Wireless IC device and manufacturing method thereof
First Claim
1. A wireless IC device comprising:
- a radiation plate;
a wireless IC chip; and
a substrate on which the wireless IC chip is mounted, the substrate being provided with a feed circuit, the feed circuit including at least one of a resonant circuit or a matching circuit, the at least one of the resonant circuit or the matching circuit including an inductance element, the feed circuit being electromagnetically coupled to the radiation plate;
whereinthe substrate is made of a resin material and includes a recess in a first main surface thereof;
the substrate is provided with a wiring electrode arranged along a bottom surface of the recess, the wiring electrode being electrically connected to the feed circuit;
the substrate is provided with a wedge member made of a different material from that of the resin material, the wedge member extending between the bottom surface of the recess and a second main surface of the substrate so as to be spaced apart from the wiring electrode;
the wireless IC chip is mounted in the recess and coupled to the wiring electrode.
1 Assignment
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Accused Products
Abstract
A wireless IC device includes a radiation plate, a wireless IC chip, and a substrate provided with a feed circuit that includes a resonant circuit and/or the matching circuit including an inductance element and that is electromagnetically coupled to the radiation plate. The substrate is made of a resin material. A recess is provided in a first main surface of the substrate. The substrate is provided with a wiring electrode arranged along a bottom surface and an inner circumferential surface of the recess and the first main surface of the substrate and electrically connected to the feed circuit, and a wedge member made of a different material from the resin material and extending between the bottom surface of the recess and a second main surface of the substrate spaced apart from the wiring electrode. The wireless IC chip is mounted in the recess and coupled to the wiring electrode.
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Citations
6 Claims
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1. A wireless IC device comprising:
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a radiation plate; a wireless IC chip; and a substrate on which the wireless IC chip is mounted, the substrate being provided with a feed circuit, the feed circuit including at least one of a resonant circuit or a matching circuit, the at least one of the resonant circuit or the matching circuit including an inductance element, the feed circuit being electromagnetically coupled to the radiation plate;
whereinthe substrate is made of a resin material and includes a recess in a first main surface thereof; the substrate is provided with a wiring electrode arranged along a bottom surface of the recess, the wiring electrode being electrically connected to the feed circuit; the substrate is provided with a wedge member made of a different material from that of the resin material, the wedge member extending between the bottom surface of the recess and a second main surface of the substrate so as to be spaced apart from the wiring electrode; the wireless IC chip is mounted in the recess and coupled to the wiring electrode. - View Dependent Claims (2, 3, 4, 5, 6)
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Specification