-circular cross-section, annular F28D15/0241, F28D15/0266 take precedence
• CPC Class Codes: H01L 23/427 Cooling by change of state, e.g. use of heat pipes by liquefied gas H01L23/445
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: Y10S 165/905 Materials of manufacture
• CPC Class Codes: Y10T 29/49353 Heat pipe device making

Abstract

A semiconductor die is constructed and arranged to have at least one conduit portion therein. At least a portion of the conduit portion is proximate to the localized area. The conduit portion is at least partially filled with a heat-dissipating material. The conduit portion absorbs heat from the localized area and dissipates at least a portion of the heat away from the localized area.

Claims

1. A method for dissipating heat from a localized area, the method comprising:

providing a semiconductor die with at least one conduit directly within the semiconductor die, the conduit being proximate to the localized area within the semiconductor die, the conduit being at least partially filled with a heat-dissipating material;

absorbing, by the conduit, heat from the localized area; and

dissipating, by the conduit, at least a portion of the heat away from the localized area.

2. The method of claim 1, wherein heat-dissipating material comprises a fluid.

3. The method of claim 2, wherein the fluid is a dielectric.

4. The method of claim 2 wherein the fluid is capable of changing phase.

5. The method of claim 2, wherein the fluid is a liquid.

6. The method of claim 5, wherein the dissipating by the conduit includes evaporating by the liquid to form a vapor, releasing heat by the vapor, and condensing of the vapor.

7. The method of claim 6, wherein the condensation created by the condensing of the vapor travels down a side of the conduit.