Pre-molded clip structure

• US 8,008,759 B2
• Filed: 06/24/2010
• Issued: 08/30/2011
• Est. Priority Date: 01/24/2007
• Status: Active Grant

• Current Assignee: Semiconductor Components Industries LLC (ON Semiconductor Corporation)
• Original Assignee: Fairchild Semiconductor Corporation (ON Semiconductor Corporation)
• Inventors: Cruz, Erwin Victor, Estacio, Maria Cristina B.
• Primary Examiner(s): Williams; Alexander O
• Application Number:
  US12/822,932
• Publication Number:
  US 20100258924A1
• Time in Patent Office: 432 Days
• Field of Search: 257/676, 257/E23.031, 257/E21.506, 257/E23.036, 257/E23.052, 257/E21.51, 257/684, 257/796, 257/666, 257/696, 257/670, 257/672, 257/723, 257/685, 257/E25.031, 257/E25.032, 257/E25.042, 257/E25.005, 257/E25.011, 257/E25.015, 257/E25.02, 257/E25.026, 438/117
• US Class Current: 257/676
• CPC Class Codes: H01L 2224/03912 the bump being used as a mask for patterning the bonding area
• CPC Class Codes: H01L 2224/0603 Bonding areas having different sizes, e.g. different heights or widths
• CPC Class Codes: H01L 2224/37147 Copper [Cu] as principal constituent
• CPC Class Codes: H01L 2224/40245 the item being metallic
• CPC Class Codes: H01L 2224/40249 the bond pad protruding from the surface of the item
• CPC Class Codes: H01L 2224/4103 Connectors having different sizes
• CPC Class Codes: H01L 2224/84801 Soldering or alloying
• CPC Class Codes: H01L 2224/8485 using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
• CPC Class Codes: H01L 23/49524 the additional leads being a tape carrier or flat leads
• CPC Class Codes: H01L 23/49562 for devices being provided for in H01L29/00
• CPC Class Codes: H01L 23/49575 Assemblies of semiconductor devices on lead frames
• CPC Class Codes: H01L 24/36 Structure, shape, material or disposition of the strap connectors prior to the connecting process
• CPC Class Codes: H01L 24/37 of an individual strap connector
• CPC Class Codes: H01L 24/39 Structure, shape, material or disposition of the strap connectors after the connecting process
• CPC Class Codes: H01L 24/40 of an individual strap connector
• CPC Class Codes: H01L 24/41 of a plurality of strap connectors
• CPC Class Codes: H01L 24/84 using a strap connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 : Boron [B]
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01015 : Phosphorus [P]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/1305 : Bipolar Junction Transistor [BJT]
• CPC Class Codes: H01L 2924/13091 : Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/19043 : being a resistor

Abstract

A method for making a premolded clip structure is disclosed. The method includes obtaining a first clip and a second clip, and forming a molding material around the first clip comprising a first surface and the second clip comprising a second surface. The first surface of the first clip structure and the second surface of the second clip structure are exposed through the molding material, and a premolded clip structure is then formed.

Claims

1. A premolded clip structure comprising:

a clip comprising a die attach surface; and

a molding material coupled to the clip and comprising a molding material surface, wherein the die attach surface is exposed by the molding material surface.

2. The premolded clip of claim 1 wherein the clip is a source clip.

17. The premolded clip structure of claim 1 wherein the clip is half-etched.

3. A semiconductor die package comprising:

a premolded clip structure comprising a clip comprising a die attach surface and a molding material coupled to the clip, wherein the molding material comprises a molding material surface, and wherein the die attach surface is exposed by the molding material surface; and

a semiconductor die comprising a first die surface and a second die surface, and a first electrical terminal and a second electrical terminal at the first die surface, wherein the first die surface is electrically coupled to the first electrical terminal.

4. The semiconductor die package of claim 3 further comprising:

a leadframe structure, and wherein the die is on the leadframe structure.

5. The semiconductor die package of claim 4 wherein the package is an MLP-type package.

6. The semiconductor die package of claim 3 wherein the semiconductor die comprises a vertical MOSFET.

7. The semiconductor die package of claim 4 wherein the molding material is a first molding material, and wherein the semiconductor die package further comprises a second molding material around at least a portion of the semiconductor die, the premolded clip structure, and the leadframe structure.

8. The semiconductor die package of claim 7 wherein the second molding material is the same type of molding material as the first molding material.

9. The semiconductor die package of claim 7 wherein the leadframe structure comprises copper.

10. The semiconductor die package of claim 9 wherein the semiconductor die package is an MLP type package.

11. The semiconductor die package of claim 7, wherein an interface is present between the first molding material and the second molding material.

12. The semiconductor die package of claim 7 wherein the leadframe structure comprises a drain lead structure, and wherein the second molding material does not extend beyond lateral edges of the drain lead structure.

13. The semiconductor die package of claim 7 wherein an exterior surface of the leadframe structure is exposed by the second molding material.

14. The semiconductor die package of claim 4 wherein the molding material is not directly attached to the leadframe structure.

15. The semiconductor die package of claim 7 wherein the first molding material is not directly attached to the leadframe structure.

16. The semiconductor die package of claim 3 wherein the clip is half-etched.