Determining die test protocols based on process health
First Claim
Patent Images
1. A method, comprising:
- receiving a first set of parameters associated with a subset of a plurality of die on a wafer;
determining a die health metric for at least a portion of the plurality of die based on the first set of parameters, the die health metric including at least one process component generated using parameters associated with the fabrication of the die and at least one non-yield performance component generated using parameters associated with an electrical performance characteristic of the die; and
performing electrical performance testing of at least one of the die after completion of the fabrication of the die, wherein a protocol of the testing is determined based on said die health metric to provide a first testing protocol for die having said die health metric greater than a predetermined threshold and a second testing protocol for die having said die health metric less than the predetermined threshold, wherein the first testing protocol has a reduced scope as compared to the second testing protocol.
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Abstract
A method includes receiving a first set of parameters associated with a subset of a plurality of die on a wafer. A die health metric is determined for at least a portion of the plurality of die based on the first set of parameters. The die health metric includes at least one process component associated with the fabrication of the die and at least one performance component associated with an electrical performance characteristic of the die. At least one of the die is tested. A protocol of the testing is determined based on the associated die health metric.
31 Citations
23 Claims
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1. A method, comprising:
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receiving a first set of parameters associated with a subset of a plurality of die on a wafer; determining a die health metric for at least a portion of the plurality of die based on the first set of parameters, the die health metric including at least one process component generated using parameters associated with the fabrication of the die and at least one non-yield performance component generated using parameters associated with an electrical performance characteristic of the die; and performing electrical performance testing of at least one of the die after completion of the fabrication of the die, wherein a protocol of the testing is determined based on said die health metric to provide a first testing protocol for die having said die health metric greater than a predetermined threshold and a second testing protocol for die having said die health metric less than the predetermined threshold, wherein the first testing protocol has a reduced scope as compared to the second testing protocol. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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13. A system, comprising:
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a plurality of metrology tools operable to measure a first set of parameters associated with a subset of a plurality of die on a wafer; a die health unit implemented by a computing device operable to determine a die health metric for at least a portion of the plurality of die based on the first set of parameters, the die health metric including at least one process component generated using parameters associated with the fabrication of the die and at least one non-yield performance component generated using parameters associated with an electrical performance characteristic of the die; and a test unit operable perform an electrical performance test on test at least one of the die after completion of the fabrication of the die, wherein a protocol of the testing is determined based on said die health metric to provide a first testing protocol for die having said die health metric greater than a predetermined threshold and a second testing protocol for die having said die health metric less than the predetermined threshold, wherein the first testing protocol has a reduced scope as compared to the second testing protocol. - View Dependent Claims (14, 15, 16, 17, 18, 19, 20, 21, 22)
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23. A system, comprising:
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means for receiving a first set of parameters associated with a subset of a plurality of die on a wafer; means for determining a die health metric for at least a portion of the plurality of die based on the first set of parameters, the die health metric including at least one process component generated using parameters associated with the fabrication of the die and at least one non-yield performance component generated using parameters associated with an electrical performance characteristic of the die; and means for performing electrical performance testing of at least one of the die after completion of the fabrication of the die, wherein a protocol of the testing is determined based on said die health metric to provide a first testing protocol for die having said die health metric greater than a predetermined threshold and a second testing protocol for die having said die health metric less than the predetermined threshold, wherein the first testing protocol has a reduced scope as compared to the second testing protocol.
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Specification