Electronic inlay structure and method of manufacture thereof
First Claim
1. An electronic inlay structure comprising:
- first and second sheets of an inlay substrate arranged in generally side to side, spaced parallel arrangement, having a gap therebetween;
a flexible web material arranged to overlie said gap and edges of said first and second sheets of said inlay structure adjacent said gap;
third and fourth sheets arranged in registration with said first and second sheets respectively, over said first and second sheets of said inlay substrate and partially over said flexible web material and bonded thereto;
electronic circuitry associated with at least one of said first, second, third and fourth sheets; and
lamination enclosing said first, second, third and fourth sheets, said electronic circuitry and said web material together to create said inlay structure.
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Accused Products
Abstract
An electronic inlay structure including first and second sheets of an inlay substrate arranged in generally side to side, spaced parallel arrangement, having a gap therebetween, a flexible web material arranged to overlie the gap and edges of the first and second sheets of the inlay structure adjacent the gap, third and fourth sheets arranged in registration with the first and second sheets respectively, over the first and second sheets of the inlay substrate and partially over the flexible web material and bonded thereto, electronic circuitry associated with at least one of the first, second, third and fourth sheets and lamination enclosing the first, second, third and fourth sheets, the electronic circuitry and the web material together to create the inlay structure.
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Citations
10 Claims
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1. An electronic inlay structure comprising:
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first and second sheets of an inlay substrate arranged in generally side to side, spaced parallel arrangement, having a gap therebetween; a flexible web material arranged to overlie said gap and edges of said first and second sheets of said inlay structure adjacent said gap; third and fourth sheets arranged in registration with said first and second sheets respectively, over said first and second sheets of said inlay substrate and partially over said flexible web material and bonded thereto; electronic circuitry associated with at least one of said first, second, third and fourth sheets; and lamination enclosing said first, second, third and fourth sheets, said electronic circuitry and said web material together to create said inlay structure. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A method of manufacture of an electronic inlay structure, the method comprising:
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arranging first and second sheets of an inlay substrate in generally side to side, spaced parallel arrangement, having a gap therebetween; arranging a flexible web material to overlie said gap and edges of said first and second sheets of said inlay structure adjacent said gap; arranging third and fourth sheets of an inlay substrate in registration with said first and second sheets respectively, over said first and second sheets of said inlay substrate and partially over said flexible web material; bonding said first and third sheets together at locations where they overlie said flexible web material; bonding said second and fourth sheets together at locations where they overlie said flexible web material; associating electronic identification circuitry with at least one of said first, second, third and forth sheets; and laminating said first, second, third and fourth sheets, said electronic circuitry and said web material together to create said inlay structure. - View Dependent Claims (10)
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Specification