Organic light-emitting display device and manufacturing method of the same
First Claim
1. A method of making an organic light emitting display (OLED), the method comprising:
- providing a device comprising;
a first substrate,a second substrate placed over the first substrate,an array of organic light-emitting pixels interposed between the first and second substrates,a frit interposed between the first and second substrates while surrounding the array, wherein the frit, the first substrate and the second substrate in combination define an enclosed space in which the array is located, andan uncured resin structure interposed between the first and second substrates and contacting the first and second substrates, wherein the uncured resin structure contacts or does not contact the frit seal;
curing the uncured resin structure so as to form a reinforcing structure bonding the first and second substrates; and
applying a laser or infrared beam to the frit so as to bond the frit to the first and second substrates.
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Abstract
A preparing method of an organic light-emitting display device, completely encapsulating a substrate and an encapsulation substrate with a frit and a supplement member is disclosed. It is an aspect of the present invention to provide an organic light-emitting display device comprising: a first substrate comprising a pixel region and a non-pixel region on the side thereof wherein an organic light-emitting element is formed in the pixel region and the non-pixel region is formed in the outer side of the pixel region; a second substrate bonded to one region including the pixel region of the first substrate; encapsulating member provided between the non-pixel region of the first substrate and the second substrate and adhering the first substrate to the second substrate; and supplement member configured of resin formed to be spaced from the frit.
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Citations
9 Claims
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1. A method of making an organic light emitting display (OLED), the method comprising:
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providing a device comprising; a first substrate, a second substrate placed over the first substrate, an array of organic light-emitting pixels interposed between the first and second substrates, a frit interposed between the first and second substrates while surrounding the array, wherein the frit, the first substrate and the second substrate in combination define an enclosed space in which the array is located, and an uncured resin structure interposed between the first and second substrates and contacting the first and second substrates, wherein the uncured resin structure contacts or does not contact the frit seal; curing the uncured resin structure so as to form a reinforcing structure bonding the first and second substrates; and applying a laser or infrared beam to the frit so as to bond the frit to the first and second substrates. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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Specification