Semiconductor device with a wiring board having an angled linear part

• US 8,022,305 B2
• Filed: 04/23/2009
• Issued: 09/20/2011
• Est. Priority Date: 05/19/2008
• Status: Expired due to Fees

• Current Assignee: Panasonic Corporation (Panasonic Holdings Corporation)
• Original Assignee: Panasonic Corporation (Panasonic Holdings Corporation)
• Inventors: Saiki, Atsushi, Yui, Takashi
• Primary Examiner(s): Prasad; Chandrika
• Application Number:
  US12/428,860
• Publication Number:
  US 20090284942A1
• Time in Patent Office: 880 Days
• Field of Search: 174250-262, 257/620, 257787-792, 361/704
• US Class Current: 174/250
• CPC Class Codes: H05K 2201/09063 Holes or slots in insulating substrate not used for electrical connections
• CPC Class Codes: H05K 2201/0909 Preformed cutting or breaking line
• CPC Class Codes: H05K 2203/167 Using mechanical means for positioning, alignment or registration, e.g. using rod-in-hole alignment
• CPC Class Codes: H05K 3/005 Punching of holes
• CPC Class Codes: H05K 3/0052 Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
• CPC Class Codes: Y10T 29/4913 Assembling to base an electrical component, e.g., capacitor, etc.

Abstract

A semiconductor device fabrication method includes: forming an elongated hole 5 in a wiring board plate along a perimeter line 3 of a plurality of wiring board regions defined over the wiring board plate with a connecting portion left unremoved at a corner of each of the wiring board regions; mounting semiconductor elements on the wiring board regions; and cutting the connecting portion using a punch 8 to isolate the wiring board regions from the wiring board plate into wiring boards. Each of the wiring boards has a cut edge formed by the punch, the cut edge starting from an end of the elongated hole 5 provided on a first side of the perimeter line 3 and extending across part of the connecting portion inside the perimeter line 3, the cut edge being angled inward of the wiring board so as to slope downward from the end of the elongated hole 5.

Claims

1. A semiconductor device, comprising:

a wiring board; and

a semiconductor element mounted on the wiring board,

wherein at least one side of the wiring board is formed by a first linear part extending toward a corner of the wiring board and a second linear part angled inward of the wiring board so as to slope downward from the first linear part to the corner of the wiring board.

2. The semiconductor device of claim 1, wherein

the corner of the wiring board has a curved part recessed inside the wiring board, and

at least one side of the wiring board is formed by the first linear part, the second linear part, and the curved part.

3. The semiconductor device of claim 1, wherein an angle θ

of the second linear part relative to the first linear part is in the range of 0°

<

θ

≦

5°

.

4. The semiconductor device of claim 1, wherein

the wiring board is formed by a base material molded with a resin, the base material being woven of warp and weft fibers, and

the second linear part extends in a direction not parallel to the fibers of the base material.