Wafer and manufacturing method of electronic component
First Claim
1. A wafer comprising:
- a chip area; and
an outside area of said chip area, whereinsaid chip area includes a plurality of chips arranged therein,each of said plurality of chips includes one or more elements, electrode films, and lead-out conductive films,each of said one or more elements is connected to said electrode films through said lead-out conductive films within each of said plurality of chips,only said outside area includes at least one evaluation element, andsaid lead-out conductive films extend to said outside area and are connected to said at least one evaluation element said one or more elements and said electrode films are located in said chip area, without being located outside said chip area, andSaid at least one evaluation element is electrically connected to one of said electrode films such that said at least one evaluation element is capable of providing evaluation characteristics via said one of said electrode films.
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Abstract
The present invention relates to a wafer formed with an evaluation element and capable of improving productivity and a manufacturing method of an electronic component using the same. In a wafer according to the present invention, a plurality of elements connected to electrode films through lead-out conductive films are arranged and a chip area is defined for cutting out the plurality of elements in a given number. In the wafer, at least one evaluation element is formed in an area outside the chip area. The lead-out conductive films extend to the outside area and are connected to the evaluation elements. With this wafer, since the lead-out conductor is shared between the element and the evaluation element, the electrode film connected therewith can be shared, too. Accordingly, evaluation can be performed by using the evaluation element without the need of providing the wafer with a lead-out conductor and an electrode film exclusively for the evaluation element, so that the chip area to be cut out from the wafer can be made larger than before.
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Citations
30 Claims
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1. A wafer comprising:
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a chip area; and an outside area of said chip area, wherein said chip area includes a plurality of chips arranged therein, each of said plurality of chips includes one or more elements, electrode films, and lead-out conductive films, each of said one or more elements is connected to said electrode films through said lead-out conductive films within each of said plurality of chips, only said outside area includes at least one evaluation element, and said lead-out conductive films extend to said outside area and are connected to said at least one evaluation element said one or more elements and said electrode films are located in said chip area, without being located outside said chip area, and Said at least one evaluation element is electrically connected to one of said electrode films such that said at least one evaluation element is capable of providing evaluation characteristics via said one of said electrode films. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15)
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16. A manufacturing method of an electronic component using a wafer having a chip area and an outside area of said chip area, wherein
said chip area includes a plurality of chips arranged therein, each of said plurality of chips includes one or more elements, electrode films, and lead-out conductive films, each of said one or more elements is connected to said electrode films through said lead-out conductive films within each of said plurality of chips, only said outside area includes at least one evaluation element, said lead-out conductive films extend to said outside area and are connected to said at least one evaluation element said one or more elements and said electrode films are located in said chip area, without being located outside said chip area, the method comprising the steps of: -
evaluating characteristics of said at least one evaluation element via said electrode films; cutting out said chip area from said wafer to remove said outside area; and dicing said chip area to obtain each of said plurality of chips as an electronic component. - View Dependent Claims (17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30)
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Specification