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Wafer and manufacturing method of electronic component

  • US 8,021,712 B2
  • Filed: 03/18/2009
  • Issued: 09/20/2011
  • Est. Priority Date: 03/18/2009
  • Status: Expired due to Fees
First Claim
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1. A wafer comprising:

  • a chip area; and

    an outside area of said chip area, whereinsaid chip area includes a plurality of chips arranged therein,each of said plurality of chips includes one or more elements, electrode films, and lead-out conductive films,each of said one or more elements is connected to said electrode films through said lead-out conductive films within each of said plurality of chips,only said outside area includes at least one evaluation element, andsaid lead-out conductive films extend to said outside area and are connected to said at least one evaluation element said one or more elements and said electrode films are located in said chip area, without being located outside said chip area, andSaid at least one evaluation element is electrically connected to one of said electrode films such that said at least one evaluation element is capable of providing evaluation characteristics via said one of said electrode films.

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