LEDs with low optical loss electrode structures
First Claim
1. A light emitting diode chip, comprising:
- a semiconductor material capable of emitting light from a planar surface responsive to application of a potential across a first metallic wire bonding pad structure disposed on the planar surface and ohmicly coupled with an p-doped region of the semiconductor material, and a second metallic wire bonding pad structure ohmicly coupled with a n-doped region of the semiconductor material, andwherein at least the first metallic bonding pad structure is ohmicly coupled with the p-doped region of the semiconductor material by a current spreading layer disposed on the planar surface that contacts both the first metallic bonding pad structure and the p-doped region of the semiconductor material, and wherein the first metallic bonding pad structure is separated physically from the semiconductor material by a non-perforated layer of dielectric material disposed on the p-doped region of the semiconductor material.
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Accused Products
Abstract
Semiconductor devices in which one or more LEDs are formed include a dielectric region formed on a n/p region of the semiconductor, and that a metallic electrode can be formed on (at least partially on) the region of dielectric material. A transparent layer of a material such as Indium Tin Oxide can be used to make ohmic contact between the semiconductor and the metallic electrode, as the metallic electrode is separated from physical contact with the semiconductor by one or more of the dielectric material and the transparent ohmic contact layer (e.g., ITO layer). The dielectric material can enhance total internal reflection of light and reduce an amount of light that is absorbed by the metallic electrode.
59 Citations
14 Claims
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1. A light emitting diode chip, comprising:
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a semiconductor material capable of emitting light from a planar surface responsive to application of a potential across a first metallic wire bonding pad structure disposed on the planar surface and ohmicly coupled with an p-doped region of the semiconductor material, and a second metallic wire bonding pad structure ohmicly coupled with a n-doped region of the semiconductor material, and wherein at least the first metallic bonding pad structure is ohmicly coupled with the p-doped region of the semiconductor material by a current spreading layer disposed on the planar surface that contacts both the first metallic bonding pad structure and the p-doped region of the semiconductor material, and wherein the first metallic bonding pad structure is separated physically from the semiconductor material by a non-perforated layer of dielectric material disposed on the p-doped region of the semiconductor material. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A light emitting diode chip, comprising:
a semiconductor material in which is formed a diode junction, the diode junction capable of emitting light from a planar surface of the semiconductor material, responsive to application of a potential across a first metallic bond pad structure and a second metallic bond pad structure, wherein one or more of the first metallic bond pad structure and the second metallic bond pad structure is separated from the semiconductor material by an optically transmissive non-perforated region of insulating material having an index of refraction greater than or equal to one and less than that of the semiconductor material and is supported from the planar surface, and electrical continuity between one or more of the first metallic bond pad structure and the second metallic bond pad structure is provided by one or more optically transmissive conducting layers in ohmic contact with both the semiconductor material and respectively one or more of the first metallic bond pad structure and the second metallic bond pad structure. - View Dependent Claims (10, 11, 12, 13, 14)
Specification