Apparatus and method for maintaining immersion fluid in the gap under the protection lens during wafer exchange in an immersion lithography machine

• US 8,035,795 B2
• Filed: 11/26/2007
• Issued: 10/11/2011
• Est. Priority Date: 04/11/2003
• Status: Expired due to Fees

• Current Assignee: Nikon Corporation
• Original Assignee: Nikon Corporation
• Inventors: Binnard, Michael
• Primary Examiner(s): Glick; Edward
• Assistant Examiner(s): KREUTZER, COLIN WRIGHT
• Application Number:
  US11/984,980
• Publication Number:
  US 20080074634A1
• Time in Patent Office: 1,415 Days
• Field of Search: 355/30, 355/53, 355/72, 355/77, 355/67, 430/311
• US Class Current: 355/30
• CPC Class Codes: G03B 27/52 Details
• CPC Class Codes: G03F 7/70341 Details of immersion lithography aspects, e.g. exposure media or control of immersion liquid supply chemical composition of immersion liquids G03F7/2041
• CPC Class Codes: G03F 7/70716 Stages
• CPC Class Codes: G03F 7/70725 control
• CPC Class Codes: G03F 7/70733 Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask

Abstract

An apparatus and method maintain immersion fluid in the gap adjacent to the projection lens during the exchange of a work piece in a lithography machine. The apparatus and method include an optical assembly that projects an image onto a work piece and a stage assembly including a work piece table that supports the work piece adjacent to the optical assembly. An environmental system is provided to supply and remove an immersion fluid from the gap between the optical assembly and the work piece on the stage assembly. After exposure of the work piece is complete, an exchange system removes the work piece and replaces it with a second work piece. An immersion fluid containment system maintains the immersion liquid in the gap during removal of the first work piece and replacement with the second work piece.

Claims

1. A liquid immersion exposure apparatus comprising:

an optical member through which a substrate is exposed through an immersion liquid;

a stage assembly including a substrate table that retains the substrate; and

a cover member having a surface which is covered with a fluorinated material,

wherein the cover member and the substrate table are relatively movable, and

wherein the cover member is positioned under the optical member in place of the substrate table to substantially maintain the immersion liquid in a space under the optical member when performing a substrate exchange operation of the substrate on the substrate table.

2. The apparatus according to claim 1, wherein during a transition from a first state in which the substrate table is under the optical member to a second state in which the cover member is under the optical member in place of the substrate table, the immersion liquid is maintained in the space under the optical member.

3. The apparatus according to claim 2, wherein in the transition, the cover member and the substrate table are moved together in a state in which the cover member and the substrate table are adjacent to each other.

4. The apparatus according to claim 3, wherein positional relation between the surface of the cover member and a surface of the substrate table is adjusted for the transition.

5. The apparatus according to claim 3, further comprising an alignment system disposed away from the optical member in a direction, wherein in the transition, the cover member and the substrate table are adjacent to each other in the direction.

6. The apparatus according to claim 5, wherein the cover member is positioned substantially at the opposite side of the alignment system with respect to the substrate table during the exposure of the substrate.

7. The apparatus according to claim 3, wherein the substrate table has no interferometer mirror at a side thereof, and the cover member is disposed adjacent to the side of the substrate table in the transition.

8. The apparatus according to claim 3, wherein the substrate table has an interferometer mirror at a side thereof and the cover member is disposed adjacent to the side of the substrate table, and wherein an interferometer beam is allowed to reach the interferometer mirror, when the cover member is positioned adjacent to the side of the substrate table.

9. The apparatus according to claim 2, further comprising a moving system which moves the cover member separately from the substrate table.

10. The apparatus according to claim 9, wherein the substrate table is movable away from under the optical member when the cover member is positioned under the optical member by the moving system.

11. The apparatus according to claim 2, wherein the cover member is moved by using the stage assembly.

12. The apparatus according to claim 11, wherein the cover member is provided on the stage assembly.

13. The apparatus according to claim 2, further comprising:

a first holding system that detachably holds the cover member; and

a second holding system that holds the cover member which is released from the first holding system, wherein the surface of the cover member held by the second holding system is opposite to the optical member.

14. The apparatus according to claim 1, wherein the surface of the cover member is coated with polytetrafluoroethylene.

15. The apparatus according to claim 1, wherein the stage assembly includes a further substrate table.

16. A liquid immersion exposure method in which a substrate is exposed to an exposure beam through an immersion liquid, the method comprising:

providing the substrate, retained on a substrate table, opposite to an optical member;

moving the substrate table away from under the optical member; and

performing a substrate exchange operation when a cover member is positioned under the optical member in place of the substrate table,

wherein the surface of the cover member is covered with a fluorinated material.

17. The method according to claim 16, wherein during a transition from a first state in which the substrate table is under the optical member to a second state in which the cover member is under the optical member in place of the substrate table, the immersion liquid is maintained in a space under the optical member.

18. The method according to claim 17, further comprising moving the cover member and the substrate table together in a state in which the cover member and the substrate table are adjacent to each other in the transition.

19. The method according to claim 18, wherein positional relation between the surface of the cover member and a surface of the substrate table is adjusted for the transition.

20. The method according to claim 17, wherein in the transition, the substrate table is moved by using a stage assembly and the cover member is moved by using a moving system.

21. The method according to claim 17, wherein the substrate table is movable away from under the optical member when the cover member is positioned under the optical member by the moving system.

22. The method according to claim 17, further comprising:

releasing the cover member from a first holding system; and

holding the cover member released from the first holding system by a second holding system so that the surface of the cover member is opposite to the optical member.

23. The method according to claim 16, wherein the surface of the cover member is coated with polytetrafluoroethylene.

24. A device manufacturing method comprising:

providing a substrate, retained on a substrate table, opposite to an optical member;

moving the substrate table away from under the optical member; and

performing a substrate exchange operation when a cover member is positioned under the optical member in place of the substrate table,

wherein a surface of the cover member is covered with a fluorinated material.

25. The method according to claim 24, wherein during a transition from a first state in which the substrate table is under the optical member to a second state in which the cover member is under the optical member in place of the substrate table, the immersion liquid is maintained in a space under the optical member.

26. The method according to claim 25, wherein the substrate includes a semiconductor wafer.

27. The method according to claim 24, wherein the surface of the cover member is coated with polytetrafluoroethylene.