Methods and systems for determining a position of inspection data in design data space

• US 8,041,103 B2
• Filed: 06/07/2007
• Issued: 10/18/2011
• Est. Priority Date: 11/18/2005
• Status: Active Grant

• Current Assignee: Kla-Tencor Technologies Corporation (KLA Corporation)
• Original Assignee: Kla-Tencor Technologies Corporation (KLA Corporation)
• Inventors: Shifrin, Eugene, Maayah, Kais, Rouse, Gordon, Kulkarni, Ashok, Duffy, Brian
• Primary Examiner(s): LE, BRIAN Q
• Application Number:
  US11/759,607
• Publication Number:
  US 20070230770A1
• Time in Patent Office: 1,594 Days
• Field of Search: 382/144, 382/145, 382/147, 438/16, 438/401, 438/462, 438/800, 716/2, 716/19, 716/20, 716/21, 356/237.4, 356/237.5, 356/394, 430/4, 430/5, 430/30, 700/96, 700/97, 700/105, 700/120, 700/121, 348/86, 348/87, 348/125, 348/126
• US Class Current: 382/144
• CPC Class Codes: G06F 30/30 Circuit design
• CPC Class Codes: G06T 2207/30148 Semiconductor; IC; Wafer
• CPC Class Codes: G06T 7/0006 using a design-rule based approach
• CPC Class Codes: G06T 7/33 using feature-based methods
• CPC Class Codes: H01L 21/67005 Apparatus not specifically provided for elsewhere processes per se H01L21/30, H01L21/46, H01L23/00; simple temporary support means, e.g. using adhesives, electric or magnetic means H01L21/68, H01L21/302

Abstract

Various methods and systems for determining a position of inspection data in design data space are provided. One computer-implemented method includes determining a centroid of an alignment target formed on a wafer using an image of the alignment target acquired by imaging the wafer. The method also includes aligning the centroid to a centroid of a geometrical shape describing the alignment target. In addition, the method includes assigning a design data space position of the centroid of the alignment target as a position of the centroid of the geometrical shape in the design data space. The method further includes determining a position of inspection data acquired for the wafer in the design data space based on the design data space position of the centroid of the alignment target.

Claims

1. A computer-implemented method for determining a position of inspection data in design data space, comprising:

using a computer system to performing the following steps;

determining a centroid of an alignment target formed on a wafer using an image of the alignment target acquired by imaging the wafer, wherein determining the centroid of the alignment target comprises determining a cross correlation between an edge profile for a first edge of the alignment target and a mirrored edge profile for a second edge of the alignment target opposite to the first edge, determining a peak of the cross correlation, and determining a mid-point between the first and second edges using a position of the peak and sizes of the edge profiles;

aligning the centroid to a centroid of a geometrical shape describing the alignment target;

assigning a design data space position of the centroid of the alignment target as a position of the centroid of the geometrical shape in the design data space; and

determining a position of inspection data acquired for the wafer in the design data space based on the design data space position of the centroid of the alignment target.

2. The method of claim 1, wherein the position of the inspection data is determined with sub-pixel accuracy.

3. The method of claim 1, wherein data for the geometrical shape comprises design data stored in a data structure.

4. The method of claim 1, wherein the alignment target is substantially symmetrical in two substantially perpendicular directions.

5. The method of claim 1, wherein the alignment target has edges that are substantially symmetrical.

6. The method of claim 1, wherein the alignment target has edges in two substantially perpendicular directions.

7. The method of claim 1, wherein the alignment target has edges in vertical and horizontal directions.

8. The method of claim 1, further comprising selecting the alignment target using the image by selecting a feature in the image that has substantially symmetrical edges and is unique within a predetermined search range.

11. The method of claim 1, wherein determining the centroid of the alignment target further comprises determining a sub-pixel position of the peak using interpolation, and wherein the position of the peak used to determine the mid-point between the first and second edges comprises the sub-pixel position of the peak.

12. The method of claim 1, wherein the image of the alignment target is acquired during inspection of the wafer.

13. The method of claim 1, wherein the image of the alignment target is acquired using an optical mode that will be used for inspection of the wafer.

14. The method of claim 1, wherein the image of the alignment target is acquired using an inspection system that will be used for inspection of the wafer.

15. The method of claim 1, further comprising locating the alignment target in the image during inspection of the wafer by performing template matching between a saved template for the alignment target and a search window in the image.

16. The method of claim 1, further comprising locating the alignment target in the image during inspection of the wafer with less than sub-pixel accuracy, wherein the position of the inspection data is determined with sub-pixel accuracy.

17. The method of claim 1, wherein the imaging comprises bright field imaging of the wafer.

18. The method of claim 1, further comprising determining a position of a defect detected on the wafer in the design data space based on the position of the inspection data in the design data space or the design data space position of the centroid of the alignment target.

9. A non-transitory computer-readable medium, comprising program instructions executed by a processor for performing a method for determining a position of inspection data in design data space, wherein the method comprises:

determining a centroid of an alignment target formed on a water using an image of the alignment target acquired by imaging the wafer, wherein determining the centroid of the alignment target comprises determining a cross correlation between an edge profile for a first edge of the alignment target and a mirrored edge profile for a second edge of the alignment target opposite to the first edge, determining a peak of the cross correlation, and determining a mid-point between the first and second edges using a position of the peak and sizes of the edge profiles;

aligning the centroid to a centroid of a geometrical shape describing the alignment target;

assigning a design data space position of the centroid of the alignment target as a position of the centroid of the geometrical shape in the design data space; and

determining a position of inspection data acquired for the wafer in the design data space based on the design data space position of the centroid of the alignment target.

10. A system configured to determine a position of inspection data in design data space, comprising:

an inspection system configured to acquire an image of an alignment target formed on a wafer and inspection data for the wafer; and

a processor coupled to the inspection system, wherein the processor is configured to;

determine a centroid of the alignment target using the image of the alignment target by determining a cross correlation between an edge profile for a first edge of the alignment target and a mirrored edge profile for a second edge of the alignment target opposite to the first edge, determining a peak of the cross correlation, and determining a mid-point between the first and second edges using a position of the peak and sizes of the edge profiles;

align the centroid to a centroid of a geometrical shape describing the alignment target;

assign a design data space position of the centroid of the alignment target as a position of the centroid of the geometrical shape in the design data space; and

determine a position of the inspection data in the design data space based on the design data space position of the centroid of the alignment target.