LED chip package structure with high-efficiency light emission by rough surfaces and method of making the same

• US 8,017,969 B2
• Filed: 09/25/2008
• Issued: 09/13/2011
• Est. Priority Date: 12/12/2007
• Status: Active Grant

• Current Assignee: Harvatek Corporation
• Original Assignee: Harvatek Corporation
• Inventors: Wu, Shih-Yu, Wang, Bily, Wu, Wen-Kuei
• Primary Examiner(s): Lee; Eugene
• Assistant Examiner(s): Ho; Anthony
• Application Number:
  US12/232,835
• Publication Number:
  US 20090152570A1
• Time in Patent Office: 1,083 Days
• Field of Search: 257/81, 257/88, 257/92, 257/99, 257/100, 257/E33.056, 257/E33.062
• US Class Current: 257/99
• CPC Class Codes: F21K 9/90 Methods of manufacture
• CPC Class Codes: F21Y 2103/10 comprising a linear array of point-like light-generating elements
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: G02B 6/0031 Reflecting element, sheet or layer
• CPC Class Codes: G02B 6/0073 Light emitting diode [LED]
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/15747 Copper [Cu] as principal constituent
• CPC Class Codes: H01L 2924/15787 Ceramics, e.g. crystalline carbides, nitrides or oxides
• CPC Class Codes: H01L 2933/0091 Scattering means in or on the semiconductor body or semiconductor body package H01L33/22 takes precedence
• CPC Class Codes: H01L 33/54 having a particular shape

Abstract

An LED chip package structure with high-efficiency light emission by rough surfaces includes a substrate unit, a light-emitting unit, and a package colloid unit. The substrate unit has a substrate body, and a positive electrode trace and a negative electrode trace respectively formed on the substrate body. The light-emitting unit has a plurality of LED chips arranged on the substrate body. Each LED chip has a positive electrode side and a negative electrode side respectively and electrically connected with the positive electrode trace and the negative electrode trace of the substrate unit. The package colloid unit has a plurality of package colloids respectively covering the LED chips. Each package colloid has a cambered colloid surface and a light-emitting colloid surface respectively formed on its top surface and a lateral surface thereof.

Claims

1. An LED chip package structure, comprising:

a substrate unit having an opaque substrate body, and a positive electrode trace and a negative electrode trace respectively formed on the opaque substrate body, wherein the opaque substrate body has a cutting surface formed on a lateral side thereof;

a light-emitting unit having a plurality of LED chips arranged on the opaque substrate body, wherein each LED chip has a positive electrode side and a negative electrode side respectively and electrically connected with the positive electrode trace and the negative electrode trace of the substrate unit; and

a package colloid unit having a plurality of half package colloids for respectively covering the LED chips, wherein each half package colloid has a half cambered colloid surface and a rough light-emitting colloid surface respectively formed on a top surface and a lateral surface thereof, the half cambered colloid surface is extended upwardly and forwardly from a top surface of the opaque substrate body and the rough light-emitting colloid surface is extended downwardly from a top end of the half cambered colloid surface to the top surface of the opaque substrate body, and each rough light-emitting colloid surface is substantially flush with the cutting surface of the opaque substrate.

2. The LED chip package structure as claimed in claim 1, wherein the opaque substrate body has a metal layer and a Bakelite layer formed on the metal layer, and both the positive electrode trace and the negative electrode trace are aluminum circuits or silver circuits.

3. The LED chip package structure as claimed in claim 1, wherein the positive electrode side and the negative electrode side of each LED chip are respectively and electrically connected with the positive electrode trace and the negative electrode trace of the substrate unit via two corresponding leading wires.

4. The LED chip package structure as claimed in claim 1, wherein the positive electrode side and the negative electrode side of each LED chip are respectively and electrically connected with the positive electrode trace and the negative electrode trace of the substrate unit via a plurality of corresponding solder balls.

5. The LED chip package structure as claimed in claim 1, wherein the LED chips are arranged on the opaque substrate body of the substrate unit along a straight line.

6. The LED chip package structure as claimed in claim 1, wherein the LED chips are arranged on the opaque substrate body of the substrate unit along a plurality of straight lines.

7. The LED chip package structure as claimed in claim 1, wherein each half package colloid is a fluorescent resin that is formed by mixing silicone with fluorescent powders.

8. The LED chip package structure as claimed in claim 1, wherein each half package colloid is a fluorescent resin that is formed by mixing epoxy with fluorescent powders.

9. The LED chip package structure as claimed in claim 1, further comprising a frame unit having an opaque frame layer formed on the opaque substrate body to cover one part of each half package colloid, wherein only the rough light-emitting colloid surface of each half package colloid is exposed, and the half cambered colloid surface and other outer surfaces of each half package colloid are covered by the opaque frame layer.

10. The LED chip package structure as claimed in claim 9, wherein one part of light beams generated by the LED chips are directly projected outside from the rough light-emitting colloid surface of each half package colloid and the other light beams generated by the LED chips are reflected by an inner surface of the opaque frame layer and then projected outside from the rough light-emitting colloid surface of each half package colloid.

11. The LED chip package structure as claimed in claim 1, further comprising a frame unit having a plurality of opaque frame bodies formed on the opaque substrate body to respectively cover the half package colloids, wherein the opaque frame bodies are separated from each other, and only the rough light-emitting colloid surface of each half package colloid is exposed, and each half cambered colloid surface and other outer surfaces of each half package colloid are covered by the opaque frame bodies.

12. The LED chip package structure as claimed in claim 11, wherein one part of light beams generated by the LED chips are directly projected outside from the rough light-emitting colloid surfaces of the half package colloids and the other light beams generated by the LED chips are reflected by inner surfaces of the opaque frame bodies and then projected outside from the rough light-emitting colloid surfaces of the half package colloids.