Semiconductor device packages with electromagnetic interference shielding

• US 8,022,511 B2
• Filed: 12/16/2008
• Issued: 09/20/2011
• Est. Priority Date: 02/05/2008
• Status: Active Grant

• Current Assignee: Advanced Semiconductor Engineering Inc (ASE Technology Holding Co., Ltd.)
• Original Assignee: Advanced Semiconductor Engineering Inc (ASE Technology Holding Co., Ltd.)
• Inventors: Huang, Jui-Cheng, Chiu, Chi-Tsung, Hung, Chih-Pin
• Primary Examiner(s): Smith; Zandra
• Assistant Examiner(s): Patton; Paul E
• Application Number:
  US12/336,407
• Publication Number:
  US 20090194852A1
• Time in Patent Office: 1,008 Days
• Field of Search: 257/659, 257/E23.114, 438/121
• US Class Current: 257/659
• CPC Class Codes: H01L 21/568 Temporary substrate used as encapsulation process aid H01L21/4832 and H01L21/566 take precedence
• CPC Class Codes: H01L 21/6835 using temporarily an auxiliary support
• CPC Class Codes: H01L 2221/68331 of passive members, e.g. die mounting substrate
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/49175 Parallel arrangements
• CPC Class Codes: H01L 2224/81 using a bump connector
• CPC Class Codes: H01L 2224/85 using a wire connector
• CPC Class Codes: H01L 2224/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 23/3128 the substrate having spherical bumps for external connection
• CPC Class Codes: H01L 23/49805 the leads being also applied on the sidewalls or the bottom of the substrate, e.g. leadless packages for surface mounting
• CPC Class Codes: H01L 23/552 Protection against radiation, e.g. light or electromagnetic waves
• CPC Class Codes: H01L 24/16 of an individual bump connector
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/49 of a plurality of wire connectors
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 : Boron [B]
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01024 : Chromium [Cr]
• CPC Class Codes: H01L 2924/01027 : Cobalt [Co]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/0103 : Zinc [Zn]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/01049 : Indium [In]
• CPC Class Codes: H01L 2924/01051 : Antimony [Sb]
• CPC Class Codes: H01L 2924/01075 : Rhenium [Re]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/15311 : being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/16152 : Cap comprising a cavity for hosting the device, e.g. U-shaped cap
• CPC Class Codes: H01L 2924/166 : Material
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/19041 : being a capacitor
• CPC Class Codes: H01L 2924/19042 : being an inductor
• CPC Class Codes: H01L 2924/19043 : being a resistor
• CPC Class Codes: H01L 2924/19105 : in a side-by-side arrangement on a common die mounting substrate
• CPC Class Codes: H01L 2924/207 : Diameter ranges
• CPC Class Codes: H01L 2924/3025 : Electromagnetic shielding

Abstract

Described herein are semiconductor device packages with EMI shielding and related methods. In one embodiment, a semiconductor device package includes: (1) a substrate unit; (2) a grounding element disposed adjacent to a periphery of the substrate unit and extending upwardly from an upper surface of the substrate unit; (3) a semiconductor device disposed adjacent to the upper surface; (4) a package body disposed adjacent to the upper surface and covering the semiconductor device and the grounding element; and (5) an EMI shield disposed adjacent to exterior surfaces of the package body and electrically connected to a lateral surface of the grounding element. A lateral surface of the package body is substantially aligned with a lateral surface of the substrate unit. The grounding element corresponds to a remnant of a conductive bump, and provides an electrical pathway to ground electromagnetic emissions incident upon the EMI shield.

Claims

1. A semiconductor device package, comprising:

a substrate unit including an upper surface, a lower surface, and a lateral surface disposed adjacent to a periphery of the substrate unit;

a grounding element disposed adjacent to the periphery of the substrate unit and extending upwardly from the upper surface of the substrate unit, the grounding element corresponding to a remnant of a conductive bump and including a lateral surface;

a semiconductor device disposed adjacent to the upper surface of the substrate unit and electrically connected to the substrate unit;

a package body disposed adjacent to the upper surface of the substrate unit and covering the semiconductor device and the grounding element, such that the lateral surface of the grounding element is electrically exposed, the package body including exterior surfaces that include a lateral surface, the lateral surface of the package body being substantially aligned with the lateral surface of the substrate unit; and

an electromagnetic interference shield disposed adjacent to the exterior surfaces of the package body and electrically connected to the lateral surface of the grounding element,

wherein the grounding element provides an electrical pathway to ground electromagnetic emissions incident upon the electromagnetic interference shield.

