Method for forming stackable semiconductor device packages including openings with conductive bumps of specified geometries
First Claim
1. A manufacturing method, comprising:
- providing a substrate including an upper surface and contact pads disposed adjacent to the upper surface of the substrate;
applying a first electrically conductive material to the upper surface of the substrate to form first conductive bumps disposed adjacent to respective ones of the contact pads;
applying a molding material to the upper surface of the substrate to form a molded structure covering the first conductive bumps, the molded structure including an upper surface, upper ends of the first conductive bumps being recessed below the upper surface of the molded structure;
forming openings adjacent to the upper surface of the molded structure, the openings exposing the upper ends of the first conductive bumps; and
applying, through the openings, a second electrically conductive material to the upper ends of the first conductive bumps;
wherein the openings define covered portions and uncovered portions of the first conductive bumps, at least one of the openings having a central depth and a peripheral depth, the central depth corresponding to a distance between the upper surface of the molded structure and an upper end of a respective one of the first conductive bumps, the peripheral depth corresponding to a distance between the upper surface of the molded structure and a boundary between a covered portion and an uncovered portion of the respective one of the first conductive bumps, the peripheral depth being greater than the central depth.
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Accused Products
Abstract
In one embodiment, a manufacturing method includes: (1) applying a first electrically conductive material to an upper surface of a substrate to form first conductive bumps; (2) electrically connecting a semiconductor device to the upper surface of the substrate; (3) applying a molding material to form a molded structure covering the first conductive bumps and the semiconductor device, upper ends of the first conductive bumps being recessed below an upper surface of the molded structure; (4) forming openings adjacent to the upper surface of the molded structure, the openings exposing the upper ends of the first conductive bumps; (5) applying, through the openings, a second electrically conductive material to form second conductive bumps; and (6) forming cutting slits extending through the molded structure and the substrate.
236 Citations
20 Claims
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1. A manufacturing method, comprising:
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providing a substrate including an upper surface and contact pads disposed adjacent to the upper surface of the substrate; applying a first electrically conductive material to the upper surface of the substrate to form first conductive bumps disposed adjacent to respective ones of the contact pads; applying a molding material to the upper surface of the substrate to form a molded structure covering the first conductive bumps, the molded structure including an upper surface, upper ends of the first conductive bumps being recessed below the upper surface of the molded structure; forming openings adjacent to the upper surface of the molded structure, the openings exposing the upper ends of the first conductive bumps; and applying, through the openings, a second electrically conductive material to the upper ends of the first conductive bumps; wherein the openings define covered portions and uncovered portions of the first conductive bumps, at least one of the openings having a central depth and a peripheral depth, the central depth corresponding to a distance between the upper surface of the molded structure and an upper end of a respective one of the first conductive bumps, the peripheral depth corresponding to a distance between the upper surface of the molded structure and a boundary between a covered portion and an uncovered portion of the respective one of the first conductive bumps, the peripheral depth being greater than the central depth. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A manufacturing method, comprising:
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providing a first semiconductor device package including a substrate unit including an upper surface, first connecting elements extending upwardly from the upper surface of the substrate unit, at least one of the first connecting elements having a width WC, a semiconductor device disposed adjacent to the upper surface of the substrate unit and electrically connected to the substrate unit, and a package body disposed adjacent to the upper surface of the substrate unit and covering the semiconductor device, the package body including an upper surface and defining openings disposed adjacent to the upper surface of the package body, upper ends of the first connecting elements being recessed below the upper surface of the package body, the openings at least partially exposing respective ones of the first connecting elements; providing a second semiconductor device package including a lower surface and second connecting elements extending downwardly from the lower surface of the second semiconductor device package; positioning the second semiconductor device package with respect to the first semiconductor device package, such that the second connecting elements are adjacent to respective ones of the first connecting elements; and merging respective pairs of the first connecting elements and the second connecting elements to form stacking elements extending through respective ones of the openings of the package body and electrically connecting the first semiconductor device package and the second semiconductor device package; wherein at least one of the stacking elements has a first width corresponding to a maximum width of the at least one of the stacking elements; and wherein the opening corresponding to the at least one of the stacking elements has a second width adjacent to the upper surface of the package body, the second width being greater than the first width. - View Dependent Claims (10, 11, 12, 13, 14, 15, 16, 17)
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18. A manufacturing method, comprising:
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providing a substrate including an upper surface and contact pads disposed adjacent to the upper surface of the substrate; forming first conductive bumps disposed adjacent to respective ones of the contact pads; forming a molded structure covering the first conductive bumps, the molded structure including an upper surface, upper ends of the first conductive bumps disposed below the upper surface of the molded structure; forming openings adjacent to the upper surface of the molded structure, the openings exposing the upper ends of the first conductive bumps; and applying an electrically conductive material to the upper ends of the first conductive bumps to form second conductive bumps, upper ends of the second conductive bumps disposed below the upper surface of the molded structure wherein at least one of the bumps has a first width corresponding to a maximum width of the at least one of the bumps; and
wherein the opening corresponding to the at least one of the bumps has a second width adjacent to the upper surface of the molding, the second width being greater than the first width. - View Dependent Claims (19, 20)
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Specification