Process monitoring apparatus and method for monitoring process

• US 8,010,228 B2
• Filed: 06/29/2007
• Issued: 08/30/2011
• Est. Priority Date: 10/31/2002
• Status: Active Grant

• Current Assignee: LG Electronics, Inc. (LG Corporation), Tokyo Electron Limited
• Original Assignee: Tokyo Electron Limited
• Inventors: Yuasa, Mitsuhiro
• Primary Examiner(s): Roman; Angel
• Application Number:
  US11/819,928
• Publication Number:
  US 20070254384A1
• Time in Patent Office: 1,523 Days
• Field of Search: 438/14, 738/661, 700/108, 700/112, 700/121, 700/123, 700/204
• US Class Current: 700/204
• CPC Class Codes: H01L 21/67253 Process monitoring, e.g. flow or thickness monitoring
• CPC Class Codes: H01L 22/32 Additional lead-in metallisation on a device or substrate, e.g. additional pads or pad portions, lines in the scribe line, sacrificed conductors arrangements for conducting electric current to or from the solid state body in operation H01L23/48
• CPC Class Codes: H01L 23/5223 Capacitor integral with wiring layers
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A sensor on a semiconductor wafer is used as a process monitor and a capacitor is employed as a power supply for the sensor. The capacitor can be formed by stacking a poly-silicon layer and a silicon nitride layer on the wafer. A timer can be used to specify an operation time or an operation timing, etc. Furthermore, unauthorized use is prevented by storing a keyword in an ROM of the process monitor.

Claims

1. A process monitoring apparatus for monitoring a semiconductor manufacturing process, comprising:

a container element having a housing unit;

a monitor element including a wafer and a plurality of sensors attached to the wafer, the monitor element being able to be transferred into target environments in a process facility or into the container element by a transfer robot; and

an electronics module attached to the container element, the electronics module being available for communication with the monitor element when the monitor element is transferred into the container element, unloaded from the transfer robot and stored in the housing unit, wherein the housing unit is a dedicated storage chamber for the monitor element and the electronics module is placed in the dedicated storage chamber.

2. A process monitoring apparatus according to claim 1, wherein the electronics module automatically communicates with the monitor element when the monitor element is transferred into the container element.

3. A process monitoring apparatus according to claim 1, wherein the electronics module comprises a charging unit charging a power supply of the monitor element.

4. A process monitoring apparatus according to claim 3, wherein power to the monitor element is fed using a contactless technique.

5. A process monitoring apparatus according to claim 4, wherein the contactless technique includes the use of wireless communication.

6. A process monitoring apparatus according to claim 1, wherein the electronics module comprises a reading unit reading data stored in a memory of the monitor element.

7. A process monitoring apparatus according to claim 6, wherein the data is read using a contactless technique.

8. A process monitoring apparatus according to claim 7, wherein the contactless technique includes the use of wireless communication or infrared rays.