Structure for mounting feedthrough capacitors

• US 8,031,480 B2
• Filed: 10/28/2008
• Issued: 10/04/2011
• Est. Priority Date: 12/07/2007
• Status: Active Grant

• Current Assignee: TDK Corporation
• Original Assignee: TDK Corporation
• Inventors: Togashi, Masaaki
• Primary Examiner(s): Semenenko; Yuriy
• Application Number:
  US12/259,777
• Publication Number:
  US 20090147489A1
• Time in Patent Office: 1,071 Days
• Field of Search: 361/760, 361/761, 361/763, 361/302, 361/303, 361/305, 361/328, 361/782
• US Class Current: 361/782
• CPC Class Codes: H01G 2/065 for surface mounting, e.g. chip capacitors
• CPC Class Codes: H01G 4/232 electrically connecting two or more layers of a stacked or rolled capacitor
• CPC Class Codes: H01G 4/35 Feed-through capacitors or anti-noise capacitors
• CPC Class Codes: H05K 1/0231 Capacitors or dielectric substances
• CPC Class Codes: H05K 2201/09309 Core having two or more power planes; Capacitive laminate of two power planes
• CPC Class Codes: H05K 2201/09481 Via in pad; Pad over filled via if used for surface mounting H05K1/113
• CPC Class Codes: H05K 2201/10636 Leadless chip, e.g. chip capacitor or resistor
• CPC Class Codes: H05K 2201/10969 Metallic case or integral heatsink of component electrically connected to a pad on PCB
• CPC Class Codes: Y02P 70/50 Manufacturing or production processes characterised by the final manufactured product

Abstract

In a structure for mounting a first feedthrough capacitor and a second feedthrough capacitor on a mounting surface of a substrate, the first and second feedthrough capacitors are disposed so as to be substantially parallel and to face each other in their partial regions, and a current in the partial region of the first feedthrough capacitor flows in a direction opposite to that in the partial region of the second feedthrough capacitor.

Claims

1. A structure for mounting a first feedthrough capacitor and a second feedthrough capacitor on a mounting surface of a substrate,

wherein the substrate is an insulating substrate including a first internal conductor and a second internal conductor insulated from each other, and includes first via holes extending from the mounting surface to the first internal conductor, second via holes extending from the mounting surface to the second internal conductor, a first land electrode formed on the mounting surface and connected to the first via hole, and a second land electrode formed on the mounting surface and connected to the second via hole insulated from the first land electrode,

the first and second via holes being alternatively aligned in a matrix, and in the row and column directions in the mounting surface,

the first and second feedthrough capacitors each including a element body, two first terminal electrodes disposed on two opposite first end faces in the longitudinal direction of the element body, and second terminal electrodes disposed on second end faces orthogonal to the longitudinal direction of the element body,

the first feedthrough capacitor being disposed between the two first via holes in a given row or column in the mounting surface,

one of the first terminal electrodes in the first feedthrough capacitor being disposed on one of the two first via holes, and connected to the first land electrode,

the other of the first terminal electrodes in the first feedthrough capacitor being disposed on the other of the two first via holes, and connected to the first land electrode,

the second terminal electrodes in the first feedthrough capacitor being connected to the second land electrode,

the second feedthrough capacitor being disposed between the two first via holes in a row or column parallel to the given row or column in the mounting surface so as to partially face the first feedthrough capacitor,

one of the first terminal electrodes in the second feedthrough capacitor being disposed on one of the two first via holes, and connected to the first land electrode,

the other of the first terminal electrodes in the second feedthrough capacitor being disposed on the other of the two first via holes, and connected to the first land electrode,

the second terminal electrodes in the second feedthrough capacitor being connected to the second land electrode.

2. The structure according to claim 1,

wherein a region between one of the first end faces and a region for forming the second terminal electrodes in the element body of the first feedthrough capacitor faces a region between one of the first end faces and a region for forming the second terminal electrodes in the element body of the second feedthrough capacitor,

a region between the other of the first end faces and a region for forming the second terminal electrodes in the element body of the first feedthrough capacitor not facing a region between the other of the first end faces and a region for forming the second terminal electrodes in the element body of the second feedthrough capacitor.

3. The structure according to claim 2,

wherein the second feedthrough capacitor is disposed between the two first via holes in a row or column adjacent to the given row or column.

4. The structure according to claim 1,

wherein the second feedthrough capacitor is disposed between the two first via holes in a row or column adjacent to the given row or column.