Light transmissive cover, device provided with same and methods for manufacturing them

• US 8,017,443 B2
• Filed: 01/03/2006
• Issued: 09/13/2011
• Est. Priority Date: 10/22/2003
• Status: Expired due to Fees

• Current Assignee: Shinko Electric Industries Company Limited (Fujitsu Limited)
• Original Assignee: Shinko Electric Industries Company Limited (Fujitsu Limited)
• Inventors: Shiraishi, Akinori
• Primary Examiner(s): Nguyen; Ha Tran T
• Assistant Examiner(s): Chi; Suberr
• Application Number:
  US11/324,720
• Publication Number:
  US 20060113649A1
• Time in Patent Office: 2,079 Days
• Field of Search: 257/434, 257/704, 257/794, 438/69, 438/22, 438/26, 438/29, 438/33, 438/48, 438/28, 438/107, 438/110, 438/113, 438/116, 438/118
• US Class Current: 438/116
• CPC Class Codes: B81B 7/0067 for controlling the passage of optical signals through the package
• CPC Class Codes: B81C 2203/0118 Bonding a wafer on the substrate, i.e. where the cap consists of another wafer
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48464 the other connecting portion not on the bonding area also being a ball bond, i.e. ball-to-ball
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/16235 Connecting to a semiconductor or solid-state bodies, i.e. cap-to-chip

Abstract

A light transmissive cover for a device comprising: a cover member of light transmissive material; and a junction member joined to the cover member, the junction member being a member used to be joined to the body of the device and having a light interrupting film on the inner surface thereof. A device provided with a light transmissive cover, the device being provided with a cover member of light transmissive material joined to the body of device via a junction member so as to cover at least a part of the device, and having a light interrupting film on the inner surface of the junction member is also disclosed. In addition, methods for manufacturing them disclosed.

Claims

1. A method of manufacturing a light transmissive cover for a device, comprising:

patterning a junction member material sheet to facilitate subsequent cutting to form a plurality of chips, wherein each chip comprises an individual light transmissive cover disposed adjacent to inner walls in the junction member material sheet, wherein the inner walls and the individual light transmissive cover form a device engaging aperture;

joining the patterned junction member material sheet to a joining side of a light transmissive material sheet, such that each device engaging aperture formed in the junction member material sheet is covered with the light transmissive material sheet;

forming dicing grooves in the junction member material sheet, after joining the patterned junction member material sheet to the light transmissive material sheet, between adjacent device engaging apertures and across an entire thickness of the junction member material sheet, such that each dicing groove exposes at its joining side aperture a surface of the joining side of the light transmissive material sheet;

forming a light interrupting film on inner surfaces of the device engaging apertures of the junction member material sheet; and

cutting, along the dicing grooves, the junction member material sheet and the light transmissive material sheet to form individual light transmissive covers.

2. A method according to claim 1, wherein said light transmissive material sheet is a glass sheet.

3. A method according to claim 1, wherein said junction member material sheet is a silicon wafer.

4. A method according to claim 3, wherein said light interrupting film is formed by dry etching of said silicon wafer.

5. The method according to claim 1, wherein the junction member material sheet is joined to the light transmissive material sheet by anodic bonding.