Semiconductor package having an antenna with reduced area and method for fabricating the same

• US 8,008,754 B2
• Filed: 06/30/2009
• Issued: 08/30/2011
• Est. Priority Date: 12/10/2008
• Status: Expired due to Fees

• Current Assignee: Hynix Semiconductor Incorporated (SK Hynix Inc.)
• Original Assignee: Hynix Semiconductor Incorporated (SK Hynix Inc.)
• Inventors: Kang, Tae Min
• Primary Examiner(s): Smith; Bradley K
• Assistant Examiner(s): KARIMY, TIMOR
• Application Number:
  US12/495,029
• Publication Number:
  US 20100140757A1
• Time in Patent Office: 791 Days
• Field of Search: 257/659, 257/E23.114, 257/221.499, 257/691
• US Class Current: 257/659
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: G06K 19/07771 the record carrier comprising means for minimising adverse effects on the data communication capability of the record carrier, e.g. minimising Eddy currents induced in a proximate metal or otherwise electromagnetically interfering object
• CPC Class Codes: H01L 21/561 Batch processing
• CPC Class Codes: H01L 2223/6677 for antenna, e.g. antenna included within housing of semiconductor device
• CPC Class Codes: H01L 2224/04042 Bonding areas specifically adapted for wire connectors, e.g. wirebond pads
• CPC Class Codes: H01L 2224/0554 External layer
• CPC Class Codes: H01L 2224/0555 Shape
• CPC Class Codes: H01L 2224/0556 Disposition
• CPC Class Codes: H01L 2224/0557 the external layer being disposed on a via connection of the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/05571 the external layer being disposed in a recess of the surface
• CPC Class Codes: H01L 2224/05573 Single external layer
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/06135 Covering only the peripheral area of the surface to be connected, i.e. peripheral arrangements
• CPC Class Codes: H01L 2224/16145 the bodies being stacked
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73265 : Layer and wire connectors
• CPC Class Codes: H01L 23/3128 : the substrate having spherical bumps for external connection
• CPC Class Codes: H01L 23/48 : Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
• CPC Class Codes: H01L 23/49838 : Geometry or layout
• CPC Class Codes: H01L 23/552 : Protection against radiation, e.g. light or electromagnetic waves
• CPC Class Codes: H01L 23/66 : High-frequency adaptations
• CPC Class Codes: H01L 24/48 : of an individual wire connector
• CPC Class Codes: H01L 24/73 : Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/15311 : being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/207 : Diameter ranges
• CPC Class Codes: H01L 2924/3025 : Electromagnetic shielding

Abstract

A semiconductor package includes an electromagnetic shielding member for shielding electromagnetic waves. An antenna is disposed on an upper face of the electromagnetic shielding member and includes an antenna part with a plurality of conductive particles electrically connected with each other and an insulation part disposed on the upper face of the electromagnetic shielding member and insulating the antenna part. Ball lands are disposed on the electromagnetic shielding member and are electrically connected with the antenna part. A Radio Frequency Identification (RFID) chip is electrically connected to the ball lands.

Claims

1. A semiconductor package, comprising:

an electromagnetic shielding member for shielding electromagnetic waves;

an antenna disposed over an upper face of the electromagnetic shielding member, the antenna comprising;

an antenna part having a plurality of conductive polarized particles electrically connected with each other; and

an insulation part surrounding the antenna part to insulate the antenna part;

RFID chip ball lands disposed on the electromagnetic shielding member and electrically coupled to the antenna part;

a Radio Frequency identification (RFID) chip electrically coupled to the RFID chip ball lands;

a semiconductor chip having the electromagnetic shielding member disposed thereon such that a lower face of the electromagnetic shielding member opposite to the upper face of the electromagnetic shielding member faces the semiconductor chip;

a substrate electrically connected to the semiconductor chip; and

a molding member for molding the RFID chip and the semiconductor chip.

2. The semiconductor package according to claim 1, wherein the electromagnetic shielding member comprises openings and bonding pads are disposed on the semiconductor chip at positions corresponding to the openings, wherein the bonding pads are electrically connected with the substrate.

3. The semiconductor package according to claim 1, wherein the electromagnetic shielding member disposed on the semiconductor chip exposes at least one edge of the semiconductor chip and bonding pads are disposed along the edge of the semiconductor chip and electrically connected to the substrate.

