Pressure sensor

• US 8,012,360 B1
• Filed: 06/11/2008
• Issued: 09/06/2011
• Est. Priority Date: 11/22/2005
• Status: Expired due to Fees

• Current Assignee: Clayton B. Sippola
• Original Assignee: Clayton B. Sippola
• Inventors: Sippola, Clayton B.
• Primary Examiner(s): Norton; Nadine G
• Assistant Examiner(s): Angadi; Maki A
• Application Number:
  US12/137,496
• Time in Patent Office: 1,182 Days
• Field of Search: 737/15, 83/621, 361/283.4, 216/13
• US Class Current: 216/13
• CPC Class Codes: G01L 19/0645 using isolation membranes, specially adapted for protection
• CPC Class Codes: G01L 9/0042 Constructional details associated with semiconductive diaphragm sensors, e.g. etching, or constructional details of non-semiconductive diaphragms details about the integration or bonding of piezoresistor in or on the diaphragm G01L9/0052 and G01L9/0057 respectively
• CPC Class Codes: G01L 9/0052 of piezoresistive elements circuits therefor G01L9/06
• CPC Class Codes: G01L 9/0073 using a semiconductive diaphragm
• CPC Class Codes: Y10T 83/089 Responsive to tool characteristic

Abstract

A pressure sensor for measuring an external pressure fabricated upon a ceramic substrate penetrated by a via extending from the top to the bottom of the ceramic substrate is disclosed. A sacrificial layer is deposited on a portion of the top of the ceramic substrate in communication with a via. A diaphragm material is then deposited on the sacrificial layer, thereby creating a diaphragm surface. A sensor element for transducing a mechanical deflection into an electrical signal is applied to the diaphragm surface. When the sacrificial layer is removed, the diaphragm is able to deflect in response to the external pressure, which is sensed by the sensor element in order to measure the external pressure.

Claims

1. A method for producing a pressure sensor comprising the steps of:

(a) creating a via through a ceramic substrate, said via extending from a first aperture, defining a perimeter, on a top surface of said ceramic substrate to a second aperture on a bottom surface of said ceramic substrate;

(b) depositing a sacrificial layer on a portion of said top surface said ceramic substrate wherein said sacrificial layer covers said first aperture of said via;

(c) screen printing a diaphragm having an upper surface and side walls on said ceramic substrate wherein said diaphragm covers said sacrificial layer;

(d) depositing an upper sensor element on at least a portion of said upper surface of said diaphragm and extending to at least a portion of a second region of said top surface of said substrate;

(e) depositing a termination electrode on said second region of said substrate;

(f) introducing an etchant into said second aperture of said via; and

(g) etching said sacrificial layer with said etchant to release said upper surface of said diaphragm to allow said upper surface of said diaphragm to flex in response to an applied pressure differential across a portion of said diaphragm.

2. A method of claim 1, wherein said diaphragm is transparent and further comprising the step of:

(h) monitoring said etching of said sacrificial layer at said step (g) through said diaphragm.

3. A method of claim 1, whereby said upper sensor electrode is fabricated from a piezoresistive material.

4. A method of claim 1, wherein said etchant is a solution of potassium iodide.

5. A method of claim 4, whereby said etching is performed in an ultrasonic, heated bath.

6. A method of claim 1, further comprising the steps of:

(h) depositing a bottom sensor element on said top surface of said ceramic substrate below said sacrificial layer, within the extents of said first region and around a setback region defined from the perimeter of said first aperture; and

(i) depositing a bottom diaphragm on said bottom sensor element such that said bottom diaphragm is adapted to extend beyond the extents of said bottom sensor element and extend into said setback region.

7. A method of claim 1, further comprising the steps of

(h) depositing a first sealing layer on said bottom face of said ceramic substrate substantially covering said second aperture of said via to create a via fill feature within said second aperture and extending into said via;

(i) drying and firing said first sealing layer;

(j) depositing a second sealing layer on said bottom surface of said ceramic substrate substantially covering said first sealing layer; and

(k) drying and firing said second sealing layer.

8. A method of claim 1 whereby each said steps (b) (c) (d) and (e) further comprise the steps of:

i. depositing a screen-printing paste on a screen-print mesh, said screen-printing paste comprising the material to be deposited and screen print vehicles;

ii. printing said screen-printing paste through a mask formed in said screen-print mesh to form a desired feature geometry;

iii. drying said screen-printing paste to remove said screen print vehicles and create a green feature; and

iv. firing said green feature at an elevated temperature to create the feature.