System in package high power highly efficient diode lamp
First Claim
1. A system-in-package, high power, and highly efficient diode lamp, comprising:
- a heat pipe having a flat portion, wherein the flat portion has an inner surface and a capillary layer is positioned on the inner surface of the flat portion;
a heat-dissipating device mounted to the heat pipe;
a LED light module mounted above the flat portion of the heat pipe;
an optical module corresponding to the LED light module for modulating light emitted by the LED light module; and
wherein the heat generated during the operation of the LED light module is conducted from the flat portion of the heat pipe to the heat-dissipating device;
wherein the LED light module comprises a substrate above the flat portion of the heat pipe, at least one LED chip and one electrode on the substrate, and the LED chip is electrically connected to the electrode.
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Accused Products
Abstract
A system in package, high power, and highly efficient diode lamp is provided. The diode lamp includes a heat-conducting/heat-dissipating module, a LED light module, an optical module, and a control circuit module. The heat-conducting/heat-dissipating module includes a heat-conducting device and at least one heat-dissipating fin. The LED light module is disposed on a flat portion of the heat-conducting device. The optical module focuses the light emitted by the LED light module. The control circuit module is used to control the LED light module. When the diode lamp is electrically connected to a power supply, the control circuit module selectively controls the LED light module to emit the light. The heat generated during the operation of the LED light module is conducted from the flat portion of the heat-conducting device to the at least one heat-dissipating fin, and then it is dissipated by the at least one heat-dissipating fin.
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Citations
4 Claims
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1. A system-in-package, high power, and highly efficient diode lamp, comprising:
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a heat pipe having a flat portion, wherein the flat portion has an inner surface and a capillary layer is positioned on the inner surface of the flat portion; a heat-dissipating device mounted to the heat pipe; a LED light module mounted above the flat portion of the heat pipe; an optical module corresponding to the LED light module for modulating light emitted by the LED light module; and wherein the heat generated during the operation of the LED light module is conducted from the flat portion of the heat pipe to the heat-dissipating device;
wherein the LED light module comprises a substrate above the flat portion of the heat pipe, at least one LED chip and one electrode on the substrate, and the LED chip is electrically connected to the electrode. - View Dependent Claims (2, 3, 4)
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Specification