Implants and methods for posterior dynamic stabilization of a spinal motion segment

• US 8,034,079 B2
• Filed: 04/12/2005
• Issued: 10/11/2011
• Est. Priority Date: 04/12/2005
• Status: Expired due to Fees

• Current Assignee: Warsaw Orthopedic Incorporated (Medtronic Plc)
• Original Assignee: Warsaw Orthopedic Incorporated (Medtronic Plc)
• Inventors: Bruneau, Aurelien, Lange, Eric C., Anderson, Kent M., Molz, Fred J. IV, Dewey, Jonathan, Morrison, Matthew M., Carls, Tommy
• Primary Examiner(s): Robert; Eduardo C
• Assistant Examiner(s): CARTER, TARA ROSE E
• Application Number:
  US11/104,350
• Publication Number:
  US 20060241614A1
• Time in Patent Office: 2,373 Days
• Field of Search: 623/16.11, 623 1711- 1716, 606/61, 606246-249
• US Class Current: 606/249
• CPC Class Codes: A61B 17/7062 Devices acting on, attached to, or simulating the effect of, vertebral processes, vertebral facets or ribs rib fixation devices A61B17/8076; Tools for such devices

Abstract

An implant assembly for stabilizing a spinal motion segment includes a spacer member positionable between adjacent spinous processes and upper and lower engaging members extending from the spacer member. The upper and lower engaging members engage at least one lamina to resist flexion of the spinal motion segment.

Claims

1. A method for stabilizing a spinal motion segment, comprising:

positioning a spacer member between adjacent upper and lower spinous processes of the spinal motion segment, the spacer member including an upper end contacting an inferior surface of the upper spinous process and a lower end contacting a superior surface of the lower spinous process;

positioning an upper engaging member extending from the upper end of the spacer member in contact with a superior surface of an upper lamina adjacent the upper spinous process; and

positioning a lower engaging member extending from the lower end of the spacer member in contact with an interiorly oriented surface adjacent the lower spinous process; and

resiliently stretching the upper engaging member before positioning the upper engaging member in contact with the superior surface of the upper lamina.

2. The method of claim 1, wherein the interiorly oriented surface extends along a lower lamina adjacent the lower spinous process, and positioning the lower engaging member includes contacting the inferior surface at the lower lamina with the lower engaging member.

3. The method of claim 2, wherein positioning the upper engaging member and the lower engaging member each includes positioning hooked end portions in contact with the respective lamina surfaces.

4. The method of claim 1, wherein the upper and lower engaging members are movably coupled with the spacer member along respective ones of the upper and lower spinous processes when the spacer member is positioned between the upper and lower spinous processes.