2. The semiconductor device package of claim 1, wherein the lateral surface of the grounding element is substantially aligned with the lateral surface of the substrate unit.

3. The semiconductor device package of claim 1, wherein the lateral surface of the grounding element is substantially planar and has a substantially orthogonal orientation with respect to the upper surface of the substrate unit.

4. The semiconductor device package of claim 1, wherein the electromagnetic interference shield includes a lateral portion that extends along the lateral surface of the substrate unit.

5. The semiconductor device package of claim 4, wherein a lower end of the lateral portion is substantially co-planar with the lower surface of the substrate unit.

6. The semiconductor device package of claim 5, wherein a height of the grounding element is in the range of 200 μ

m to 600 μ

m, and a width of the grounding element is in the range of 100 μ

m to 300 μ

m.

7. The semiconductor device package of claim 5, wherein a height of the grounding element is in the range of 400 μ

m to 1,200 μ

m, and a width of the grounding element is in the range of 200 μ

m to 600 μ

m.

8. A semiconductor device package, comprising:

a substrate unit including a first surface, a second opposing surface, and a grounding pad disposed adjacent to the first surface;

a grounding element extending upwardly from the grounding pad and electrically connected to the grounding pad, the grounding element including a connection surface disposed adjacent to a periphery of the substrate unit;

a semiconductor device disposed adjacent to the first surface of the substrate unit and electrically connected to the substrate unit;

a package body disposed adjacent to the first surface of the substrate unit and covering the semiconductor device and the grounding element, such that the connection surface of the grounding element is electrically exposed, the package body including exterior surfaces; and

an electromagnetic interference shield disposed adjacent to the exterior surfaces of the package body and electrically connected to the connection surface of the grounding element,

wherein the grounding element provides an electrical pathway to ground electromagnetic emissions incident upon the electromagnetic interference shield.

9. The semiconductor device package of claim 8, wherein a lateral profile of the semiconductor device package is substantially planar and is substantially orthogonal with respect to the first surface of the substrate unit.

10. The semiconductor device package of claim 8, wherein the grounding element includes at least one of a solder and an electrically conductive adhesive.

11. The semiconductor device package of claim 8, wherein the grounding pad corresponds to a remnant of a contact pad, and the grounding element corresponds to a remnant of a conductive bump.

12. The semiconductor device package of claim 10, wherein an area of the connection surface is in the range of 0.03 mm² to 0.3 mm².

13. The semiconductor device package of claim 10, wherein an area of the connection surface is in the range of 0.1 mm² to 1.1 mm².

14. The semiconductor device package of claim 8, wherein the substrate unit further includes a lateral surface extending between the first surface and the second opposing surface, and the connection surface of the grounding element is substantially co-planar aligned with the lateral surface of the substrate unit.

15. The semiconductor device package of claim 14, wherein the exterior surfaces of the package body include a lateral surface, and the lateral surface of the package body is substantially co-planar with the lateral surface of the substrate unit.

16. The semiconductor device package of claim 10, wherein the electromagnetic interference shield is a conformal shield that includes at least one of aluminum, copper, chromium, tin, gold, silver, stainless steel, and nickel.

17. The semiconductor device package of claim 10, wherein the electromagnetic interference shield includes a first layer and a second layer disposed adjacent to the first layer.

18. The semiconductor device package of claim 17, wherein the first layer and the second layer include different electrically conductive materials.

19. The semiconductor device package of claim 10, wherein a thickness of the electromagnetic interference shield is in the range of 1 μ

m to 50 μ

m.

20. A semiconductor device package, comprising:

a substrate unit including an upper surface, a lower surface, and a lateral surface disposed adjacent to a periphery of the substrate unit;

a conductive bump disposed adjacent to the periphery of the substrate unit and extending upwardly from the upper surface of the substrate unit, the conductive bump including a lateral surface;

a semiconductor device disposed adjacent to the upper surface of the substrate unit and electrically connected to the substrate unit;

a package body disposed adjacent to the upper surface of the substrate unit and covering the semiconductor device and the conductive bump, the package body including exterior surfaces that include a lateral surface, the lateral surface of the package body being substantially co-planar with the lateral surface of the conductive bump; and

a conformal shield disposed adjacent to the exterior surfaces of the package body and electrically connected to the lateral surface of the conductive bump.

21. The semiconductor device package of claim 20, wherein the lateral surface of the conductive bump is substantially co-planar with the lateral surface of the substrate unit.