Method and system of monitoring manufacturing equipment

• US 8,010,225 B2
• Filed: 01/30/2008
• Issued: 08/30/2011
• Est. Priority Date: 01/30/2008
• Status: Expired due to Fees

• Current Assignee: GlobalFoundries, Inc.
• Original Assignee: International Business Machines Corporation
• Inventors: Yamartino, John M.
• Primary Examiner(s): Decady; Albert
• Assistant Examiner(s): Lin; Jason
• Application Number:
  US12/022,448
• Publication Number:
  US 20090192632A1
• Time in Patent Office: 1,308 Days
• Field of Search: 700/180, 747/14, 744/26, 373/31, 373/32, 216/37, 735/71, 738/637.3, 737/14, 734/26
• US Class Current: 700/180
• CPC Class Codes: G05B 23/024 Quantitative history assessment, e.g. mathematical relationships between available data; Functions therefor; Principal component analysis [PCA]; Partial least square [PLS]; Statistical classifiers, e.g. Bayesian networks, linear regression or correlation analysis; Neural networks
• CPC Class Codes: G05B 23/0281 Quantitative, e.g. mathematical distance; Clustering; Neural networks; Statistical analysis

Abstract

A method and system is provided for monitoring manufacturing equipment and, more particularly, for monitoring manufacturing equipment in a semiconductor fabrication facility using existing tool elements. The method includes operating a tool working at an operating mode such that at least one of its control parameters is outside of a normal operating range, and measuring the at least on of the control parameters of the tool working at the operating mode outside of the normal operating range. The method further includes detecting a change to a condition of the tool based on the measuring of the at least one control parameter.

Claims

1. A method, comprising:

operating a tool working at an operating mode such that at least one of its control parameters is outside of a normal operating range;

measuring the at least one of the control parameters of the tool working at the operating mode outside of the normal operating range;

detecting a change to a condition of the tool based on the measuring of the at least one control parameter, wherein the condition comprises one of;

process gas temperature;

process gas dissociation level;

chamber wall condition and deposition;

outgassing;

pressure gage calibration;

chamber conductance; and

mass flow control (MFC) calibration; and

comparing the parameter across multiple tools for determining differences between the tools,

wherein the operating the tool occurs at least one of;

between processing steps of the tool;

while the tool is in a manufacturing idle state;

between conditioning steps of the tool;

before or after processing a wafer on the tool; and

before or after conditioning of the tool.

2. The method of claim 1, wherein the operating mode puts a pressure control valve of a vacuum processing chamber above about 35% open.

3. The method of claim 2, wherein the operating mode puts the pressure control valve of a vacuum processing chamber above 40% open.

4. The method of claim 1, wherein the measuring of the parameter is used for statistical process control (SPC), Fault Detection and Classification (FDC), monitoring or analyses of the tool.

5. The method of claim 1, further comprising ramping a flow or pressure to move a pressure control valve from a normal control region to substantially open or fully open position.

6. The method of claim 1, wherein the operating mode is embedded within at least one processing step or conditioning step of a fabrication process.

7. The method of claim 1, wherein the operating mode is a dedicated step executed before or after a conditioning step or a wafer processing step.

8. The method of claim 1, wherein the operating mode is executed during an idle time of the tool.

9. The method of claim 8, further comprising ramping a flow or pressure to obtain a cold-chamber baseline measurement of at least one of wall outgassing and conductance change.

10. The method of claim 9, wherein the ramping is continuous during the idle time.

11. The method of claim 1, wherein the tool is a wafer processing tool of a semiconductor fabrication facility.

12. A method comprising operating a chamber of a tool set at a non-normal operating mode, measuring at least one control parameter of the chamber of the tool set when in an insensitive operating region and comparing the at least one control parameter to determine a condition of the chamber,

wherein the condition comprises one of:

process gas temperature;

process gas dissociation level;

chamber wall condition and deposition;

outgassing;

pressure gage calibration;

chamber conductance; and

mass flow control (MFC) calibration,

wherein the tool set is at least two tools and the measuring of the parameters is in two chambers in an insensitive operating region, and the comparing is comparing the parameters of the at least two tools to determine chamber conditions, and

wherein the operating occurs at least one of;

between processing steps of the chamber;

while the chamber is in a manufacturing idle state;

between conditioning steps of the chamber;

before or after processing a wafer in the chamber; and

before or after conditioning of the chamber.

13. The method of claim 12, wherein the insensitive operating region is above about 35% of a pressure control valve opening.

14. The method of claim 12, wherein the insensitive operating region is a sensitive region for determining at least gas temperature and gas dissociation level.

15. The method of claim 12, wherein the parameters are measurements:

taken during an idle time of the tool set;

embedded during at least one processing step of a fabrication process;

or

taken before or after a conditioning step or a wafer processing step.

16. A system monitoring conditions in chambers of tools implemented on a computer program product comprising a computer readable media, the computer program product being operable to:

operate a tool outside its normal operating mode at least one of;

between processing steps of the tool;

while the tool is in a manufacturing idle state;

between conditioning steps of the tool;

before or after processing a wafer on the tool; and

before or after conditioning of the tool;

measure at least one control parameter of the tool working at the operating mode outside of its normal operating mode; and

detect a change to a condition of the tool based on the measuring of the at least one control parameter, wherein the condition comprises one of;

process gas temperature;

process gas dissociation level;

chamber wall condition and deposition;

outgassing;

pressure gage calibration;

chamber conductance; and

mass flow control (MFC) calibration;

wherein the at least one control parameters comprises a position of a pressure control valve, and the operating comprises instructing a wafer processing chamber to operate at conditions that move the pressure control valve to a position outside of the normal operating range of the pressure control valve.

17. The system of claim 16, wherein the computer program product being operable to provide, based on the detecting a change, statistical process control (SPC), Fault Detection and Classification (FDC), monitoring or analyses of the tool.

18. The system of claim 17, wherein the computer program product is operable to detect changes to at least one of:

gas temperature, gas dissociation level, chamber wall condition and deposition;

outgassing;

pressure gage calibration;

chamber conductance; and

mass flow control (MFC) calibration.

19. The system of claim 16, wherein the tool is a wafer processing tool of a semiconductor fabrication facility.

20. A method of monitoring manufacturing equipment in a semiconductor fabrication facility, the method comprising:

operating a wafer processing tool at a non-normal operating mode by instructing a wafer processing chamber to operate at conditions that move a pressure control valve to a position outside of a normal operating range of the pressure control valve, wherein the position is in an insensitive pressure control region;

after the operating at the non-normal operating mode, operating the wafer processing tool at a normal operating mode;

measuring at least one control parameter of the wafer processing tool during the non-normal operating mode by measuring a changed position of the pressure control valve in the insensitive pressure control region; and

detecting a change to a condition of the wafer processing tool based on the measured changed position of the pressure control valve, wherein the condition comprises one of;

process gas temperature;

process gas dissociation level;

chamber wall condition and deposition;

outgassing;

pressure gage calibration;

chamber conductance; and

mass flow control (MFC) calibration,

wherein the operating a wafer processing tool occurs at least one of;

between processing steps of the wafer processing tool; and

while the wafer processing tool is in a manufacturing idle state.