Uniform background radiation in maskless lithography

• US 8,009,270 B2
• Filed: 03/22/2007
• Issued: 08/30/2011
• Est. Priority Date: 03/22/2007
• Status: Expired due to Fees

• Current Assignee: ASML Netherlands BV (ASML Holding NV)
• Original Assignee: ASML Netherlands BV (ASML Holding NV)
• Inventors: Desmedt, Paul Antoon Cyriel, Tinnemans, Patricius Aloysius Jacobus, Cuperus, Minne
• Primary Examiner(s): Glick; Edward J.
• Assistant Examiner(s): Asfaw; Mesfin T
• Application Number:
  US11/689,926
• Publication Number:
  US 20080231826A1
• Time in Patent Office: 1,622 Days
• Field of Search: 355/53, 359290-295, 359/298
• US Class Current: 355/53
• CPC Class Codes: G03F 7/70283 Mask effects on the imaging process
• CPC Class Codes: G03F 7/70291 Addressable masks, e.g. spatial light modulators [SLMs], digital micro-mirror devices [DMDs] or liquid crystal display [LCD] patterning devices
• CPC Class Codes: G03F 7/70475 Stitching, i.e. connecting image fields to produce a device field, the field occupied by a device such as a memory chip, processor chip, CCD, flat panel display

Abstract

A device manufacturing method comprising applying patterns to a plurality of arrays of individually controllable elements, such that they modulate a beam of radiation, and projecting the modulated beam of radiation onto a substrate. The patterns applied to the arrays of individually controllable elements are arranged such that pre-determined amounts of background radiation are included in the modulated beam of radiation. The pre-determined amounts of background radiation being different for different locations on the arrays.

Claims

1. A device manufacturing method, comprising:

applying patterns to a plurality of arrays, each of the arrays comprising individually controllable elements such that the arrays modulate a beam of radiation; and

projecting the modulated beam of radiation onto a substrate,

wherein the patterns applied to the arrays are arranged such that pre-determined amounts of background radiation are included in the modulated beam of radiation, the pre-determined amounts of background radiation being different for different locations on the arrays,

wherein each of the arrays further comprise a static border that does not include individually controllable elements.

2. The device manufacturing method of claim 1, wherein the pre-determined amount of background radiation included in the modulated beam of radiation is greater at a central location of a given one of the arrays than at an edge of the given one of the arrays.

3. The device manufacturing method of claim 1, wherein the pre-determined amounts of background radiation are selected such that a substantially uniform level of background radiation is delivered to different locations on the substrate, irrespective of whether those locations receive radiation from one of the arrays or more than one of the arrays.

4. The device manufacturing method of claim 1, wherein the method further comprises:

determining which locations on the substrate will receive radiation modulated by more than one of the arrays, and which locations on the substrate will receive radiation modulated by only one of the arrays; and

arranging the patterns applied to the arrays, such that those locations on the substrate that receive radiation modulated by only one of the arrays will receive substantially a same amount of background radiation as those locations on the substrate that receive radiation modulated by more than one of the arrays.

5. The device manufacturing method of claim 1, wherein the method further comprises:

determining the amount of background radiation that will be received at different locations on the substrate;

determining a maximum amount of radiation that will be received on the substrate;

calculating amounts of additional background radiation to be added to locations on the substrate that receive less than the maximum amount of background radiation; and

adjusting patterns applied to the arrays accordingly, such that those locations on the substrate receive the maximum amount of background radiation.

6. The device manufacturing method of claim 1, wherein one or more DC offsets are applied to individually controllable elements in different locations of an array, the DC offsets adjusting an amount of background radiation that is included in the modulated beam.

7. The device manufacturing method of claim 1, wherein the individually controllable elements are mirrors.

8. The device manufacturing method of claim 1, wherein positions of patterned regions projected onto the substrate are staggered, such that there are no locations on the substrate that receive more than three patterned regions.

9. The device manufacturing method of claim 8, wherein the staggering of the positions of the patterned regions is such that the patterned regions are not aligned in a direction transverse to a scanning movement of the substrate.

