Method for fabricating MEMS device
First Claim
1. A method for fabricating microelectromechanical system (MEMS) device, comprising:
- providing a single crystal substrate, having a first surface and a second surface opposite to the first surface and having a MEMS region and an integrated-circuit (IC) region;
forming a plurality of SCS (single crystal structure) mass blocks on the first surface of the substrate in the MEMS region;
forming a structural dielectric layer over the first surface of the substrate, wherein the structural dielectric layer has a dielectric member and spaces surrounding the SCS mass blocks in the MEMS region are filled with the dielectric member, wherein the IC region has a circuit structure with an interconnection structure formed in the structural dielectric layer;
patterning the single crystal substrate by an etching process on the second surface to expose a portion of the dielectric member filled in the spaces surrounding the SCS mass blocks; and
performing an isotropic etching process at least on the dielectric member filled in the spaces surrounding the SCS mass blocks, wherein the SCS mass blocks are exposed to release a MEMS structure.
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Abstract
A method for fabricating MEMS device includes: providing a single crystal substrate, having first surface and second surface and having a MEMS region and an IC region; forming SCS mass blocks on the first surface in the MEMS region; forming a structural dielectric layer over the first surface of the substrate, wherein a dielectric member of the structural dielectric layer is filled in spaces surrounding the SCS mass blocks in the MEMS region, the IC region has a circuit structure with an interconnection structure formed in the structural dielectric layer; patterning the single crystal substrate by an etching process on the second surface to expose a portion of the dielectric member filled in the spaces surrounding the SCS mass blocks; performing isotropic etching process at least on the dielectric portion filled in the spaces surrounding the SCS mass blocks. The SCS mass blocks are exposed to release a MEMS structure.
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Citations
28 Claims
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1. A method for fabricating microelectromechanical system (MEMS) device, comprising:
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providing a single crystal substrate, having a first surface and a second surface opposite to the first surface and having a MEMS region and an integrated-circuit (IC) region; forming a plurality of SCS (single crystal structure) mass blocks on the first surface of the substrate in the MEMS region; forming a structural dielectric layer over the first surface of the substrate, wherein the structural dielectric layer has a dielectric member and spaces surrounding the SCS mass blocks in the MEMS region are filled with the dielectric member, wherein the IC region has a circuit structure with an interconnection structure formed in the structural dielectric layer; patterning the single crystal substrate by an etching process on the second surface to expose a portion of the dielectric member filled in the spaces surrounding the SCS mass blocks; and performing an isotropic etching process at least on the dielectric member filled in the spaces surrounding the SCS mass blocks, wherein the SCS mass blocks are exposed to release a MEMS structure. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28)
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Specification