Circuit boards interconnected by overlapping plated through holes portions

• US 8,007,286 B1
• Filed: 03/18/2009
• Issued: 08/30/2011
• Est. Priority Date: 03/18/2008
• Status: Active Grant

• Current Assignee: MetroSpec Technology LLC
• Original Assignee: MetroSpec Technology LLC
• Inventors: Crandell, Wm. Todd, Holec, Henry V.
• Primary Examiner(s): Prasad; Chandrika
• Application Number:
  US12/406,761
• Time in Patent Office: 895 Days
• Field of Search: 439/65, 439/66, 439/67, 439/591, 439/74
• US Class Current: 439/65
• CPC Class Codes: F21Y 2107/30 on the outer surface of cylindrical surfaces, e.g. rod-shaped supports having a circular or a polygonal cross section
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: H01R 12/00 Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures printed connections to, or between, printed circuits H05K1/11
• CPC Class Codes: H01R 12/523 by an interconnection through aligned holes in the boards or multilayer board
• CPC Class Codes: H01R 13/717 with built-in light source
• CPC Class Codes: H01R 4/02 Soldered or welded connections H01R4/625, H01R4/723, H01R12/59 take precedence
• CPC Class Codes: H05K 1/0266 Marks, test patterns or identification means
• CPC Class Codes: H05K 1/0269 for visual or optical inspection
• CPC Class Codes: H05K 1/0292 having a modifiable lay-out, i.e. adapted for engineering changes or repair H05K1/0293 takes precedence
• CPC Class Codes: H05K 1/0293 Individual printed conductors which are adapted for modification, e.g. fusable or breakable conductors, printed switches
• CPC Class Codes: H05K 1/0298 Multilayer circuits
• CPC Class Codes: H05K 1/11 Printed elements for providing electric connections to or between printed circuits
• CPC Class Codes: H05K 1/113 Via provided in pad; Pad over filled via
• CPC Class Codes: H05K 1/118 specially for flexible printed circuits, e.g. using folded portions
• CPC Class Codes: H05K 1/14 Structural association of two or more printed circuits providing electric connection to or between printed circuits H05K1/11, H01R12/00
• CPC Class Codes: H05K 1/144 Stacked arrangements of planar printed circuit boards
• CPC Class Codes: H05K 1/147 at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit H05K1/148 takes precedence
• CPC Class Codes: H05K 2201/041 Stacked PCBs, i.e. having neither an empty space nor mounted components in between
• CPC Class Codes: H05K 2201/09481 Via in pad; Pad over filled via if used for surface mounting H05K1/113
• CPC Class Codes: H05K 2201/09918 Optically detected marks used for aligning tool relative to the PCB, e.g. for mounting of components
• CPC Class Codes: H05K 2201/10106 : Light emitting diode [LED]
• CPC Class Codes: H05K 2201/2027 : Guiding means, e.g. for guiding flexible circuits
• CPC Class Codes: H05K 2203/0228 : Cutting, sawing, milling or shearing
• CPC Class Codes: H05K 3/0061 : onto a metallic substrate, e.g. a heat sink heat sinks for electric apparatus H05K7/20
• CPC Class Codes: H05K 3/363 : by soldering

Abstract

In some embodiments, an interconnectable circuit board may include one or more of the following features: (a) a first electrically conductive pad located on a top of the circuit board, (b) a plated through hole on the conductive pad which passes through the circuit board, (c) a second electrically conductive pad coupled to the plated through hole; the second conductive pad capable of being electrically connected to a third electrically conductive pad attached to a top of a second interconnectable circuit board, (d) cut marks indicating safe locations for separating the circuit board, and (e) a second cut mark adjacent to the first cut mark where the area between the first and second cut mark can be utilized to make a safe cut through the circuit board.

Claims

1. An interconnectable circuit board array, comprising:

a plurality of interconnectable circuit boards, each circuit board comprising

a distal end having a first electrically conductive pad located on a top of the circuit board;

a plated through hole located on the conductive pad, the through hole passes through a conductive layer of the circuit board, an insulative layer of the circuit board and a second separate conductive layer of the circuit board, the plated through hole allowing solder to flow from the conductive layer to the second conductive layer;

a second electrically conductive pad coupled to the plated through hole, the second electrically conductive pad capable of coupling with an electrical component; and

a proximal end having a third electrically conductive pad attached to the top of the circuit board;

wherein each of the plurality of interconnectable circuit boards includes a portion that overlaps with another interconnectable circuit board to form an overlapping joint and a portion that does not overlap with another interconnectable circuit board.

2. The circuit board array of claim 1, further comprising alignment marks for use in aligning the interconnectable circuit boards when interconnecting them.

3. The circuit board array of claim 1, further comprising cut marks showing locations where the interconnectable circuit boards can be cut.

4. The circuit board array of claim 1, further comprising circuit paths electrically coupling the electrically conductive pads to provide electrical interconnectivity between the interconnectable circuit boards.

5. The circuit board array of claim 1, further comprising a non-conductive solder repelling material on a surface of the interconnectable circuit boards.

6. The circuit board array of claim 1, the interconnectable circuit boards further comprising a fourth conductive pad for electrically receiving electronic components.

7. The circuit board array of claim 1, wherein the insulative layer is sandwiched between the conductive layer and a second conductive layer.

8. The circuit board array of claim 1, wherein the electrical components can be an LED.

9. The circuit board array of claim 1, wherein the interconnectable circuit board is a SSL (solid state lighting) circuit.

10. The circuit board array of claim 7, wherein the first and second conductive layers are comprised of copper.

11. The circuit board array of claim 7, wherein the insulative layer is comprised of fiberglass composite material.

12. The circuit board array of claim 1, wherein the length of the plurality of interconnectable circuit boards after interconnection is greater than the length of individual interconnectable circuit boards.

13. The circuit board array of claim 1, further comprising a heat sink, the plurality of interconnectable circuit boards disposed on the heat sink.

14. The circuit board array of claim 13, the plurality of interconnectable circuit boards adhered to the heat sink by double sided thermal adhesive tape.

15. An interconnectable circuit board array, comprising:

a plurality of interconnectable circuit boards, each circuit board comprising

a first electrically conductive pad located on a top of the circuit board;

a plated through hole located on the first conductive pad, the through hole passes through a first conductive layer of the circuit board, an insulative layer of the circuit board and a second separate conductive layer of the circuit board, the plated through hole allowing solder to flow from the first conductive layer to the second conductive layer;

a second electrically conductive pad coupled to the plated through hole, the second electrically conductive pad capable of coupling with an electrical component; and

a third electrically conductive pad attached to the top of the circuit board;

wherein each of the plurality of interconnectable circuit boards includes a portion that overlaps with another interconnectable circuit board and a portion that does not overlap with another interconnectable circuit board.

16. The interconnectable circuit board array of claim 15, further comprising cut marks showing locations where the interconnectable circuit boards can be cut.

17. The interconnectable circuit board array of claim 15, further comprising circuit paths electrically coupling the electrically conductive pads to provide electrical interconnectivity between the interconnectable circuit boards.

18. The interconnectable circuit board array of claim 15, further comprising a non-conductive solder repelling material on a surface of the interconnectable circuit boards.

19. The interconnectable circuit board array of claim 15, the interconnectable circuit boards further comprising a fourth conductive pad for electrically receiving electronic components.

20. The interconnectable circuit board array of claim 15, wherein the insulative layer is sandwiched between the conductive layer and a second conductive layer.