System in package high power highly efficient diode lamp

• US 8,029,158 B2
• Filed: 01/13/2011
• Issued: 10/04/2011
• Est. Priority Date: 03/28/2005
• Status: Expired due to Fees

• Current Assignee: NeoBulb Technologies Inc
• Original Assignee: NeoBulb Technologies Inc
• Inventors: Chen, Jen-Shyan
• Primary Examiner(s): TRAN, THUY V
• Application Number:
  US13/006,015
• Publication Number:
  US 20110110088A1
• Time in Patent Office: 264 Days
• Field of Search: 315/113, 315/312, 315/324, 362/85, 362/227, 362/235, 362/240, 362/294, 362/373, 362/249, 362/545, 362/547, 362/800, 362/249.01, 362/249.02
• US Class Current: 362/249.02
• CPC Class Codes: F21K 9/00 Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
• CPC Class Codes: F21V 29/507 of means for protecting lighting devices from damage, e.g. housings
• CPC Class Codes: F21V 29/51 using condensation or evaporation of a fluid, e.g. heat pipes
• CPC Class Codes: F21V 29/76 with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
• CPC Class Codes: F21V 29/767 the planes containing the fins or blades having directions perpendicular to the light emitting axis
• CPC Class Codes: F21V 29/773 the planes containing the fins or blades having the direction of the light emitting axis
• CPC Class Codes: F21V 29/83 the elements having apertures, ducts or channels, e.g. heat radiation holes
• CPC Class Codes: F21V 29/89 Metals
• CPC Class Codes: F21Y 2105/10 comprising a two-dimensional array of point-like light-generating elements
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: H01L 33/648 the elements comprising fluids, e.g. heat-pipes

Abstract

A system in package, high power, and highly efficient diode lamp is provided. The diode lamp includes a heat-conducting/heat-dissipating module, a LED light module, an optical module, and a control circuit module. The heat-conducting/heat-dissipating module includes a heat-conducting device and at least one heat-dissipating fin. The LED light module is disposed on a flat portion of the heat-conducting device. The optical module focuses the light emitted by the LED light module. The control circuit module is used to control the LED light module. When the diode lamp is electrically connected to a power supply, the control circuit module selectively controls the LED light module to emit the light. The heat generated during the operation of the LED light module is conducted from the flat portion of the heat-conducting device to the at least one heat-dissipating fin, and then it is dissipated by the at least one heat-dissipating fin.

Claims

1. A system-in-package, high power, and highly efficient diode lamp, comprising:

a heat pipe having a flat portion, wherein the flat portion has an inner surface and a capillary layer is positioned on the inner surface of the flat portion;

a heat-dissipating device mounted to the heat pipe;

a LED light module mounted above the flat portion of the heat pipe;

an optical module corresponding to the LED light module for modulating light emitted by the LED light module; and

wherein the heat generated during the operation of the LED light module is conducted from the flat portion of the heat pipe to the heat-dissipating device;

wherein the LED light module comprises a substrate above the flat portion of the heat pipe, at least one LED chip and one electrode on the substrate, and the LED chip is electrically connected to the electrode.

2. The diode lamp of claim 1, wherein the substrate is formed of a silicon material or a metal material.

3. The diode lamp of claim 1, wherein the heat pipe comprises a planished end and a cylindrical wall connected to the planished end, wherein the flat portion is positioned on the planished end and the capillary layer is extended on both an inner surface of the planished end and an inner surface of the cylindrical wall.

4. The diode lamp of claim 1, the heat pipe comprising a sealed end and a cylindrical wall connected to the seal end, wherein a portion of the cylindrical wall is planished such that the flat portion is positioned on the planished portion of the cylindrical wall, and the capillary layer is extended on the inner surface of the flat portion and an inner surface of the cylindrical wall.