Method and apparatus for cleaning a substrate using non-Newtonian fluids

• US 8,043,441 B2
• Filed: 06/15/2005
• Issued: 10/25/2011
• Est. Priority Date: 06/15/2005
• Status: Expired due to Fees

• Current Assignee: Lam Research Corporation
• Original Assignee: Lam Research Corporation
• Inventors: Farber, Jeffrey, Korolik, Mikhail, Ravkin, Mike, de Larios, John M., Redeker, Fred C.
• Primary Examiner(s): Kornakov; Michael
• Assistant Examiner(s): GOLIGHTLY, ERIC WAYNE
• Application Number:
  US11/153,957
• Publication Number:
  US 20060283486A1
• Time in Patent Office: 2,323 Days
• Field of Search: 134/34, 134/902
• US Class Current: 134/34
• CPC Class Codes: B08B 3/003 Cleaning involving contact with foam
• CPC Class Codes: B08B 7/0014 by incorporation in a layer which is removed with the contaminants
• CPC Class Codes: C11D 2111/22 Electronic devices, e.g. PCBs or semiconductors
• CPC Class Codes: C11D 7/5004 Organic solvents
• CPC Class Codes: H01L 21/02057 Cleaning during device manufacture
• CPC Class Codes: H01L 21/67051 using mainly spraying means, e.g. nozzles
• CPC Class Codes: H01L 21/67057 with the semiconductor substrates being dipped in baths or vessels
• CPC Class Codes: Y10S 134/902 Semiconductor wafer

Abstract

A method for cleaning a substrate is provided. In this method, a flow of non-Newtonian fluid is provided where at least a portion of the flow exhibits plug flow. To remove particles from a surface of the substrate, the surface of the substrate is placed in contact with the portion of the flow that exhibits plug flow such that the portion of the flow exhibiting plug flow moves over the surface of the substrate. Additional methods and apparatuses for cleaning a substrate also are described.

Claims

1. A method for cleaning a substrate, comprising:

filling a chamber with a non-Newtonian fluid, the chamber having an input end and an output end;

introducing the substrate into the chamber at the input end and suspending the substrate suspended in the non-Newtonian fluid;

closing access to the input end;

forcing additional non-Newtonian fluids through the chamber such that a flow of the non-Newtonian fluid moves the substrate toward the output end; and

activating a pin to block the substrate from moving through the output end while forcing the additional non-Newtonian fluid, the pin contacting an edge of the substrate, wherein the non-Newtonian fluid flows over surfaces of the substrate and the non-Newtonian fluid exits at the output end.

2. The method of claim 1, further comprising:

preventing the substrate from moving within the chamber while enabling the non-Newtonian fluid to flow through the chamber.

3. The method of claim 1, wherein the input end and the output end oppose each other.

4. The method of claim 3, further comprising:

releasing the pin to enable the substrate to exit out of the output end.

5. The method of claim 1, wherein the non-Newtonian fluid is defined as one or more of a foam, a colloid, and an emulsion.

6. The method of claim 1, wherein closing access to the input end includes,

closing a panel to close the access to the input end;

and

continuing to fill the chamber through opposing input ports.

7. The method of claim 1, wherein the filling includes:

inputting the non-newtonian fluid through opposing top and bottom input ports.