Method and system for controlling radical distribution

• US 8,038,834 B2
• Filed: 04/06/2010
• Issued: 10/18/2011
• Est. Priority Date: 09/23/2005
• Status: Expired due to Fees

• Current Assignee: International Business Machines Corporation, Tokyo Electron Limited
• Original Assignee: International Business Machines Corporation, Tokyo Electron Limited
• Inventors: Chen, Lee, Horak, David V., Funk, Merritt, Strang, Eric J.
• Primary Examiner(s): Lund; Jeffrie R
• Application Number:
  US12/754,662
• Publication Number:
  US 20100193471A1
• Time in Patent Office: 560 Days
• Field of Search: 118/715, 156/345.29, 156/345.33, 156/345.34, 216/67, 427/569, 438/710, 438/771, 438/776, 134/1.1
• US Class Current: 156/345.29
• CPC Class Codes: C23C 16/4412 Details relating to the exhausts, e.g. pumps, filters, scrubbers, particle traps
• CPC Class Codes: C23C 16/45565 Shower nozzles
• CPC Class Codes: H01J 37/3244 Gas supply means
• CPC Class Codes: H01J 37/32449 Gas control, e.g. control of the gas flow
• CPC Class Codes: H01J 37/32834 Exhausting

Abstract

A plasma processing system includes a processing chamber, a substrate holder configured to hold a substrate for plasma processing, and a gas injection assembly. The gas injection assembly includes a first evacuation port located substantially in a center of the gas injection assembly and configured to evacuate gases from a central region of the substrate, and a gas injection system configured to inject gases in the process chamber. The plasma processing system also includes a second evacuation port configured to evacuate gases from a peripheral region surrounding the central region of the substrate.

Claims

1. A method of controlling the pressure in a plasma processing chamber, comprising:

evacuating chamber gases from a peripheral region of a processing region proximate to a substrate being processed in said plasma processing chamber;

evacuating chamber gases substantially from a center of said processing region through an evacuation port in a gas injection assembly located above said substrate, the evacuation port having a baffle plate with at least two openings and being limited to a central region of the gas injection assembly; and

controlling said evacuating the gases using at least one of a pump or a valve such that a first magnitude of a process parameter within said center of the processing region is adjusted relative to a second magnitude of the process parameter at the peripheral region of the processing region to provide more uniformity in the process parameter across the processing region.

2. The method of claim 1, further comprising:

injecting a gas into the center of the processing region through a substantially central portion of the gas injection assembly;

injecting a gas into the peripheral region of the processing region through a peripheral portion of the gas injection assembly; and

independently controlling injection of process gas into the central region and the peripheral region to facilitate said adjusting of the process parameter within said center of the processing region the process parameter at the peripheral region of the processing region.

3. The method of claim 2, wherein said independently controlling comprises independently controlling at least two gas injection zones arranged concentrically around the center of the gas injection assembly.

4. The method of claim 1, wherein said evacuating chamber gasses from a center of the processing region comprises evacuating the chamber gases only through a single evacuation port located substantially in the center of the gas injection assembly.

5. The method of claim 4, wherein the entrant region has a diameter between 1 cm and 15 cm.

6. The method of claim 1, wherein said evacuating chamber gasses from a center of the processing region comprises evacuating the chamber gases through multiple openings provided substantially in the center of the gas injection assembly.

7. The method of claim 6, further comprising providing said multiple openings in the center of the gas injection assembly by attaching a removable baffle plate substantially to a center of the gas injection assembly.

8. The method of claim 7, wherein the removable baffle plate is mounted on a lower surface of the gas injection assembly.

9. The method of claim 8 further comprising threading the removable baffle plate threaded to screw into a threaded recess in the gas injection assembly.

10. The method of claim 1, further comprising generating a plasma within said processing chamber, and impeding the plasma from passing through the evacuation port.

11. The method of claim 10, wherein said impeding comprises providing a plurality of openings coupled to said evacuation port, each and openings having a high aspect ratio sufficient to impede plasma from passing though the opening.

12. The method of claim 11, wherein an aspect ratio (ratio of length to diameter) of each of the openings in the gas injection assembly evacuation port located within the removable baffle plate ranges from 1 to 200.

13. The method of claim 1, further comprising using a turbomolecular pump to maintain vacuum pressure in the chamber at less than 50 mTorr.

14. The method of claim 1, wherein said evacuating further comprises evacuating through at least two openings arranged substantially concentrically around a center in the central region of the gas injection assembly.

15. The method of claim 1, wherein said evacuating from a peripheral region comprises evacuating through a sidewall port coupled to said processing chamber.