Minimum contact area wafer clamping with gas flow for rapid wafer cooling
First Claim
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1. A load lock for cooling wafers after processing, the load lock comprising:
- (a) an inlet transfer port for receiving the wafers after processing;
(b) an outlet transfer port for removing the wafers after cooling;
(c) a pedestal having a surface for absorbing heat from the wafers, said surface being structured to prevent a venting gas from passing through the pedestal while absorbing heat from the wafers;
(d) a venting non-process gas port for delivering a venting gas above the pedestal surface to increase pressure inside the load lock, the venting gas port shaped as a ring and comprising an opening facing a center of the ring, the opening configured to direct the venting non-process gas above and parallel to front surfaces of the wafers upon leaving the opening, wherein a diameter of the ring is smaller than a diameter of the wafers; and
(e) at least three supports provided on the pedestal surface, wherein said supports have heights which provide an average gap between one of the wafers and the pedestal surface of no greater than about 0.010 inches, when the one of the wafers is supported by the supports.
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Abstract
Apparatuses and methods for cooling and transferring wafers from low pressure environment to high pressure environment are provided. An apparatus may include a cooling pedestal and a set of supports for holding the wafer above the cooling pedestal. The average gap between the wafer and the cooling pedestal may be no greater than about 0.010 inches. Venting gases may be used to increase the pressure inside the apparatus during the transfer. In certain embodiment, venting gases comprise nitrogen.
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Citations
28 Claims
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1. A load lock for cooling wafers after processing, the load lock comprising:
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(a) an inlet transfer port for receiving the wafers after processing; (b) an outlet transfer port for removing the wafers after cooling; (c) a pedestal having a surface for absorbing heat from the wafers, said surface being structured to prevent a venting gas from passing through the pedestal while absorbing heat from the wafers; (d) a venting non-process gas port for delivering a venting gas above the pedestal surface to increase pressure inside the load lock, the venting gas port shaped as a ring and comprising an opening facing a center of the ring, the opening configured to direct the venting non-process gas above and parallel to front surfaces of the wafers upon leaving the opening, wherein a diameter of the ring is smaller than a diameter of the wafers; and (e) at least three supports provided on the pedestal surface, wherein said supports have heights which provide an average gap between one of the wafers and the pedestal surface of no greater than about 0.010 inches, when the one of the wafers is supported by the supports. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22)
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23. A method of cooling and transferring a wafer from a low pressure side to a high pressure side using a load lock, the method comprising:
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(a) providing the wafer into the load lock; (b) positioning the wafer on supports provided on a pedestal having a surface for absorbing heat from the wafers, said surface being structured to prevent a venting gas from passing through the pedestal while absorbing heat from the wafers; (c) closing an inlet transfer port; (d) increasing pressure inside the load lock by delivering a venting non-process gas through a venting gas port shaped as a ring and comprising an opening facing a center of the ring, wherein a diameter of the ring is smaller than a diameter of the wafer and wherein the venting non-process gas is delivered parallel above and parallel to a front side of the wafer and to keeps the wafer in contact with at least 70% of the supports by creating pressure differential at a center of the wafer such that pressure at the front side of the wafer is greater than pressure at a back side of the wafer forcing at least the center of the wafer towards the supports; and (e) opening an outlet transfer port and removing the wafer. - View Dependent Claims (24, 25, 26, 27, 28)
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Specification