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Optical bonding composition for LED light source

  • US 8,013,345 B2
  • Filed: 11/07/2007
  • Issued: 09/06/2011
  • Est. Priority Date: 11/20/2006
  • Status: Active Grant
First Claim
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1. An LED light source comprising:

  • an LED die;

    an optical element optically coupled to the LED die; and

    a bonding layer comprising an amorphous organopolysiloxane network, the organopolysiloxane network comprising a silsesquioxane portion derived from
    (R1SiO1.5)n and a portion derived from D-units, the D-units having the formula (R2)2Si(OR3)2 wherein R1, R2 and R3 are organic groupsand n is an integer of at least 10;

    the bonding layer bonding the LED die and the optical element together.

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