RFID tag and method of manufacturing RFID tag

• US 8,009,049 B2
• Filed: 09/22/2010
• Issued: 08/30/2011
• Est. Priority Date: 05/29/2007
• Status: Expired due to Fees

• Current Assignee: Fujitsu Frontech Limited (Fujitsu Limited), Fujitsu Limited
• Original Assignee: Fujitsu Frontech Limited (Fujitsu Limited), Fujitsu Limited
• Inventors: Sugimura, Yoshiyasu, Nogami, Satoru, Baba, Shunji, Niwata, Tsuyoshi, Hashimoto, Shigeru
• Primary Examiner(s): La; Anh V
• Application Number:
  US12/887,826
• Publication Number:
  US 20110006120A1
• Time in Patent Office: 342 Days
• Field of Search: 3405721-5728, 340/10.1, 156/277, 156/60, 342/51, 342/42, 342/44, 713/189, 713/150, 713/192, 713/193, 235/492, 283/109, 283/75
• US Class Current: 340/572.1
• CPC Class Codes: B32B 2305/342 Chips
• CPC Class Codes: B32B 2519/02 RFID tags
• CPC Class Codes: B32B 37/185 Laminating sheets, panels or inserts between two discrete plastic layers
• CPC Class Codes: B32B 38/145 Printing
• CPC Class Codes: Y10T 156/10 Methods of surface bonding and/or assembly therefor

Abstract

An RFID tag includes: a tag main body having a communication antenna, a circuit chip electrically connected to the antenna to perform wireless communication via the antenna, and a tabular sealing member in which the antenna and the circuit chip are enclosed; a print layer formed on a first surface of the tag main body by printing; and a protective film that covers the print layer. The print layer is formed only in a central area of the first surface surrounded by a marginal area of the first surface extending along the outer edge of the first surface. The protective film includes a covering portion that covers the print layer and an adhering portion that lies off the print layer while surrounding the outer edge of the print layer and adheres to the first surface.

Claims

1. An RFID tag comprising:

an inlay including a base, an antenna, and a circuit chip;

a sealing member encapsulating the inlay therein;

a print layer formed on a surface of the sealing member except for an outer edge of the surface; and

a protective film covering the print layer and adhering to the outer edge of the surface of the sealing member.

2. The RFID tag according to claim 1, wherein the protective film is made of the same material as that of the sealing member.

3. The RFID tag according to claim 1, wherein the protective film includes amarked portion where a groove is formed by laser marking, and

the print layer and the marked portion are formed in respective areas that do not overlap each other when the protective film is viewed in the thickness direction thereof.

4. The RFID tag according to claim 2, wherein the protective film includes amarkedportion where a groove is formed by laser marking, and

the print layer and the marked portion are formed in respective areas that do not overlap each other when the protective film is viewed in the thickness direction thereof.

5. The RFID tag according to claim 1, wherein the print layer has an area smaller than the surface of the sealing member, and

the protect film has an area equal to the surface of the sealing member.

6. A method of manufacturing a RFID tag comprising:

interposing an inlayincluding a base, anantenna, and a circuit chip between a first sealing member and a second sealing member;

forming a print layer on at least one surface of the first and the second sealing members except for an outer edge of the surface;

disposing a protect film onto the print layer and the outer edge of the surface; and

heating under pressure an entire stack of the first sealing member, the second sealing member, and the protect film t o encapsulate the inlay in a thermal-sealed member and to adhere the protect film to the outer edge of the surface.

7. The method according to claim 6, wherein the first sealing member, the second sealing member, andthe protectivemember are made of the same material.