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Adjacent substantially flexible substrates having integrated circuits that are bonded together by non-polymeric layer

  • US 8,035,233 B2
  • Filed: 03/03/2003
  • Issued: 10/11/2011
  • Est. Priority Date: 04/04/1997
  • Status: Expired due to Fees
First Claim
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1. Circuitry comprising:

  • first, second and third substrates, each substrate having integrated circuits formed thereon and each substrate having a first substantially planar surface, the second substrate having a second substantially planar surface;

    first thermal diffusion bonds comprising a first metal bonding layer between a majority of the first surfaces of the first and second substrates; and

    second thermal diffusion bonds comprising a second metal bonding layer between a majority of the first surface of the third substrate and a majority of the second surface of the second substrate.

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