10. A lithographic apparatus, comprising:

a plurality of arrays comprising individually controllable elements arranged to be patterned, such that the arrays modulate a beam of radiation;

a projection system arranged to project the modulated beam of radiation onto a substrate; and

a controller arranged to control patterns provided on the arrays, wherein;

the controller is arranged to apply patterns to the arrays,

the patterns being configured such that pre-determined amounts of background radiation are included in the beam of radiation as modulated by the arrays,

the arrays further comprise a static border that does not include individually controllable elements, and

the pre-determined amounts of background radiation being different for different locations on the arrays.

11. The apparatus of claim 10, wherein the pattern applied to a given one of the arrays is such that the amount of background radiation included in the radiation beam as modulated by one location on an array is twice as much as the background radiation included in the radiation beam as modulated by a different location on the array.

12. The apparatus of claim 10, wherein the pre-determined amount of background radiation included in the modulated beam of radiation is greater at a central location of a given one of the arrays than at an edge of that array.

13. The apparatus of claim 10, wherein:

the controller is provided with information that indicates which locations on the substrate will receive radiation modulated by more than one of the arrays, and which locations on the substrate will receive radiation modulated by only one of the arrays; and

the controller is configured to arrange patterns applied to the arrays, such that those locations on the substrate that receive radiation modulated by only one of the arrays will receive substantially a same amount of background radiation as those locations on the substrate that receive radiation modulated by more than one of the arrays.

14. The apparatus of claim 10, wherein the apparatus further comprises:

a blade arranged to mask off radiation modulated by one or more of the arrays, the blade having an edge that is parallel to a scanning direction of motion of the substrate within the lithographic apparatus, the blade being moveable in a direction that is transverse to a scanning direction of motion.

15. A device manufacturing method, comprising:

modulating a beam of radiation using a plurality of arrays comprising individually controllable elements; and

projecting the modulated beam of radiation onto a substrate to form a plurality of patterned regions on the substrate,

wherein the arrays further comprise a static border that does not include individually controllable element, and

wherein positions of the patterned regions are staggered, such that there are no locations on the substrate that receive more than three patterned regions.

16. The device manufacturing method of claim 15, wherein the staggering of the positions of the patterned regions is such that the patterned regions are not aligned in a direction transverse to a scanning movement of the substrate.

17. A lithographic apparatus, comprising:

a plurality of arrays comprising individually controllable elements arranged to be patterned, such that the arrays modulate a beam of radiation;

a projection system arranged to project the modulated beam of radiation onto a substrate; and

a controller arranged to control patterns provided on the arrays,

wherein the arrays are not aligned in a direction transverse to a scanning direction of the lithographic apparatus, but instead have a separation in the scanning direction, the separation being a non-integer multiple of a length of an active part of one of the arrays of individually controllable elements in the scanning direction, and

wherein the arrays further comprise a static border that does not include individually controllable elements.

18. The apparatus of claim 17, wherein the separation in the scanning direction is determined by SLMD_scan=(M_d*Pitch_scan+(SLM_scan−

Pitch_scan)+2*BA and the reduction factor of the projection system of the lithographic apparatus, wherein

M_d is an integer,

Pitch_scan is a length in the lithographic apparatus scanning direction, which is patterned by a given mirror array not including overlap with an adjacent pattern,

SLM_scan is a length in the scanning direction that is patterned by the mirror array including overlap with an adjacent pattern, and

BA is a length in the scanning direction that receives radiation from a border of the mirror array.

19. The apparatus of claim 17, wherein the separation in the scanning direction is an integer number times the length in the lithographic apparatus scanning direction that is patterned by a given one of the mirror arrays not including overlap with an adjacent pattern, plus an amount which is less than half of the length in the lithographic apparatus scanning direction that is patterned by a given mirror array not including overlap with an adjacent pattern.

20. The apparatus of claim 17, the separation in the scanning direction is any value that avoids locations on the substrate receiving radiation modulated by the mirror arrays on four separate occasions during exposure of the substrate.