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System in package high power highly efficient diode lamp

  • US 8,029,158 B2
  • Filed: 01/13/2011
  • Issued: 10/04/2011
  • Est. Priority Date: 03/28/2005
  • Status: Expired due to Fees
First Claim
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1. A system-in-package, high power, and highly efficient diode lamp, comprising:

  • a heat pipe having a flat portion, wherein the flat portion has an inner surface and a capillary layer is positioned on the inner surface of the flat portion;

    a heat-dissipating device mounted to the heat pipe;

    a LED light module mounted above the flat portion of the heat pipe;

    an optical module corresponding to the LED light module for modulating light emitted by the LED light module; and

    wherein the heat generated during the operation of the LED light module is conducted from the flat portion of the heat pipe to the heat-dissipating device;

    wherein the LED light module comprises a substrate above the flat portion of the heat pipe, at least one LED chip and one electrode on the substrate, and the LED chip is electrically connected to the electrode.

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