Optical bonding composition for LED light source
First Claim
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1. An LED light source comprising:
- an LED die;
an optical element optically coupled to the LED die; and
a bonding layer comprising an amorphous organopolysiloxane network, the organopolysiloxane network comprising a silsesquioxane portion derived from
(R1SiO1.5)n and a portion derived from D-units, the D-units having the formula (R2)2Si(OR3)2 wherein R1, R2 and R3 are organic groupsand n is an integer of at least 10;
the bonding layer bonding the LED die and the optical element together.
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Abstract
An optical bonding composition and LED light source comprising the composition are disclosed, as well as a method of making the LED light source. The LED light source may comprise: an LED die; an optical element optically coupled to the LED die; and a bonding layer comprising an amorphous organopolysiloxane network, the organopolysiloxane network comprising a silsesquioxane portion derived from (R1SiO1.5)n wherein R1 is an organic group and n is an integer of at least 10; the bonding layer bonding the LED die and the optical element together. Efficiency of the LED light source may be increased when using an optical extractor as the optical element.
60 Citations
30 Claims
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1. An LED light source comprising:
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an LED die; an optical element optically coupled to the LED die; and a bonding layer comprising an amorphous organopolysiloxane network, the organopolysiloxane network comprising a silsesquioxane portion derived from
(R1SiO1.5)nand a portion derived from D-units, the D-units having the formula (R2)2Si(OR3)2 wherein R1, R2 and R3 are organic groups and n is an integer of at least 10; the bonding layer bonding the LED die and the optical element together. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26)
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27. A method of making an LED light source, the method comprising:
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a) providing an LED die; b) providing an optical element; c) providing an optical bonding composition comprising a silsesquioxane having the formula (R1SiO1.5)n(OR4)n+2 and a dialkoxysilane having the formula (R2)2Si(OR3)2, wherein R1 to R4 are organic groups and n is an integer of at least 5; and d) bonding the LED die and the optical element together by contacting the LED die and the optical element with the optical bonding composition. - View Dependent Claims (28, 29, 30)
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Specification