Edge connect wafer level stacking

• US 8,022,527 B2
• Filed: 10/20/2010
• Issued: 09/20/2011
• Est. Priority Date: 10/10/2006
• Status: Active Grant

• Current Assignee: Tessera, Inc. (Adeia Inc.)
• Original Assignee: Tessera, Inc. (Adeia Inc.)
• Inventors: Haba, Belgacem, Oganesian, Vage
• Primary Examiner(s): Wagner; Jenny L.
• Application Number:
  US12/908,265
• Publication Number:
  US 20110031629A1
• Time in Patent Office: 335 Days
• Field of Search: 257/686, 257/E23.085
• US Class Current: 257/686
• CPC Class Codes: H01L 21/78 with subsequent division of the substrate into plural individual devices cutting to change the surface-physical characteristics or shape of semiconductor bodies H01L21/304
• CPC Class Codes: H01L 2224/24145 the bodies being stacked
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48145 the bodies being stacked
• CPC Class Codes: H01L 2225/06506 Wire or wire-like electrical connections between devices
• CPC Class Codes: H01L 2225/0651 Wire or wire-like electrical connections from device to substrate
• CPC Class Codes: H01L 2225/06517 Bump or bump-like direct electrical connections from device to substrate
• CPC Class Codes: H01L 2225/06524 Electrical connections formed on device or on substrate, e.g. a deposited or grown layer
• CPC Class Codes: H01L 2225/06541 Conductive via connections through the device, e.g. vertical interconnects, through silicon via [TSV]
• CPC Class Codes: H01L 2225/06551 Conductive connections on the side of the device
• CPC Class Codes: H01L 2225/06568 the devices decreasing in size, e.g. pyramidical stack
• CPC Class Codes: H01L 2225/06582 Housing for the assembly, e.g. chip scale package [CSP]
• CPC Class Codes: H01L 23/5382 Adaptable interconnections, e.g. for engineering changes
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 25/0657 Stacked arrangements of devices
• CPC Class Codes: H01L 25/50 Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00 H01L21/50 takes precedence
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01004 : Beryllium [Be]
• CPC Class Codes: H01L 2924/01057 : Lanthanum [La]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/15311 : being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/207 : Diameter ranges

Abstract

In accordance with an aspect of the invention, a stacked microelectronic package is provided which may include a plurality of subassemblies, e.g., a first subassembly and a second subassembly underlying the first subassembly. A front face of the second subassembly may confront the rear face of the first subassembly. Each of the first and second subassemblies may include a plurality of front contacts exposed at the front face, at least one edge and a plurality of front traces extending about the respective at least one edge. The second subassembly may have a plurality of rear contacts exposed at the rear face. The second subassembly may also have a plurality of rear traces extending from the rear contacts about the at least one edge. The rear traces may extend to at least some of the plurality of front contacts of at least one of the first or second subassemblies.

Claims

1. A stacked microelectronic package comprising:

a plurality of subassemblies including a first subassembly and a second subassembly underlying the first subassembly, each subassembly having a front face and a rear face remote from the front face, each of the first and second subassemblies including a plurality of front contacts exposed at the front face, at least one edge and a plurality of front traces extending about the respective at least one edge, the second subassembly having a plurality of rear contacts exposed at the rear face and a plurality of rear traces extending from the rear contacts about the at least one edge to at least some of the plurality of front contacts of at least one of the first or second subassemblies, and a substrate underlying the second subassembly, the substrate having a relief channel aligned with the at least one edge of each subassembly.

2. The stacked microelectronic package as claimed in claim 1, further comprising a polymer material disposed in the relief channel, wherein at least one of the rear traces or the front traces overlie at least portions of the polymer material.

3. The stacked microelectronic package as claimed in claim 1, wherein each of the plurality of subassemblies includes at least one microelectronic chip.

4. An assembly including the stacked microelectronic package as claimed in claim 3, further comprising a circuit panel having terminals conductively connected to at least some package contacts selected from the group consisting of the rear contacts of the second subassembly and front contacts of one subassembly of the plurality of subassemblies.

5. An assembly as claimed in claim 1, further comprising an additional microelectronic chip joined to the stacked microelectronic package such that a face of the additional microelectronic chip confronts a face of one of the first and second subassemblies.

6. An assembly as claimed in claim 5, wherein contacts of the additional microelectronic chip are wire-bonded to the front contacts of the one subassembly.

7. An assembly as claimed in claim 6, further comprising conductive masses joining the contacts of the additional microelectronic chip to the front contacts of the one subassembly.

8. An assembly as claimed in claim 5, wherein the additional microelectronic chip includes a microcontroller.

9. An assembly as claimed in claim 5, wherein at least one of the microelectronic chips in the plurality of subassemblies is replaceable by the additional microelectronic chip by disconnecting the at least one microelectronic chip from ones of the front contacts of the one subassembly and connecting the additional microelectronic chip to the ones of the front contacts.

10. An assembly as claimed in claim 5, further comprising bond wires, the bond wires conductively connecting the front contacts of the one subassembly to the terminals of the circuit panel.

11. An assembly as claimed in claim 10, further comprising conductive masses joining the contacts of the additional microelectronic chip to the front contacts of the one subassembly.

12. An assembly as claimed in claim 5, further comprising bond wires, the bond wires conductively connecting contacts of the additional microelectronic chip to the terminals of the circuit panel.

13. An assembly as claimed in claim 1, further comprising conductive masses joining the terminals of the circuit panel to the exposed front contacts of the one subassembly.

14. An assembly as claimed in claim 13, further comprising an additional microelectronic chip joined to the rear face of the second subassembly, the additional microelectronic chip having contacts conductively connected to terminals of the circuit panel.

15. An assembly as claimed in claim 14, further comprising bond wires, the bond wires joining the contacts of the additional microelectronic chip to the terminals of the circuit panel.

16. An assembly as claimed in claim 1, further comprising conductive masses joining the terminals of the circuit panel to the rear contacts of the second subassembly.

17. An assembly as claimed in claim 16, further comprising an additional microelectronic chip having contacts in conductive communication with the front contacts of the one subassembly.