4. The semiconductor package according to claim 1, wherein the antenna is disposed along an edge of the upper face of the electromagnetic shielding member in one of a spiral shape and a closed loop shape.

5. The semiconductor package according to claim 1, wherein the antenna disposed on the upper face of the electromagnetic shielding member is configured such that the antenna intersects with another portion thereof at least one time on the electromagnetic shielding member.

6. A semiconductor package, comprising:

an electromagnetic shielding member for shielding electromagnetic waves;

an antenna disposed over an upper face of the electromagnetic shielding member, the antenna comprising;

an antenna part having a plurality of conductive polarized particles electrically connected with each other; and

an insulation part surrounding the antenna part to insulate the antenna part;

RFID chip ball lands disposed on the electromagnetic shielding member and electrically coupled to the antenna part;

a Radio Frequency Identification (RFID) chip electrically coupled to the RFID chip ball lands;

a substrate on which the electromagnetic shielding member is disposed such that a lower face of the electromagnetic shielding member opposite the upper face of the electromagnetic shielding member faces the substrate;

a semiconductor chip disposed on the substrate and electrically connected to the substrate; and

a molding member for molding the RFID chip and the semiconductor chip.

7. The semiconductor package according to claim 6, further comprising:

a plurality of RFID reader ball lands disposed on at least one of the substrate and the semiconductor chip;

an RFID reader electrically connected to the RFID reader ball lands, and in communication with an external RFID chip positioned outside the semiconductor package; and

an RFID reader antenna disposed on at least one of the substrate and the semiconductor chip, and electrically connected to the RFID reader ball lands.

8. The semiconductor package according to claim 7, further comprising:

a thin secondary cell, disposed on the substrate and applying a power to at least one of the RFID reader and the RFID chip.

9. The semiconductor package according to claim 8, wherein the thin secondary cell is interposed between the substrate and the semiconductor chip.

10. The semiconductor package according to claim 6, wherein the electromagnetic shielding member is disposed on an entire upper surface of the substrate and an opening is defined in the electromagnetic shielding member for exposing the semiconductor chip.

11. The semiconductor package according to claim 10, further comprising:

bonding pads disposed in the semicondubtor chip facing the substrate;

connection pads disposed on the substrate corresponding to the bonding pads; and

bumps for electrically connecting the bonding pads and the connection pads.

12. The semiconductor package according to claim 6, wherein the antenna is disposed along an edge of the upper face of the electromagnetic shielding member in one of a spiral shape and a closed loop shape.

13. The semiconductor package according to claim 6, wherein the antenna disposed on the upper face of the electromagnetic shielding member is configured such that the antenna intersects with another portion thereof at least one time on the electromagnetic shielding member.

14. A semiconductor package, comprising:

an electromagnetic shielding member for shielding electromagnetic waves;

an antenna disposed over an upper face of the electromagnetic shielding member, the antenna comprising;

an antenna part having a plurality of conductive polarized particles electrically connected with each other; and

an insulation part surrounding the antenna part to insulate the antenna part;

RFID chip ball lands disposed on the electromagnetic shielding member and electrically coupled to the antenna part;

a Radio Frequency Identification (RFID) chip electrically coupled to the RFID chip ball lands;

a wafer level semiconductor chip comprising;

a first face, wherein a lower face of the electromagnetic shielding member opposite the upper face of the electromagnetic shielding member is disposed on the first face of the wafer level semiconductor chip;

a second face opposite the first face;

bonding pads disposed on the second face;

redistributions electrically connected to the respective bonding pads; and

an insulation film disposed over the second face and having openings defined therein for exposing a portion of the respective redistributions.

15. The semiconductor package according to claim 14, further comprising:

a molding member for molding the RFID chip and the electromagnetic shielding member.

16. The semiconductor package according to claim 14, further comprising:

an RFID reader ball land disposed over the electromagnetic shielding member; and

an RFID reader electrically connected to the RFID reader ball land, and in communication with an external RFID chip positioned outside the semiconductor package; and

an RFID reader antenna electrically connected to the RFID reader ball land.

17. The semiconductor package according to claim 14, wherein the antenna is disposed along an edge of the upper face of the electromagnetic shielding member in one of a spiral shape and a closed loop shape.

18. The semiconductor package according to claim 14, wherein the antenna disposed on the upper face of the electromagnetic shielding member is configured such that the antenna intersects with another portion thereof at least one time on the electromagnetic shielding member.