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Methods of cutting or forming cavities in a substrate for use in making optical films, components or wave guides

  • US 8,029,708 B2
  • Filed: 06/19/2009
  • Issued: 10/04/2011
  • Est. Priority Date: 02/23/1999
  • Status: Expired due to Fees
First Claim
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1. A method of forming a pattern of optical elements on or in at least one side of an optical panel member, the method comprising:

  • cutting or forming a pattern or patterns of cavities in a cylindrical or curved substrate or in a sleeve or sleeve segment of the substrate using a cutting tool that is moved into and out of engagement with the substrate or sleeve or sleeve segment and has a tool axis that extends at an acute angle to the substrate or sleeve or sleeve segment while the cutting tool is moved in a non-parallel cross path direction to the substrate or sleeve or sleeve segment, the cutting tool comprising a cutting or forming tip that is nonsymmetrical about the tool axis, the cutting or forming tip having at least one cutting or forming edge that is parallel to the cutting tool cross path direction in order to cut or form the pattern or patterns of cavities in the substrate or sleeve or sleeve segment during the cutting or forming process, the pattern or patterns of cavities corresponding to a desired pattern and shape of optical elements to be formed on or in the optical panel member,using the substrate or sleeve or sleeve segment containing the desired pattern or patterns of optical element shaped cavities or depositions or mirror copies or inverse copies thereof in production tooling or as a master for production tooling, andusing the production tooling to form the corresponding pattern of optical elements on or in at least the one side of the optical panel member.

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