Manufacturing method for electronic device

• US 8,007,335 B2
• Filed: 08/26/2009
• Issued: 08/30/2011
• Est. Priority Date: 12/27/2004
• Status: Expired due to Fees

• Current Assignee: Fujikura Limited
• Original Assignee: Fujikura Limited
• Inventors: Ohmori, Kiwako, Ono, Akinobu, Tanabe, Nobuo
• Primary Examiner(s): HINES, ANNE M
• Application Number:
  US12/548,262
• Publication Number:
  US 20090317563A1
• Time in Patent Office: 734 Days
• Field of Search: 445 24- 25, 428/246, 428/327, 428/901, 313498-512
• US Class Current: 445/24
• CPC Class Codes: G03F 7/039 Macromolecular compounds which are photodegradable, e.g. positive electron resists G03F7/075 takes precedence; macromolecular quinonediazides G03F7/023
• CPC Class Codes: G03F 7/093 characterised by antistatic means, e.g. for charge depletion
• CPC Class Codes: H10K 50/81 Anodes
• CPC Class Codes: H10K 59/80515 characterised by their shape
• CPC Class Codes: H10K 71/211 by selective transformation of an existing layer

Abstract

A manufacturing method for an electronic device, the method including forming a transparent conductive film, including conductive polymers, on a base material, and irradiating ultraviolet light onto a part of the transparent conductive film such that first regions of the transparent conductive film are not irradiated and second regions, adjacent to the first regions, are irradiated, thus forming irradiated portions and non-irradiated portions. The irradiated portions having an electrical resistance value higher than that of the non-irradiated portions. The ultraviolet light includes a wavelength that exhibits an absorbance in an absorption spectrum of the conductive polymers, of the transparent conductive film, two or more times higher than that of a background.

Claims

1. An electronic device manufacturing method comprising:

forming a transparent conductive film, comprising conductive polymers, on a base material; and

irradiating ultraviolet light onto a part of the transparent conductive film, such that at least one first region of the transparent conductive film is not irradiated and at least one second region, adjacent to the first region, is irradiated, thus forming at least one irradiated portion and at least one non-irradiated portion, wherein the irradiated portion has an electrical resistance value higher than that of the non-irradiated portion;

wherein the ultraviolet light includes a wavelength that exhibits an absorbance in an absorption spectrum of the conductive polymers of the transparent conductive film, two or more times higher than that of a background.

2. The electronic device manufacturing method according to claim 1, further comprising:

drying and curing the transparent conductive film prior to irradiating the ultraviolet light.

3. An electronic device manufacturing method comprising:

forming a transparent conductive film, comprising conductive polymers and a radical polymerization initiator, on a base material; and

irradiating ultraviolet light onto a part of the transparent conductive film, such that at least one first region of the transparent conductive file is not irradiated and at least one second region, adjacent to the first region, is irradiated, thus forming at least one irradiated portion and at least one non-irradiated portion, wherein the at least one irradiated portion has an electrical resistance value higher than that of the at least one non-irradiated portion.

4. The electronic device manufacturing method according to claim 3, further comprising drying and curing the transparent conductive film prior to irradiating the ultraviolet light.

5. An electronic device manufacturing method comprising:

forming a transparent conductive film, comprising polythiophene-based conductive polymers and a radical polymerization initiator, on a base material; and

irradiating ultraviolet light onto a part of the transparent conductive film, such that at least one first region of the transparent conductive film is not irradiated and at least one second region, adjacent to the first region, is irradiated, thus forming at least one irradiated portion and at least one non-irradiated portion, wherein the at least one irradiated portion has an electrical resistance value higher than that of the at least one non-irradiated portion.

6. The electronic device manufacturing method according to claim 5, further comprising drying and curing the transparent conductive film prior to irradiating ultraviolet light.