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Exposure apparatus and method for producing device

  • US 8,034,539 B2
  • Filed: 02/23/2007
  • Issued: 10/11/2011
  • Est. Priority Date: 12/10/2002
  • Status: Expired due to Fees
First Claim
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1. A pattern formation method comprising the steps of:

  • forming a resist film on a substrate;

    performing pattern exposure by selectively irradiating the resist film with exposing light via a projection optical system and an immersion liquid in a first chamber, a space between the projection optical system and the resist film is locally filled with the immersion liquid;

    transferring the substrate into a second chamber which has a cover member, the substrate being surrounded by the cover member;

    removing the immersion liquid remaining on a surface of the resist film in the second chamber after the pattern exposure; and

    forming a resist pattern by developing the resist film after removing the immersion liquid.

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