Optical bonding composition for LED light source

• US 8,026,115 B2
• Filed: 11/15/2007
• Issued: 09/27/2011
• Est. Priority Date: 11/17/2006
• Status: Expired due to Fees

• Current Assignee: 3M Innovative Properties Company (3M Company)
• Original Assignee: 3M Innovative Properties Company (3M Company)
• Inventors: Barnes, Amy S., Thompson, D. Scott, Kolb, Brant U., Ballen, Todd A., Rolf, Jacqueline C., Brott, Robert L.
• Primary Examiner(s): Gulakowski, Randy
• Assistant Examiner(s): LOEWE, ROBERT S
• Application Number:
  US12/514,630
• Publication Number:
  US 20100059776A1
• Time in Patent Office: 1,412 Days
• Field of Search: 438/26, 438/29, 106/287.16
• US Class Current: 438/26
• CPC Class Codes: B82Y 20/00 Nanooptics, e.g. quantum optics or photonic crystals
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 33/58 Optical field-shaping elements

Abstract

Disclosed herein is an optical bonding composition that may be used in optical applications. An LED light source that utilizes the composition is also disclosed, as well as a method of making it. The LED light source may comprise: an LED die; an optical element optically coupled to the LED die; and a bonding layer comprising surface-modified metal oxide nanoparticles in an amorphous silicate network, the bonding layer bonding the LED die and the optical element together. Efficiency of the LED light source may be increased when using an optical extractor as the optical element.

Claims

1. An LED light source comprising:

an LED die;

an optical element optically coupled to the LED die; and

a bonding layer comprising surface-modified metal oxide nanoparticles in an amorphous silicate network, the bonding layer bonding the LED die and the optical element together;

wherein the surface-modified nanoparticles are selected from the group consisting of silicon oxide, aluminum oxide, zirconium oxide, titanium oxide, zinc oxide, tantalum oxide, niobium oxide, lanthanum oxide, strontium oxide, yttrium oxide, hafnium oxide, tin oxide, antimony oxide, and combinations thereof;

and wherein the optical element comprises an optical glass having a refractive index of at least about 1.7.

2. The LED light source of claim 1, the amorphous silicate network derived from silicate, silane, silicic acid, polymeric forms of silicic acid, alkoxysilane, or combinations thereof.

3. The LED light source of claim 1, the surface-modified metal oxide nanoparticles comprising mixed metal oxide nanoparticles of at least two metal oxides selected from the group consisting of silicon oxide, aluminum oxide, zirconium oxide, titanium oxide, zinc oxide, tantalum oxide, niobium oxide, lanthanum oxide, strontium oxide, yttrium oxide, hafnium oxide, tin oxide, antimony oxide, and combinations thereof.

4. The LED light source of claim 3, the mixed metal oxide nanoparticles comprising silicon oxide and zirconium oxide.

5. The LED light source of claim 3, the mixed metal oxide nanoparticles comprising silicon oxide and titanium oxide.

6. The LED light source of claim 3, the mixed metal oxide nanoparticles comprising silicon oxide, zirconium oxide, and titanium oxide.

7. The LED light source of claim 1, the surface-modified metal oxide nanoparticles comprising crystalline zirconium oxide nanoparticles having a refractive index of greater than about 1.8.

8. The LED light source of claim 1, the surface-modified metal oxide nanoparticles comprising crystalline titanium oxide nanoparticles having a refractive index of greater than about 2.0.

9. The LED light source of claim 1, the surface-modified metal oxide nanoparticles being surface-modified with a surface-modifier, the surface-modifier comprising hydrophilic groups.

10. The LED light source of claim 1, the surface-modified metal oxide nanoparticles being surface-modified with a surface-modifier, the surface-modifier comprising a carboxylic acid, a phosphonic acid, an alkoxysilane, or a combination or mixture thereof.

11. The LED light source of claim 10, the alkoxysilane comprising a polyethyleneglycol alkoxysilane.

12. The LED light source of claim 1, the bonding layer comprising from about 40 to about 95% by weight of the surface-modified metal oxide nanoparticles.

13. The LED light source of claim 1, the LED die comprising a light emitting layer having a refractive index of greater than 1.9, and the bonding layer having a thickness of from about 50 nm to about 100 microns.

14. The LED light source of claim 1, the LED die comprising a light emitting layer having a refractive index of less than or equal to 1.9, and the bonding layer having a thickness of from greater than about 5 nm to about 300 nm.

15. The LED light source of claim 1, wherein the LED die comprises a light emitting surface, the optical element comprises a light input surface, and the bonding layer bonds the light emitting surface and the light input surface together.

16. The LED light source of claim 1, the optical element having a refractive index of at least about 2.0.

17. The LED light source of claim 1, the optical element comprising a diverging or converging extractor.

18. A method of making an LED light source, the method comprising:

a) providing an LED die;

b) providing an optical element;

c) providing a optical bonding composition comprising surface-modified metal oxide nanoparticles and a source of silicon in an aqueous solution having a pH greater than about 8, the source of silicon selected from the group consisting of silicate, silane, silicic acid, polymeric forms of silicic acid, alkoxysilane, and combinations thereof; and

d) bonding the LED die and the optical element together by contacting the LED die and the optical element with the optical bonding composition.

19. The method of claim 18, wherein contacting the LED die and the optical element with the optical bonding composition is carried out at room temperature.

20. The method of claim 18, wherein an assembly is formed from bonding the LED die and the optical element together, and the method further comprises heating the assembly.