Printed circuit board and method thereof and a solder ball land and method thereof
First Claim
1. A printed circuit board (PCB), comprising:
- a first metal land having a first surface treatment portion configured for a first type of resistance; and
a second metal land having a second surface treatment portion configured for a second type of resistance, wherein a surface material of the first metal land is different from that of the second metal land, and the first type of resistance is higher heat conductivity which allows for greater heat dissipation and the second type of resistance is higher stress resistance.
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Accused Products
Abstract
A printed circuit board and method thereof and a solder ball land and method thereof. The example printed circuit board (PCB) may include a first solder ball land having a first surface treatment portion configured for a first type of resistance and a second solder ball land having a second surface treatment portion configured for a second type of resistance. The example solder ball land may include a first surface treatment portion configured for a first type of resistance and a second surface treatment portion configured for a second type of resistance. A first example method may include first treating a first surface of a first solder ball land to increase a first type of resistance and second treating a second surface of a second solder ball land to increase a second type of resistance other than the first type of resistance. A second example method may include first treating a solder ball land to increase a first type of resistance and second treating the solder ball land to increase a second type of resistance other than the first type of resistance.
16 Citations
32 Claims
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1. A printed circuit board (PCB), comprising:
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a first metal land having a first surface treatment portion configured for a first type of resistance; and a second metal land having a second surface treatment portion configured for a second type of resistance, wherein a surface material of the first metal land is different from that of the second metal land, and the first type of resistance is higher heat conductivity which allows for greater heat dissipation and the second type of resistance is higher stress resistance. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16)
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17. A metal land, comprising:
a first surface treatment portion configured for a first type of resistance and a second surface treatment portion configured for a second type of resistance, wherein the second surface treatment portion is applied by sequentially stacking a nickel layer and a gold layer. - View Dependent Claims (18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32)
Specification